IL125249A - הוצאת יוני אורתופוספיט מאמבטיות לציפוי ניקל ללא חשמל - Google Patents
הוצאת יוני אורתופוספיט מאמבטיות לציפוי ניקל ללא חשמלInfo
- Publication number
- IL125249A IL125249A IL12524997A IL12524997A IL125249A IL 125249 A IL125249 A IL 125249A IL 12524997 A IL12524997 A IL 12524997A IL 12524997 A IL12524997 A IL 12524997A IL 125249 A IL125249 A IL 125249A
- Authority
- IL
- Israel
- Prior art keywords
- acid
- bath
- calcium
- ion
- orthophosphite
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3087796P | 1996-11-14 | 1996-11-14 | |
PCT/US1997/020781 WO1998021381A1 (en) | 1996-11-14 | 1997-11-13 | Removal of orthophosphite ions from electroless nickel plating baths |
Publications (2)
Publication Number | Publication Date |
---|---|
IL125249A0 IL125249A0 (en) | 1999-03-12 |
IL125249A true IL125249A (he) | 2001-04-30 |
Family
ID=21856476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL12524997A IL125249A (he) | 1996-11-14 | 1997-11-13 | הוצאת יוני אורתופוספיט מאמבטיות לציפוי ניקל ללא חשמל |
Country Status (8)
Country | Link |
---|---|
US (1) | US6048585A (he) |
EP (1) | EP0894156A4 (he) |
JP (1) | JP2000503354A (he) |
CN (1) | CN1208442A (he) |
BR (1) | BR9707124A (he) |
CA (1) | CA2241794A1 (he) |
IL (1) | IL125249A (he) |
WO (1) | WO1998021381A1 (he) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6490984B1 (en) * | 1998-12-28 | 2002-12-10 | Miyoshi Yushi Kabushiki Kaisha | Method of making flue gas harmless |
US6800121B2 (en) * | 2002-06-18 | 2004-10-05 | Atotech Deutschland Gmbh | Electroless nickel plating solutions |
DE10246453A1 (de) * | 2002-10-04 | 2004-04-15 | Enthone Inc., West Haven | Verfahren zur stromlosen Abscheidung von Nickel |
JP2005022956A (ja) * | 2003-07-02 | 2005-01-27 | Rohm & Haas Electronic Materials Llc | セラミックの金属化 |
JP4486559B2 (ja) * | 2005-07-12 | 2010-06-23 | 株式会社ムラタ | 無電解めっき液の再生装置及び再生方法 |
US7787912B2 (en) * | 2006-11-22 | 2010-08-31 | Nokia Corporation | Portable electronic device with double acting hinge arrangement |
EP2072508A1 (fr) * | 2007-12-19 | 2009-06-24 | Galactic S.A. | Procédé d'obtention de lactide |
US8858693B2 (en) * | 2011-01-11 | 2014-10-14 | Omg Electronic Chemicals, Llc | Electroless plating bath composition and method of plating particulate matter |
US11685999B2 (en) * | 2014-06-02 | 2023-06-27 | Macdermid Acumen, Inc. | Aqueous electroless nickel plating bath and method of using the same |
US9708693B2 (en) * | 2014-06-03 | 2017-07-18 | Macdermid Acumen, Inc. | High phosphorus electroless nickel |
EP3325688B1 (en) * | 2015-07-17 | 2021-02-24 | Coventya Inc. | Electroless nickel-phosphorous plating method using baths with reduced ion concentration |
CN110760824A (zh) * | 2019-11-07 | 2020-02-07 | 惠州市臻鼎环保科技有限公司 | 一种化学镀镍液的再生处理方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3420680A (en) * | 1966-04-08 | 1969-01-07 | Shipley Co | Compositions and processes for electroless nickel plating |
US4483711A (en) * | 1983-06-17 | 1984-11-20 | Omi International Corporation | Aqueous electroless nickel plating bath and process |
US4789484A (en) * | 1988-02-22 | 1988-12-06 | Occidental Chemical Corporation | Treatment of electroless nickel plating baths |
