IL82535A - Thermally insulative and electrically conductive interconnect and process for making same - Google Patents

Thermally insulative and electrically conductive interconnect and process for making same

Info

Publication number
IL82535A
IL82535A IL82535A IL8253587A IL82535A IL 82535 A IL82535 A IL 82535A IL 82535 A IL82535 A IL 82535A IL 8253587 A IL8253587 A IL 8253587A IL 82535 A IL82535 A IL 82535A
Authority
IL
Israel
Prior art keywords
electrically conductive
making same
conductive interconnect
thermally insulative
insulative
Prior art date
Application number
IL82535A
Other languages
English (en)
Other versions
IL82535A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL82535A0 publication Critical patent/IL82535A0/xx
Publication of IL82535A publication Critical patent/IL82535A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/381—Pitch distance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
IL82535A 1986-09-02 1987-05-14 Thermally insulative and electrically conductive interconnect and process for making same IL82535A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/902,733 US4740700A (en) 1986-09-02 1986-09-02 Thermally insulative and electrically conductive interconnect and process for making same

Publications (2)

Publication Number Publication Date
IL82535A0 IL82535A0 (en) 1987-11-30
IL82535A true IL82535A (en) 1991-08-16

Family

ID=25416327

Family Applications (1)

Application Number Title Priority Date Filing Date
IL82535A IL82535A (en) 1986-09-02 1987-05-14 Thermally insulative and electrically conductive interconnect and process for making same

Country Status (6)

Country Link
US (1) US4740700A (fr)
EP (1) EP0279814B1 (fr)
JP (1) JP2565524B2 (fr)
DE (1) DE3785448T2 (fr)
IL (1) IL82535A (fr)
WO (1) WO1988001793A1 (fr)

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US5186379A (en) * 1991-06-17 1993-02-16 Hughes Aircraft Company Indium alloy cold weld bumps
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US5653892A (en) * 1994-04-04 1997-08-05 Texas Instruments Incorporated Etching of ceramic materials with an elevated thin film
US5679267A (en) * 1994-04-04 1997-10-21 Texas Instruments Incorporated Dual etching of ceramic materials with an elevated thin film
US5478242A (en) * 1994-04-29 1995-12-26 Texas Instruments Incorporated Thermal isolation of hybrid thermal detectors through an anisotropic etch
US5424544A (en) * 1994-04-29 1995-06-13 Texas Instruments Incorporated Inter-pixel thermal isolation for hybrid thermal detectors
US5457318A (en) * 1994-04-29 1995-10-10 Texas Instruments Incorporated Thermal detector apparatus and method using reduced thermal capacity
US5426303A (en) * 1994-04-29 1995-06-20 Texas Instruments Incorporated Thermal isolation structure for hybrid thermal detectors
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US5574282A (en) * 1994-06-30 1996-11-12 Texas Instruments Incorporated Thermal isolation for hybrid thermal detectors
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US5559332A (en) * 1994-11-04 1996-09-24 Texas Instruments Incorporated Thermal detector and method
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US5607600A (en) * 1995-01-31 1997-03-04 Texas Instruments Incorporated Optical coat reticulation post hybridization
US5602392A (en) * 1995-01-31 1997-02-11 Texas Instruments Thermal crosstalk reduction for infrared detectors with common electrodes
US5646066A (en) * 1995-03-01 1997-07-08 Texas Instruments Incorporated Method for forming electrical contact to the optical coating of an infrared detector from the backside of the detector
US5552326A (en) * 1995-03-01 1996-09-03 Texas Instruments Incorporated Method for forming electrical contact to the optical coating of an infrared detector using conductive epoxy
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US5578527A (en) * 1995-06-23 1996-11-26 Industrial Technology Research Institute Connection construction and method of manufacturing the same
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US6080987A (en) * 1997-10-28 2000-06-27 Raytheon Company Infrared-sensitive conductive-polymer coating
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US6130148A (en) * 1997-12-12 2000-10-10 Farnworth; Warren M. Interconnect for semiconductor components and method of fabrication
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DE10016132A1 (de) * 2000-03-31 2001-10-18 Infineon Technologies Ag Elektronisches Bauelement mit flexiblen Kontaktierungsstellen und Verfahren zu dessen Herstellung
DE10063914A1 (de) * 2000-12-20 2002-07-25 Pac Tech Gmbh Kontakthöckeraufbau zur Herstellung eines Verbindungsaufbaus zwischen Substratanschlussflächen
DE10116069C2 (de) * 2001-04-02 2003-02-20 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zu seiner Herstellung
US7132736B2 (en) * 2001-10-31 2006-11-07 Georgia Tech Research Corporation Devices having compliant wafer-level packages with pillars and methods of fabrication
DE10238582B4 (de) * 2002-08-22 2006-01-19 Infineon Technologies Ag Verfahren zur Herstellung eines Verbundes aus einer getesteten integrierten Schaltung und einer elektrischen Einrichtung
US7335979B2 (en) * 2004-06-28 2008-02-26 Intel Corporation Device and method for tilted land grid array interconnects on a coreless substrate package
JP4583939B2 (ja) * 2005-01-14 2010-11-17 日東電工株式会社 配線回路基板の製造方法
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US7813730B2 (en) * 2006-10-17 2010-10-12 Mavenir Systems, Inc. Providing mobile core services independent of a mobile device
US8178965B2 (en) * 2007-03-14 2012-05-15 Infineon Technologies Ag Semiconductor module having deflecting conductive layer over a spacer structure
DE102007046451B4 (de) * 2007-09-28 2011-08-25 Pyreos Ltd. Vorrichtung zur Detektion von Wärmestrahlung mit hoher Auflösung, Verfahren zum Herstellen und Verwendung der Vorrichtung
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US9348377B2 (en) * 2014-03-14 2016-05-24 Sandisk Enterprise Ip Llc Thermal isolation techniques
RU2662631C2 (ru) * 2014-05-05 2018-07-26 Дзе Проктер Энд Гэмбл Компани Гетерогенный материал, содержащий пеноматериал
US10729600B2 (en) 2015-06-30 2020-08-04 The Procter & Gamble Company Absorbent structure
CN108348387B (zh) 2015-11-04 2021-05-28 宝洁公司 吸收结构
BR112018009094A2 (pt) 2015-11-04 2018-11-06 Procter & Gamble estrutura absorvente
JP6766144B2 (ja) 2015-11-04 2020-10-07 ザ プロクター アンド ギャンブル カンパニーＴｈｅ Ｐｒｏｃｔｅｒ ＆ Ｇａｍｂｌｅ Ｃｏｍｐａｎｙ 吸収性構造体
CN108156746A (zh) * 2016-12-06 2018-06-12 华邦电子股份有限公司 多层电路板及其制造方法

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US4740700A (en) 1986-09-02 1988-04-26 Hughes Aircraft Company Thermally insulative and electrically conductive interconnect and process for making same

Also Published As

Publication number Publication date
IL82535A0 (en) 1987-11-30
US4740700A (en) 1988-04-26
DE3785448D1 (de) 1993-05-19
WO1988001793A1 (fr) 1988-03-10
EP0279814B1 (fr) 1993-04-14
EP0279814A1 (fr) 1988-08-31
DE3785448T2 (de) 1993-07-29
JP2565524B2 (ja) 1996-12-18
JPH01500706A (ja) 1989-03-09

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Legal Events

Date Code Title Description
KB Patent renewed
HC Change of name of proprietor(s)
KB Patent renewed
EXP Patent expired