IL102041A - Method of forming t-gate structure on microelectronic device substrate - Google Patents

Method of forming t-gate structure on microelectronic device substrate

Info

Publication number
IL102041A
IL102041A IL10204192A IL10204192A IL102041A IL 102041 A IL102041 A IL 102041A IL 10204192 A IL10204192 A IL 10204192A IL 10204192 A IL10204192 A IL 10204192A IL 102041 A IL102041 A IL 102041A
Authority
IL
Israel
Prior art keywords
material layer
etching
resist
layer
forming
Prior art date
Application number
IL10204192A
Other languages
English (en)
Other versions
IL102041A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL102041A0 publication Critical patent/IL102041A0/xx
Publication of IL102041A publication Critical patent/IL102041A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/012—Manufacture or treatment of electrodes comprising a Schottky barrier to a semiconductor
    • H10D64/0124—Manufacture or treatment of electrodes comprising a Schottky barrier to a semiconductor to Group III-V semiconductors
    • H10D64/0125—Manufacture or treatment of electrodes comprising a Schottky barrier to a semiconductor to Group III-V semiconductors characterised by the sectional shape, e.g. T or inverted T
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/202—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials for lift-off processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/909—Controlled atmosphere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/949—Energy beam treating radiation resist on semiconductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/951—Lift-off

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
IL10204192A 1991-05-28 1992-05-28 Method of forming t-gate structure on microelectronic device substrate IL102041A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/705,870 US5155053A (en) 1991-05-28 1991-05-28 Method of forming t-gate structure on microelectronic device substrate

Publications (2)

Publication Number Publication Date
IL102041A0 IL102041A0 (en) 1992-12-30
IL102041A true IL102041A (en) 1994-06-24

Family

ID=24835293

Family Applications (1)

Application Number Title Priority Date Filing Date
IL10204192A IL102041A (en) 1991-05-28 1992-05-28 Method of forming t-gate structure on microelectronic device substrate

Country Status (4)

Country Link
US (1) US5155053A (de)
EP (1) EP0516408A3 (de)
JP (1) JPH0689907A (de)
IL (1) IL102041A (de)

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US5334542A (en) * 1991-11-27 1994-08-02 Oki Electric Industry Co., Ltd. Method of forming T-shaped electrode
JPH0653241A (ja) * 1992-08-03 1994-02-25 Nec Corp 電界効果トランジスタの製造方法
US5288660A (en) * 1993-02-01 1994-02-22 Avantek, Inc. Method for forming self-aligned t-shaped transistor electrode
US5436201A (en) * 1993-05-28 1995-07-25 Hughes Aircraft Company Dual etchant process, particularly for gate recess fabrication in GaAs MMIC chips
FR2711451B1 (fr) * 1993-10-18 1995-11-17 Jackie Etrillard Procédé d'obtention de contacts conducteurs auto-alignés pour composants électroniques.
US5489539A (en) * 1994-01-10 1996-02-06 Hughes Aircraft Company Method of making quantum well structure with self-aligned gate
US5543253A (en) * 1994-08-08 1996-08-06 Electronics & Telecommunications Research Inst. Photomask for t-gate formation and process for fabricating the same
US5516710A (en) * 1994-11-10 1996-05-14 Northern Telecom Limited Method of forming a transistor
US6294799B1 (en) * 1995-11-27 2001-09-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating same
US5940732A (en) 1995-11-27 1999-08-17 Semiconductor Energy Laboratory Co., Method of fabricating semiconductor device
TW301061B (en) * 1996-06-07 1997-03-21 Ind Tech Res Inst Manufacturing method of submicron T-type gate
KR100212455B1 (ko) * 1996-11-04 1999-08-02 정선종 이중 게이트 구조의 반도체 소자 제조 방법
DE19717363C2 (de) * 1997-04-24 2001-09-06 Siemens Ag Herstellverfahren für eine Platinmetall-Struktur mittels eines Lift-off-Prozesses und Verwendung des Herstellverfahrens
TW347561B (en) * 1997-06-20 1998-12-11 Ti Acer Co Ltd Method of forming a T-gate Lightly-Doped Drain semiconductor device
KR100264773B1 (ko) * 1998-04-02 2000-09-01 윤종용 자기 정렬된 콘택홀을 갖는 반도체 장치의제조 방법
US6096664A (en) * 1998-08-06 2000-08-01 Siemens Aktiengesellschaft Method of manufacturing semiconductor structures including a pair of MOSFETs
US6833079B1 (en) * 2000-02-17 2004-12-21 Applied Materials Inc. Method of etching a shaped cavity
US6319802B1 (en) 2000-07-20 2001-11-20 Advanced Micro Devices, Inc. T-gate formation using modified damascene processing with two masks
US6270929B1 (en) * 2000-07-20 2001-08-07 Advanced Micro Devices, Inc. Damascene T-gate using a relacs flow
US7008832B1 (en) 2000-07-20 2006-03-07 Advanced Micro Devices, Inc. Damascene process for a T-shaped gate electrode
US6255202B1 (en) 2000-07-20 2001-07-03 Advanced Micro Devices, Inc. Damascene T-gate using a spacer flow
US6417084B1 (en) 2000-07-20 2002-07-09 Advanced Micro Devices, Inc. T-gate formation using a modified conventional poly process
US6403456B1 (en) 2000-08-22 2002-06-11 Advanced Micro Devices, Inc. T or T/Y gate formation using trim etch processing
US6313019B1 (en) 2000-08-22 2001-11-06 Advanced Micro Devices Y-gate formation using damascene processing
DE10101825B4 (de) * 2001-01-17 2006-12-14 United Monolithic Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiter-Bauelements mit einer T-förmigen Kontaktelektrode
DE10304722A1 (de) * 2002-05-11 2004-08-19 United Monolithic Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauelements
US20040145030A1 (en) * 2003-01-28 2004-07-29 Meagley Robert P. Forming semiconductor structures
US7262070B2 (en) * 2003-09-29 2007-08-28 Intel Corporation Method to make a weight compensating/tuning layer on a substrate
JP4758170B2 (ja) * 2005-08-09 2011-08-24 三菱電機株式会社 半導体装置の製造方法
US7892978B2 (en) 2006-07-10 2011-02-22 Micron Technology, Inc. Electron induced chemical etching for device level diagnosis
US7807062B2 (en) * 2006-07-10 2010-10-05 Micron Technology, Inc. Electron induced chemical etching and deposition for local circuit repair
US7791055B2 (en) 2006-07-10 2010-09-07 Micron Technology, Inc. Electron induced chemical etching/deposition for enhanced detection of surface defects
US7791071B2 (en) 2006-08-14 2010-09-07 Micron Technology, Inc. Profiling solid state samples
US7833427B2 (en) 2006-08-14 2010-11-16 Micron Technology, Inc. Electron beam etching device and method
US7718080B2 (en) * 2006-08-14 2010-05-18 Micron Technology, Inc. Electronic beam processing device and method using carbon nanotube emitter
US7569484B2 (en) * 2006-08-14 2009-08-04 Micron Technology, Inc. Plasma and electron beam etching device and method
US8420978B2 (en) * 2007-01-18 2013-04-16 The Board Of Trustees Of The University Of Illinois High throughput, low cost dual-mode patterning method for large area substrates
US8003300B2 (en) * 2007-04-12 2011-08-23 The Board Of Trustees Of The University Of Illinois Methods for fabricating complex micro and nanoscale structures and electronic devices and components made by the same
US8652763B2 (en) * 2007-07-16 2014-02-18 The Board Of Trustees Of The University Of Illinois Method for fabricating dual damascene profiles using sub pixel-voting lithography and devices made by same
US8546067B2 (en) * 2008-03-21 2013-10-01 The Board Of Trustees Of The University Of Illinois Material assisted laser ablation
US8187795B2 (en) * 2008-12-09 2012-05-29 The Board Of Trustees Of The University Of Illinois Patterning methods for stretchable structures
WO2012094357A2 (en) * 2011-01-07 2012-07-12 Eastman Kodak Company Transistor including multiple reentrant profiles
US8847226B2 (en) 2011-01-07 2014-09-30 Eastman Kodak Company Transistor including multiple reentrant profiles
CN118946242A (zh) * 2017-08-31 2024-11-12 谷歌有限责任公司 使用多层堆叠制造器件的方法
CN111640795A (zh) * 2020-04-28 2020-09-08 西安电子科技大学 一种具有弧形栅电极的氮化镓高频晶体管及制作方法
CN112885899A (zh) * 2020-12-17 2021-06-01 南京中电芯谷高频器件产业技术研究院有限公司 一种自对准低欧姆接触电阻GaN HEMT器件及其制造方法

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JPS55163860A (en) * 1979-06-06 1980-12-20 Toshiba Corp Manufacture of semiconductor device
JPS57183037A (en) * 1981-05-06 1982-11-11 Nec Corp Formation of pattern
JPS60111474A (ja) * 1983-11-22 1985-06-17 Nec Corp 半導体装置の製造方法
JPS6180870A (ja) * 1984-09-27 1986-04-24 Nec Corp 半導体トランジスタおよびその製造方法
JPS62250674A (ja) * 1986-04-23 1987-10-31 Nec Corp 半導体装置の製造方法
US4700462A (en) * 1986-10-08 1987-10-20 Hughes Aircraft Company Process for making a T-gated transistor
JPS63155770A (ja) * 1986-12-19 1988-06-28 Hitachi Ltd 電界効果トランジスタの製造方法
US4771017A (en) * 1987-06-23 1988-09-13 Spire Corporation Patterning process
JPH0269936A (ja) * 1988-07-28 1990-03-08 Siemens Ag 半導体材料上の樹脂構造の形成方法
US4959326A (en) * 1988-12-22 1990-09-25 Siemens Aktiengesellschaft Fabricating T-gate MESFETS employing double exposure, double develop techniques
DE3901288A1 (de) * 1989-01-18 1990-07-26 Licentia Gmbh Verfahren zur herstellung von gate-elektroden
JP2550412B2 (ja) * 1989-05-15 1996-11-06 ローム株式会社 電界効果トランジスタの製造方法
US5053348A (en) * 1989-12-01 1991-10-01 Hughes Aircraft Company Fabrication of self-aligned, t-gate hemt

Also Published As

Publication number Publication date
EP0516408A2 (de) 1992-12-02
IL102041A0 (en) 1992-12-30
EP0516408A3 (en) 1993-01-13
US5155053A (en) 1992-10-13
JPH0689907A (ja) 1994-03-29

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