US5112392A (en) * | 1991-06-21 | 1992-05-12 | Martin Marietta Energy Systems, Inc. | Recovery process for electroless plating baths |
US5221328A (en) * | 1991-11-27 | 1993-06-22 | Mcgean-Rohco, Inc. | Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths |
US5258061A (en) * | 1992-11-20 | 1993-11-02 | Monsanto Company | Electroless nickel plating baths |
US5277817A (en) * | 1992-11-20 | 1994-01-11 | Monsanto Company | Apparatus and methods for treating electroless plating baths |
US5338342A (en) * | 1993-05-21 | 1994-08-16 | Mallory Jr Glen O | Stabilized electroless nickel plating baths |
US5944879A (en) * | 1997-02-19 | 1999-08-31 | Elf Atochem North America, Inc. | Nickel hypophosphite solutions containing increased nickel concentration |
-
1997
- 1997-11-13 BR BR9707124A patent/BR9707124A/pt not_active Application Discontinuation
- 1997-11-13 CN CN97191683A patent/CN1208442A/zh active Pending
- 1997-11-13 JP JP10522844A patent/JP2000503354A/ja active Pending
- 1997-11-13 EP EP97949429A patent/EP0894156A4/en not_active Withdrawn
- 1997-11-13 US US09/101,145 patent/US6048585A/en not_active Expired - Fee Related
- 1997-11-13 IL IL12524997A patent/IL125249A/he not_active IP Right Cessation
- 1997-11-13 CA CA002241794A patent/CA2241794A1/en not_active Abandoned
- 1997-11-13 WO PCT/US1997/020781 patent/WO1998021381A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2000503354A (ja) | 2000-03-21 |
EP0894156A4 (en) | 2002-06-26 |
US6048585A (en) | 2000-04-11 |
BR9707124A (pt) | 1999-07-20 |
CN1208442A (zh) | 1999-02-17 |
WO1998021381A1 (en) | 1998-05-22 |
IL125249A0 (en) | 1999-03-12 |
CA2241794A1 (en) | 1998-05-22 |
EP0894156A1 (en) | 1999-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1378584B1 (en) | Electroless nickel plating solutions | |
US4483711A (en) | Aqueous electroless nickel plating bath and process | |
US3338726A (en) | Chemical reduction plating process and bath | |
KR890002654B1 (ko) | 무전해 구리도금용액 | |
US4684550A (en) | Electroless copper plating and bath therefor | |
US6048585A (en) | Removal of orthophosphite ions from electroless nickel plating baths | |
GB2095292A (en) | Electroless gold plating | |
JP2004537647A (ja) | ニッケル、ホウ素および粒子を含有する塗料 | |
US4780342A (en) | Electroless nickel plating composition and method for its preparation and use | |
US5935306A (en) | Electroless gold plating bath | |
GB2121444A (en) | Electroless gold plating | |
US5944879A (en) | Nickel hypophosphite solutions containing increased nickel concentration | |
JPS6141774A (ja) | 水性・無電解ニツケル改良浴及び方法 | |
US4038085A (en) | Method of treating electroless nickel plating bath | |
USH325H (en) | Electroless deposition of transition metals | |
JP3697181B2 (ja) | 無電解金メッキ液 | |
CN113005438B (zh) | 一种银离子促进剂作为提高化学镀钯液中镀钯速率的添加剂的方法 | |
JP2741070B2 (ja) | 亜鉛又は亜鉛合金の無電解ニッケルめっき方法 | |
JPH06280038A (ja) | 無電解ニッケルリンめっき液 | |
JPH04503379A (ja) | メッキ組成物およびメッキ方法 | |
JPS61217582A (ja) | 無電解すずめつき浴とその使用方法 | |
JPH06256964A (ja) | 無電解Ni−Sn系合金めっき液 | |
JPH06256962A (ja) | 無電解Ni−Sn−P合金めっき液 | |
JPH0218387B2 (he) | ||
JPH0137477B2 (he) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
RH1 | Patent not in force |