IL203461A - Polishing pad - Google Patents
Polishing padInfo
- Publication number
- IL203461A IL203461A IL203461A IL20346110A IL203461A IL 203461 A IL203461 A IL 203461A IL 203461 A IL203461 A IL 203461A IL 20346110 A IL20346110 A IL 20346110A IL 203461 A IL203461 A IL 203461A
- Authority
- IL
- Israel
- Prior art keywords
- polishing pad
- polishing
- grooves
- barrier region
- pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US95629307P | 2007-08-16 | 2007-08-16 | |
PCT/US2008/009687 WO2009025748A1 (en) | 2007-08-16 | 2008-08-13 | Polishing pad |
Publications (1)
Publication Number | Publication Date |
---|---|
IL203461A true IL203461A (en) | 2014-11-30 |
Family
ID=40378437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL203461A IL203461A (en) | 2007-08-16 | 2010-01-24 | Polishing pad |
Country Status (10)
Country | Link |
---|---|
US (1) | US20110183579A1 (zh) |
EP (1) | EP2193010B1 (zh) |
JP (1) | JP5307815B2 (zh) |
KR (1) | KR101203789B1 (zh) |
CN (1) | CN101778701B (zh) |
IL (1) | IL203461A (zh) |
MY (1) | MY154071A (zh) |
SG (1) | SG183738A1 (zh) |
TW (1) | TWI411495B (zh) |
WO (1) | WO2009025748A1 (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8047899B2 (en) * | 2007-07-26 | 2011-11-01 | Macronix International Co., Ltd. | Pad and method for chemical mechanical polishing |
US8662957B2 (en) * | 2009-06-30 | 2014-03-04 | Applied Materials, Inc. | Leak proof pad for CMP endpoint detection |
JP5426469B2 (ja) * | 2010-05-10 | 2014-02-26 | 東洋ゴム工業株式会社 | 研磨パッドおよびガラス基板の製造方法 |
US8657653B2 (en) | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
US8628384B2 (en) * | 2010-09-30 | 2014-01-14 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
CN102501187A (zh) * | 2011-11-04 | 2012-06-20 | 厦门大学 | 区域压力调整抛光盘 |
US9067299B2 (en) | 2012-04-25 | 2015-06-30 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
JP2014104521A (ja) * | 2012-11-26 | 2014-06-09 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
US9649742B2 (en) * | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
CN104044087B (zh) * | 2014-06-18 | 2016-09-07 | 蓝思科技股份有限公司 | 一种蓝宝石抛光用铜盘及其修盘方法 |
CN106607749B (zh) * | 2015-10-22 | 2019-01-22 | 中芯国际集成电路制造(上海)有限公司 | 一种阻挡型化学机械研磨垫及研磨装置 |
KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
TWI595968B (zh) * | 2016-08-11 | 2017-08-21 | 宋建宏 | 研磨墊及其製造方法 |
TWI650202B (zh) * | 2017-08-22 | 2019-02-11 | 智勝科技股份有限公司 | 研磨墊、研磨墊的製造方法及研磨方法 |
US11685013B2 (en) * | 2018-01-24 | 2023-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad for chemical mechanical planarization |
WO2020109947A1 (en) * | 2018-11-27 | 2020-06-04 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
WO2022202008A1 (ja) * | 2021-03-26 | 2022-09-29 | 富士紡ホールディングス株式会社 | 研磨パッド |
CN113246015B (zh) * | 2021-05-25 | 2022-09-20 | 万华化学集团电子材料有限公司 | 具有终点检测窗的抛光垫及其应用 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
JP2002001652A (ja) * | 2000-06-22 | 2002-01-08 | Nikon Corp | 研磨パッド及び研磨装置及び素子製造方法 |
KR100858392B1 (ko) * | 2001-04-25 | 2008-09-11 | 제이에스알 가부시끼가이샤 | 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법 |
WO2004028744A1 (en) * | 2002-09-25 | 2004-04-08 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US7442116B2 (en) * | 2003-11-04 | 2008-10-28 | Jsr Corporation | Chemical mechanical polishing pad |
JP4877448B2 (ja) * | 2003-11-04 | 2012-02-15 | Jsr株式会社 | 化学機械研磨パッド |
US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
US7182670B2 (en) * | 2004-09-22 | 2007-02-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a streamlined windowpane |
