IL112313A - Method and apparatus for determining a location on a surface of an object - Google Patents

Method and apparatus for determining a location on a surface of an object

Info

Publication number
IL112313A
IL112313A IL11231395A IL11231395A IL112313A IL 112313 A IL112313 A IL 112313A IL 11231395 A IL11231395 A IL 11231395A IL 11231395 A IL11231395 A IL 11231395A IL 112313 A IL112313 A IL 112313A
Authority
IL
Israel
Prior art keywords
location
determining
Prior art date
Application number
IL11231395A
Other languages
English (en)
Other versions
IL112313A0 (en
Original Assignee
Nova Measuring Instr Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nova Measuring Instr Ltd filed Critical Nova Measuring Instr Ltd
Priority to IL11231395A priority Critical patent/IL112313A/xx
Publication of IL112313A0 publication Critical patent/IL112313A0/xx
Priority to US08/512,731 priority patent/US5682242A/en
Priority to IL11670496A priority patent/IL116704A/xx
Priority to JP2051296A priority patent/JPH08298281A/ja
Priority to DE19601708A priority patent/DE19601708A1/de
Priority to US08/590,054 priority patent/US5867590A/en
Priority to FR9600247A priority patent/FR2729216B1/fr
Publication of IL112313A publication Critical patent/IL112313A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37404—Orientation of workpiece or tool, surface sensor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37555—Camera detects orientation, position workpiece, points of workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Dicing (AREA)
  • Control Of Position Or Direction (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL11231395A 1995-01-11 1995-01-11 Method and apparatus for determining a location on a surface of an object IL112313A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IL11231395A IL112313A (en) 1995-01-11 1995-01-11 Method and apparatus for determining a location on a surface of an object
US08/512,731 US5682242A (en) 1995-01-11 1995-08-07 Method and apparatus for determining a location on a surface of an object
IL11670496A IL116704A (en) 1995-01-11 1996-01-08 Method and apparatus for determining a location on a surface of an object
JP2051296A JPH08298281A (ja) 1995-01-11 1996-01-11 物体表面上の特徴的部分を利用した物体上の部位を求める方法及び物体の位置決め方法
DE19601708A DE19601708A1 (de) 1995-01-11 1996-01-11 Verfahren und System zum Bestimmen einer Lage auf einer Oberfläche eines Gegenstandes
US08/590,054 US5867590A (en) 1995-01-11 1996-01-11 Method and apparatus for determining a location on a surface of an object
FR9600247A FR2729216B1 (fr) 1995-01-11 1996-01-11 Methode et dispositif pour determiner un emplacement sur une surface d'un objet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL11231395A IL112313A (en) 1995-01-11 1995-01-11 Method and apparatus for determining a location on a surface of an object

Publications (2)

Publication Number Publication Date
IL112313A0 IL112313A0 (en) 1995-03-30
IL112313A true IL112313A (en) 1999-08-17

Family

ID=11066992

Family Applications (1)

Application Number Title Priority Date Filing Date
IL11231395A IL112313A (en) 1995-01-11 1995-01-11 Method and apparatus for determining a location on a surface of an object

Country Status (5)

