ID26139A - Peralatan pengumpan jet solder dan metoda penyolderan - Google Patents

Peralatan pengumpan jet solder dan metoda penyolderan

Info

Publication number
ID26139A
ID26139A IDP20000454D ID20000454D ID26139A ID 26139 A ID26139 A ID 26139A ID P20000454 D IDP20000454 D ID P20000454D ID 20000454 D ID20000454 D ID 20000454D ID 26139 A ID26139 A ID 26139A
Authority
ID
Indonesia
Prior art keywords
adsignment
collection equipment
jet solder
solder collection
jet
Prior art date
Application number
IDP20000454D
Other languages
English (en)
Inventor
Masuo Koshi
Tadahiko Sugimoto
Takeshi Onobayashi
Kenichirou Todoroki
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of ID26139A publication Critical patent/ID26139A/id

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Nozzles (AREA)
IDP20000454D 1999-05-27 2000-05-25 Peralatan pengumpan jet solder dan metoda penyolderan ID26139A (id)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14738699 1999-05-27
JP2000123388A JP3602031B2 (ja) 1999-05-27 2000-04-25 はんだ噴流装置およびはんだ付け方法

Publications (1)

Publication Number Publication Date
ID26139A true ID26139A (id) 2000-11-30

Family

ID=26477945

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP20000454D ID26139A (id) 1999-05-27 2000-05-25 Peralatan pengumpan jet solder dan metoda penyolderan

Country Status (7)

Country Link
US (1) US6349861B1 (id)
JP (1) JP3602031B2 (id)
KR (1) KR100634226B1 (id)
CN (1) CN1170650C (id)
DE (1) DE10026067A1 (id)
ID (1) ID26139A (id)
MY (1) MY120844A (id)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132029A1 (de) * 2001-07-03 2003-01-16 Seho Systemtechnik Gmbh Lötdüse zum Wellenlöten von Leiterplatten
DE202009010159U1 (de) * 2009-07-28 2010-12-30 Seho Systemtechnik Gmbh Lötdüse für eine Wellenlötvorrichtung
CN104249210A (zh) * 2013-06-28 2014-12-31 鸿富锦精密工业（深圳）有限公司 多点焊治具
CN105570490B (zh) * 2014-10-09 2018-10-23 浙江三花智能控制股份有限公司 导阀体部件及具有该导阀体部件的导阀、四通换向阀
JP7340388B2 (ja) * 2019-08-21 2023-09-07 株式会社デンソーテン はんだ付け装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410126A (en) * 1978-10-12 1983-10-18 Cooper Industries, Inc. Mass soldering system
US4566624A (en) * 1983-12-16 1986-01-28 Hollis Automation, Inc. Mass wave soldering system
US5855323A (en) * 1996-11-13 1999-01-05 Sandia Corporation Method and apparatus for jetting, manufacturing and attaching uniform solder balls
US5984166A (en) * 1997-07-09 1999-11-16 Mask Technology, Inc. Process for creating fine and coarse pitch solder deposits on printed ciruit boards

Also Published As

Publication number Publication date
US6349861B1 (en) 2002-02-26
CN1275459A (zh) 2000-12-06
JP3602031B2 (ja) 2004-12-15
JP2001044613A (ja) 2001-02-16
KR20010049424A (ko) 2001-06-15
DE10026067A1 (de) 2001-05-23
MY120844A (en) 2005-11-30
KR100634226B1 (ko) 2006-10-16
CN1170650C (zh) 2004-10-13

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