GB8715486D0 - Forming electrical contacts - Google Patents
Forming electrical contactsInfo
- Publication number
- GB8715486D0 GB8715486D0 GB8715486A GB8715486A GB8715486D0 GB 8715486 D0 GB8715486 D0 GB 8715486D0 GB 8715486 A GB8715486 A GB 8715486A GB 8715486 A GB8715486 A GB 8715486A GB 8715486 D0 GB8715486 D0 GB 8715486D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrical contacts
- forming electrical
- forming
- contacts
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76804—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics by forming tapered via holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8715486A GB2206729B (en) | 1987-07-01 | 1987-07-01 | A method of forming electrical contacts in a multi-level interconnect system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8715486A GB2206729B (en) | 1987-07-01 | 1987-07-01 | A method of forming electrical contacts in a multi-level interconnect system |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8715486D0 true GB8715486D0 (en) | 1987-08-05 |
GB2206729A GB2206729A (en) | 1989-01-11 |
GB2206729B GB2206729B (en) | 1990-10-24 |
Family
ID=10619909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8715486A Expired - Lifetime GB2206729B (en) | 1987-07-01 | 1987-07-01 | A method of forming electrical contacts in a multi-level interconnect system |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2206729B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR910013463A (en) * | 1989-12-29 | 1991-08-08 | 김광호 | Opening Method of Semiconductor Device |
KR920015542A (en) * | 1991-01-14 | 1992-08-27 | 김광호 | Multi-layered wiring formation method of semiconductor device |
US5847460A (en) * | 1995-12-19 | 1998-12-08 | Stmicroelectronics, Inc. | Submicron contacts and vias in an integrated circuit |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3648131A (en) * | 1969-11-07 | 1972-03-07 | Ibm | Hourglass-shaped conductive connection through semiconductor structures |
GB2150749B (en) * | 1983-12-03 | 1987-09-23 | Standard Telephones Cables Ltd | Integrated circuits |
GB2156593B (en) * | 1984-03-28 | 1987-06-17 | Plessey Co Plc | Through hole interconnections |
US4630357A (en) * | 1985-08-02 | 1986-12-23 | Ncr Corporation | Method for forming improved contacts between interconnect layers of an integrated circuit |
-
1987
- 1987-07-01 GB GB8715486A patent/GB2206729B/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB2206729B (en) | 1990-10-24 |
GB2206729A (en) | 1989-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19930701 |