Country Link
US (1) US5682242A (xx)
JP (1) JPH08298281A (xx)
DE (1) DE19601708A1 (xx)
FR (1) FR2729216B1 (xx)
IL (1) IL112313A (xx)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5827629A (en) * 1995-05-11 1998-10-27 Sumitomo Heavy Industries, Ltd. Position detecting method with observation of position detecting marks
US5965307A (en) * 1995-05-11 1999-10-12 Sumitomo Heavy Industries, Ltd. Position detecting method with observation of position detecting marks
JPH09306977A (ja) * 1996-05-14 1997-11-28 Komatsu Ltd ウエハ検査装置等におけるウエハの位置決め方法
US6151406A (en) 1997-10-09 2000-11-21 Cognex Corporation Method and apparatus for locating ball grid array packages from two-dimensional image data
IL123575A (en) * 1998-03-05 2001-08-26 Nova Measuring Instr Ltd Method and apparatus for alignment of a wafer
EP1098360A4 (en) * 1998-06-15 2004-09-15 Nikon Corp POSITION DETECTING METHOD, POSITION SENSOR, EXPOSURE METHOD, EXPOSURE DEVICE AND METHOD FOR THEIR PRODUCTION AND DEVICE MANUFACTURING METHOD
US6320609B1 (en) * 1998-07-10 2001-11-20 Nanometrics Incorporated System using a polar coordinate stage and continuous image rotation to compensate for stage rotation
US7295314B1 (en) 1998-07-10 2007-11-13 Nanometrics Incorporated Metrology/inspection positioning system
IL125337A0 (en) * 1998-07-14 1999-03-12 Nova Measuring Instr Ltd Method and apparatus for lithography monitoring and process control
JP4722244B2 (ja) * 1998-07-14 2011-07-13 ノバ・メジャリング・インストルメンツ・リミテッド 所定のフォトリソグラフィ工程に従って基板を加工する装置
IL126949A (en) 1998-11-08 2004-03-28 Nova Measuring Instr Ltd Apparatus for integrated monitoring of wafers and for process control in semiconductor manufacturing and a method for use thereof
US6212961B1 (en) 1999-02-11 2001-04-10 Nova Measuring Instruments Ltd. Buffer system for a wafer handling system
AU3187100A (en) 1999-03-10 2000-09-28 Nova Measuring Instruments Ltd. Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects
IL128920A0 (en) 1999-03-10 2000-02-17 Nova Measuring Instr Ltd Method for monitoring metal cmp
US8531678B2 (en) 1999-07-09 2013-09-10 Nova Measuring Instruments, Ltd. Method and system for measuring patterned structures
IL130874A (en) 1999-07-09 2002-12-01 Nova Measuring Instr Ltd System and method for measuring pattern structures
IL132314A0 (en) 1999-10-11 2001-03-19 Nova Measuring Instr Ltd An apparatus for in-cassette monitoring of semiconductor wafers
US6791686B1 (en) 2000-07-26 2004-09-14 Nova Measuring Instruments Ltd. Apparatus for integrated monitoring of wafers and for process control in the semiconductor manufacturing and a method for use thereof
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US6782337B2 (en) 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US6806951B2 (en) 2000-09-20 2004-10-19 Kla-Tencor Technologies Corp. Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US20020114507A1 (en) * 2001-02-21 2002-08-22 Mark Lynch Saw alignment technique for array device singulation
IL144806A (en) * 2001-08-08 2005-11-20 Nova Measuring Instr Ltd Method and apparatus for process control in semiconductor manufacturing
IL145699A (en) * 2001-09-30 2006-12-10 Nova Measuring Instr Ltd Method of thin film characterization
US7085676B2 (en) * 2003-06-27 2006-08-01 Tokyo Electron Limited Feed forward critical dimension control
IL158086A (en) * 2003-09-24 2010-02-17 Nova Measuring Instr Ltd Method and system for positioning articles with respect to a processing tool
AU2003300005A1 (en) 2003-12-19 2005-08-03 International Business Machines Corporation Differential critical dimension and overlay metrology apparatus and measurement method
IL162290A (en) * 2004-06-01 2013-06-27 Nova Measuring Instr Ltd Optical measurement system
GB0515695D0 (en) * 2005-07-29 2005-09-07 Randox Lab Ltd Method
JP4262232B2 (ja) * 2005-10-17 2009-05-13 リンテック株式会社 測定装置
DE102007010223B4 (de) 2007-02-28 2010-07-29 Vistec Semiconductor Systems Gmbh Verfahren zur Bestimmung geometrischer Parameter eines Wafers und Verwendung des Verfahren bei der optischen Inspektion von Wafern
DE102007010224B4 (de) 2007-02-28 2010-08-05 Vistec Semiconductor Systems Jena Gmbh Vorrichtung zum Haltern von scheibenförmigen Objekten
TWI495886B (zh) * 2014-01-06 2015-08-11 Wistron Corp 自動化對位系統及方法
CN106477125A (zh) * 2016-09-27 2017-03-08 杭州南江机器人股份有限公司 一种自动贴标装置以及贴标方法
JP6955955B2 (ja) * 2017-10-12 2021-10-27 株式会社ディスコ ウェーハの加工方法
JP7016730B2 (ja) * 2018-03-09 2022-02-07 リンテック株式会社 方位認識装置および方位認識方法、並びに、位置決め装置および位置決め方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4856904A (en) * 1985-01-21 1989-08-15 Nikon Corporation Wafer inspecting apparatus
US4780615A (en) * 1985-02-01 1988-10-25 Canon Kabushiki Kaisha Alignment system for use in pattern transfer apparatus
JPS61277003A (ja) * 1985-05-31 1986-12-08 Mitsubishi Electric Corp ウエハ−のストリ−ト検出装置
JPS6265436A (ja) * 1985-09-18 1987-03-24 Tokyo Sokuhan Kk ダイボンダにおけるウエハ−位置制御方法
JPH0789534B2 (ja) * 1986-07-04 1995-09-27 キヤノン株式会社 露光方法
US4918320A (en) * 1987-03-20 1990-04-17 Canon Kabushiki Kaisha Alignment method usable in a step-and-repeat type exposure apparatus for either global or dye-by-dye alignment
JP2635617B2 (ja) * 1987-09-29 1997-07-30 株式会社東芝 半導体素子特性評価用の直交格子点の発生方法
US5238354A (en) * 1989-05-23 1993-08-24 Cybeq Systems, Inc. Semiconductor object pre-aligning apparatus
US5037771A (en) * 1989-11-28 1991-08-06 Cross-Check Technology, Inc. Method for implementing grid-based crosscheck test structures and the structures resulting therefrom
US5241266A (en) * 1992-04-10 1993-08-31 Micron Technology, Inc. Built-in test circuit connection for wafer level burnin and testing of individual dies

Also Published As

Publication number Publication date
DE19601708A1 (de) 1996-07-18
FR2729216B1 (fr) 1998-06-19
US5682242A (en) 1997-10-28
JPH08298281A (ja) 1996-11-12
IL112313A0 (en) 1995-03-30
FR2729216A1 (fr) 1996-07-12

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