BR9707124A - Bando de niquelação sem corrente elétrica e processo aperfeiçoado que utiliza este banho - Google Patents

Bando de niquelação sem corrente elétrica e processo aperfeiçoado que utiliza este banho

Info

Publication number
BR9707124A
BR9707124A BR9707124A BR9707124A BR9707124A BR 9707124 A BR9707124 A BR 9707124A BR 9707124 A BR9707124 A BR 9707124A BR 9707124 A BR9707124 A BR 9707124A BR 9707124 A BR9707124 A BR 9707124A
Authority
BR
Brazil
Prior art keywords
bath
electric current
improved process
nickel band
nickel
Prior art date
Application number
BR9707124A
Other languages
English (en)
Inventor
Nicholas Michael Martyak
John Edward Mccaskie
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BR9707124A publication Critical patent/BR9707124A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
BR9707124A 1996-11-14 1997-11-13 Bando de niquelação sem corrente elétrica e processo aperfeiçoado que utiliza este banho BR9707124A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3087796P 1996-11-14 1996-11-14
PCT/US1997/020781 WO1998021381A1 (en) 1996-11-14 1997-11-13 Removal of orthophosphite ions from electroless nickel plating baths

Publications (1)

Publication Number Publication Date
BR9707124A true BR9707124A (pt) 1999-07-20

Family

ID=21856476

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9707124A BR9707124A (pt) 1996-11-14 1997-11-13 Bando de niquelação sem corrente elétrica e processo aperfeiçoado que utiliza este banho

Country Status (8)

Country Link
US (1) US6048585A (pt)
EP (1) EP0894156A4 (pt)
JP (1) JP2000503354A (pt)
CN (1) CN1208442A (pt)
BR (1) BR9707124A (pt)
CA (1) CA2241794A1 (pt)
IL (1) IL125249A (pt)
WO (1) WO1998021381A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6490984B1 (en) * 1998-12-28 2002-12-10 Miyoshi Yushi Kabushiki Kaisha Method of making flue gas harmless
US6800121B2 (en) * 2002-06-18 2004-10-05 Atotech Deutschland Gmbh Electroless nickel plating solutions
DE10246453A1 (de) * 2002-10-04 2004-04-15 Enthone Inc., West Haven Verfahren zur stromlosen Abscheidung von Nickel
JP2005022956A (ja) * 2003-07-02 2005-01-27 Rohm & Haas Electronic Materials Llc セラミックの金属化
JP4486559B2 (ja) * 2005-07-12 2010-06-23 株式会社ムラタ 無電解めっき液の再生装置及び再生方法
US7787912B2 (en) * 2006-11-22 2010-08-31 Nokia Corporation Portable electronic device with double acting hinge arrangement
EP2072508A1 (fr) * 2007-12-19 2009-06-24 Galactic S.A. Procédé d'obtention de lactide
EP3255176B1 (en) * 2011-01-11 2019-05-01 MacDermid Enthone America LLC Method of plating particulate matter
US11685999B2 (en) * 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
US9708693B2 (en) * 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
MY185286A (en) * 2015-07-17 2021-04-30 Coventya Inc Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
CN110760824A (zh) * 2019-11-07 2020-02-07 惠州市臻鼎环保科技有限公司 一种化学镀镍液的再生处理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3420680A (en) * 1966-04-08 1969-01-07 Shipley Co Compositions and processes for electroless nickel plating
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US4789484A (en) * 1988-02-22 1988-12-06 Occidental Chemical Corporation Treatment of electroless nickel plating baths
US5112392A (en) * 1991-06-21 1992-05-12 Martin Marietta Energy Systems, Inc. Recovery process for electroless plating baths
US5221328A (en) * 1991-11-27 1993-06-22 Mcgean-Rohco, Inc. Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths
US5258061A (en) * 1992-11-20 1993-11-02 Monsanto Company Electroless nickel plating baths
US5277817A (en) * 1992-11-20 1994-01-11 Monsanto Company Apparatus and methods for treating electroless plating baths
US5338342A (en) * 1993-05-21 1994-08-16 Mallory Jr Glen O Stabilized electroless nickel plating baths
US5944879A (en) * 1997-02-19 1999-08-31 Elf Atochem North America, Inc. Nickel hypophosphite solutions containing increased nickel concentration

Also Published As

Publication number Publication date
EP0894156A4 (en) 2002-06-26
WO1998021381A1 (en) 1998-05-22
US6048585A (en) 2000-04-11
IL125249A (en) 2001-04-30
EP0894156A1 (en) 1999-02-03
IL125249A0 (en) 1999-03-12
CA2241794A1 (en) 1998-05-22
CN1208442A (zh) 1999-02-17
JP2000503354A (ja) 2000-03-21

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Legal Events

Date Code Title Description
EG Technical examination (opinion): publication of technical examination (opinion)
B09B Patent application refused [chapter 9.2 patent gazette]