IL289684B2 - Integrated structures with antenna components and IC chips using edge contact connections - Google Patents

Integrated structures with antenna components and IC chips using edge contact connections

Info

Publication number
IL289684B2
IL289684B2 IL289684A IL28968422A IL289684B2 IL 289684 B2 IL289684 B2 IL 289684B2 IL 289684 A IL289684 A IL 289684A IL 28968422 A IL28968422 A IL 28968422A IL 289684 B2 IL289684 B2 IL 289684B2
Authority
IL
Israel
Prior art keywords
chip
cavity
substrate
antenna
sidewall
Prior art date
Application number
IL289684A
Other languages
English (en)
Hebrew (he)
Other versions
IL289684B1 (en
IL289684A (en
Inventor
Steven J Franson
Douglas J Mathews
Original Assignee
Viasat Inc
Steven J Franson
Douglas J Mathews
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viasat Inc, Steven J Franson, Douglas J Mathews filed Critical Viasat Inc
Publication of IL289684A publication Critical patent/IL289684A/en
Publication of IL289684B1 publication Critical patent/IL289684B1/en
Publication of IL289684B2 publication Critical patent/IL289684B2/en

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Classifications

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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
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    • H01L2224/81205—Ultrasonic bonding
    • H01L2224/81207—Thermosonic bonding
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81385—Shape, e.g. interlocking features
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
    • H01L2224/81898—Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81905—Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904
    • H01L2224/81906—Specific sequence of method steps
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81905—Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904
    • H01L2224/81907—Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00012—Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
  • Waveguide Aerials (AREA)
  • Semiconductor Integrated Circuits (AREA)
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Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
US11088098B2 (en) 2019-08-12 2021-08-10 Viasat, Inc. Integrated structures with antenna elements and IC chips employing edge contact connections
US11503704B2 (en) * 2019-12-30 2022-11-15 General Electric Company Systems and methods for hybrid glass and organic packaging for radio frequency electronics
US20210315099A1 (en) * 2020-04-03 2021-10-07 The Boeing Company Method of forming a flexible electronics assembly
US11336032B2 (en) * 2020-05-15 2022-05-17 Raytheon Company Reactive array
EP3930204A1 (en) * 2020-06-27 2021-12-29 Pharrowtech BV A structure for distributing radio frequency signals
CN115917731A (zh) * 2020-09-30 2023-04-04 株式会社村田制作所 高频模块以及通信装置
WO2022103402A1 (en) * 2020-11-13 2022-05-19 Viasat, Inc. Integrated antenna array with beamformer ic chips having multiple surface interfaces
US20230044903A1 (en) * 2021-08-04 2023-02-09 Nxp Usa, Inc. Semiconductor device with rf interposer and method therefor

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483352B2 (ja) * 1994-10-13 2004-01-06 三菱樹脂株式会社 非接触ｉｃカード
JPH11328355A (ja) * 1998-05-20 1999-11-30 Dainippon Printing Co Ltd Ｉｃカード用ｉｃモジュール
JP4043601B2 (ja) * 1998-06-04 2008-02-06 大日本印刷株式会社 非接触型ｉｃカードとその製造方法、非接触型ｉｃカード用基体
US7030466B1 (en) 1999-05-03 2006-04-18 United Microelectronics Corporation Intermediate structure for making integrated circuit device and wafer
US7612443B1 (en) 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
EP1880417A2 (fr) 2005-05-11 2008-01-23 STMicroelectronics SA Microplaquette de silicium ayant des plages de contact inclinees et module electronique comprenant une telle microplaquette
JP2009031956A (ja) * 2007-07-26 2009-02-12 Dainippon Printing Co Ltd 接触・非接触共用型ｉｃカードと接触・非接触共用型ｉｃカードの製造方法
US8269671B2 (en) * 2009-01-27 2012-09-18 International Business Machines Corporation Simple radio frequency integrated circuit (RFIC) packages with integrated antennas
US9153863B2 (en) 2012-01-24 2015-10-06 E I Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications
US9711465B2 (en) * 2012-05-29 2017-07-18 Taiwan Semiconductor Manufacturing Co., Ltd. Antenna cavity structure for integrated patch antenna in integrated fan-out packaging
TWI518991B (zh) * 2013-02-08 2016-01-21 Sj Antenna Design Integrated antenna and integrated circuit components of the shielding module
US9488719B2 (en) * 2014-05-30 2016-11-08 Toyota Motor Engineering & Manufacturing North America, Inc. Automotive radar sub-system packaging for robustness
KR102380304B1 (ko) * 2015-01-23 2022-03-30 삼성전기주식회사 전자부품 내장 기판 및 그 제조방법
US10636753B2 (en) * 2015-07-29 2020-04-28 STATS ChipPAC Pte. Ltd. Antenna in embedded wafer-level ball-grid array package
US10182498B2 (en) 2015-10-28 2019-01-15 Indiana Integrated Circuits, LLC Substrates with interdigitated hinged edge interconnects
US10896898B2 (en) 2015-10-28 2021-01-19 Indiana Integrated Circuits, LLC Edge interconnect self-assembly substrate
EP3394929B1 (en) * 2015-12-22 2023-03-29 Intel Corporation Microelectronic devices designed with integrated antennas on a substrate
US10756033B2 (en) * 2016-06-03 2020-08-25 Intel IP Corporation Wireless module with antenna package and cap package
CN107864688B (zh) 2016-07-22 2019-12-31 京瓷株式会社 Rfid标签用基板、rfid标签以及rfid系统
US10511080B2 (en) * 2017-08-18 2019-12-17 Samsung Electro-Mechanics Co., Ltd. Fan-out semiconductor package
US10872868B2 (en) * 2017-10-25 2020-12-22 Sj Semiconductor (Jiangyin) Corporation Fan-out antenna packaging structure and preparation method thereof
US11211343B2 (en) * 2018-10-26 2021-12-28 Sj Semiconductor (Jiangyin) Corporation Fan-out antenna packaging structure and packaging method
DE102018220712B4 (de) * 2018-11-30 2024-06-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wafer-level packaging-basiertes modul sowie verfahren zur herstellung desselben
US11088098B2 (en) * 2019-08-12 2021-08-10 Viasat, Inc. Integrated structures with antenna elements and IC chips employing edge contact connections

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