KR20060051345A (ko) * | 2004-09-22 | 2006-05-19 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 유선형의 투시창을 구비한 씨엠피 패드 |
JP4620501B2 (ja) * | 2005-03-04 | 2011-01-26 | ニッタ・ハース株式会社 | 研磨パッド |
KR20070018711A (ko) * | 2005-08-10 | 2007-02-14 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 표면 요철이 감소된 창을 구비한 연마 패드 |
JP2007118106A (ja) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
-
2008
- 2008-07-22 TW TW097127831A patent/TWI411495B/zh active
- 2008-08-13 WO PCT/US2008/009687 patent/WO2009025748A1/en active Application Filing
- 2008-08-13 US US12/673,057 patent/US20110183579A1/en not_active Abandoned
- 2008-08-13 MY MYPI2010000193A patent/MY154071A/en unknown
- 2008-08-13 JP JP2010521026A patent/JP5307815B2/ja active Active
- 2008-08-13 CN CN2008801027610A patent/CN101778701B/zh active Active
- 2008-08-13 SG SG2012060802A patent/SG183738A1/en unknown
- 2008-08-13 KR KR1020107005681A patent/KR101203789B1/ko active IP Right Grant
- 2008-08-13 EP EP08795288.3A patent/EP2193010B1/en active Active
-
2010
- 2010-01-24 IL IL203461A patent/IL203461A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN101778701A (zh) | 2010-07-14 |
JP5307815B2 (ja) | 2013-10-02 |
CN101778701B (zh) | 2012-06-27 |
MY154071A (en) | 2015-04-30 |
SG183738A1 (en) | 2012-09-27 |
JP2010536583A (ja) | 2010-12-02 |
EP2193010A1 (en) | 2010-06-09 |
US20110183579A1 (en) | 2011-07-28 |
TWI411495B (zh) | 2013-10-11 |
KR101203789B1 (ko) | 2012-11-21 |
EP2193010B1 (en) | 2020-01-08 |
TW200922748A (en) | 2009-06-01 |
KR20100068255A (ko) | 2010-06-22 |
EP2193010A4 (en) | 2013-10-16 |
WO2009025748A1 (en) | 2009-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL203461A (en) | Polishing pad | |
JP2010536583A5 (zh) | ||
WO2011129959A3 (en) | Molding windows in thin pads | |
WO2011005996A3 (en) | Cutting element for a drill bit used in drilling subterranean formations | |
WO2010065334A3 (en) | Semiconductor devices with current shifting regions and related methods | |
ATE464976T1 (de) | Polierkissen mit ausgespartem fenster | |
TW200620705A (en) | Semiconductor light emitting device | |
EP2428318A3 (en) | Method of polishing an object to form a convex or concave surface on said object and polishing pad | |
WO2011008918A3 (en) | Grooved cmp polishing pad | |
TW200644285A (en) | Semiconductor light emitting device, semiconductor light emitting apparatus, and method of manufacturing semiconductor light emitting device | |
MY201736A (en) | Glass substrate for a magnetic disk, magnetic disk and method of manufacturing a magentic disk | |
WO2011142975A3 (en) | Pad window insert | |
WO2010045151A3 (en) | Textured platen | |
WO2009019993A1 (ja) | 磁気ディスク用ガラス基板の製造方法 | |
WO2009112780A3 (fr) | Substrat texture muni d'un empilement a proprietes thermiques. | |
WO2008152945A1 (ja) | 半導体発光装置及びその製造方法 | |
TW200701303A (en) | A substrate and a method for polishing a substrate | |
WO2009046332A3 (en) | Snowboard or ski or the like having a channeled edge or multiple element edge | |
WO2006020284A3 (en) | Wood panel | |
CN202491278U (zh) | 具有软质层的热压板 | |
MX2007003029A (es) | Dispositivo de cojinete. | |
CN202895023U (zh) | 一种干磨砂纸 | |
TW200614897A (en) | Circuit structure | |
WO2009051120A1 (ja) | 半導体素子搭載基板 | |
TW200802701A (en) | Interconnect structure, methods for fabricating the same, and methods for improving adhesion between low-k dielectric layers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed |