IE32507B1 - Improvements in and relating to contact bonding and lead attachment to an electrical device - Google Patents

Improvements in and relating to contact bonding and lead attachment to an electrical device

Info

Publication number
IE32507B1
IE32507B1 IE1435/68A IE143568A IE32507B1 IE 32507 B1 IE32507 B1 IE 32507B1 IE 1435/68 A IE1435/68 A IE 1435/68A IE 143568 A IE143568 A IE 143568A IE 32507 B1 IE32507 B1 IE 32507B1
Authority
IE
Ireland
Prior art keywords
leads
bonding
wafer
frame
needle
Prior art date
Application number
IE1435/68A
Other languages
English (en)
Other versions
IE32507L (en
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IE32507L publication Critical patent/IE32507L/xx
Publication of IE32507B1 publication Critical patent/IE32507B1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
IE1435/68A 1967-12-15 1968-11-25 Improvements in and relating to contact bonding and lead attachment to an electrical device IE32507B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104067A 1967-12-15 1967-12-15

Publications (2)

Publication Number Publication Date
IE32507L IE32507L (en) 1969-06-15
IE32507B1 true IE32507B1 (en) 1973-08-22

Family

ID=24774930

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1435/68A IE32507B1 (en) 1967-12-15 1968-11-25 Improvements in and relating to contact bonding and lead attachment to an electrical device

Country Status (7)

Country Link
BE (1) BE725468A (enrdf_load_stackoverflow)
CA (1) CA922021A (enrdf_load_stackoverflow)
DE (1) DE1813165A1 (enrdf_load_stackoverflow)
FR (1) FR1597770A (enrdf_load_stackoverflow)
GB (1) GB1199848A (enrdf_load_stackoverflow)
IE (1) IE32507B1 (enrdf_load_stackoverflow)
NL (1) NL6817049A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758871A (fr) * 1969-11-13 1971-05-12 Philips Nv Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
US7515693B2 (en) 2004-08-06 2009-04-07 Powerphone, Inc. Call handler systems and methods
CN216483147U (zh) * 2018-12-21 2022-05-10 大陆-特韦斯贸易合伙股份公司及两合公司 传感器

Also Published As

Publication number Publication date
DE1813165A1 (de) 1969-07-03
CA922021A (en) 1973-02-27
BE725468A (enrdf_load_stackoverflow) 1969-06-13
IE32507L (en) 1969-06-15
FR1597770A (enrdf_load_stackoverflow) 1970-06-29
GB1199848A (en) 1970-07-22
NL6817049A (enrdf_load_stackoverflow) 1969-06-17

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