IT1313366B1 - Apparecchio e procedimento per allineare componenti - Google Patents

Apparecchio e procedimento per allineare componenti

Info

Publication number
IT1313366B1
IT1313366B1 IT1999MI001962A ITMI991962A IT1313366B1 IT 1313366 B1 IT1313366 B1 IT 1313366B1 IT 1999MI001962 A IT1999MI001962 A IT 1999MI001962A IT MI991962 A ITMI991962 A IT MI991962A IT 1313366 B1 IT1313366 B1 IT 1313366B1
Authority
IT
Italy
Prior art keywords
procedure
align components
align
components
Prior art date
Application number
IT1999MI001962A
Other languages
English (en)
Inventor
Sang-Cheol Kim
Original Assignee
Samsung Aerospace Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Aerospace Ind filed Critical Samsung Aerospace Ind
Publication of ITMI991962A0 publication Critical patent/ITMI991962A0/it
Publication of ITMI991962A1 publication Critical patent/ITMI991962A1/it
Application granted granted Critical
Publication of IT1313366B1 publication Critical patent/IT1313366B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
IT1999MI001962A 1998-09-24 1999-09-22 Apparecchio e procedimento per allineare componenti IT1313366B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980039728A KR100287787B1 (ko) 1998-09-24 1998-09-24 부품위치정렬장치및이를이용한정렬방법

Publications (3)

Publication Number Publication Date
ITMI991962A0 ITMI991962A0 (it) 1999-09-22
ITMI991962A1 ITMI991962A1 (it) 2001-03-22
IT1313366B1 true IT1313366B1 (it) 2002-07-23

Family

ID=19551820

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1999MI001962A IT1313366B1 (it) 1998-09-24 1999-09-22 Apparecchio e procedimento per allineare componenti

Country Status (6)

Country Link
US (1) US6473188B1 (it)
JP (1) JP2000101298A (it)
KR (1) KR100287787B1 (it)
CN (1) CN1131415C (it)
DE (1) DE19944721A1 (it)
IT (1) IT1313366B1 (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6639239B2 (en) * 1998-10-30 2003-10-28 Cyberoptics Corporation Angle rejection filter
JP4387745B2 (ja) * 2003-09-30 2009-12-24 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
DE102005023705A1 (de) * 2005-05-23 2006-11-30 Siemens Ag Sensor und Sensorsystem zur optischen Erfassung von Objekten, Bestückkopf, Verfahren zur Bestimmung der Höhenposition eines Bauelements
NL1031471C2 (nl) * 2006-03-30 2007-03-16 Assembleon Nv Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.
NL1033000C2 (nl) * 2006-03-30 2007-08-21 Assembleon Nv Componentplaatsingseenheid alsmede componentplaatsingsinrichting die is voorzien van een dergelijke componentplaatsingseenheid.
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628464A (en) * 1983-10-07 1986-12-09 Westinghouse Electric Corp. Robotic system for mounting electrical components
US4827436A (en) 1987-04-22 1989-05-02 Micro Component Technology, Inc. Non-contact high resolution displacement measurement technique
US5278634A (en) * 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
US5331406A (en) * 1991-06-25 1994-07-19 Cyberoptics Corporation Multi-beam laser sensor for semiconductor lead measurements
EP0599297B1 (en) * 1992-11-25 1998-05-20 Sumitomo Electric Industries, Limited Method of detecting impurities in molten resin
JP3189500B2 (ja) * 1993-06-25 2001-07-16 松下電器産業株式会社 電子部品の外観検査装置および外観検査方法
JP3842287B2 (ja) * 1994-08-11 2006-11-08 サイバーオプティックス・コーポレーション 高精度半導体部品位置合せシステム

Also Published As

Publication number Publication date
ITMI991962A1 (it) 2001-03-22
CN1131415C (zh) 2003-12-17
KR20000020912A (ko) 2000-04-15
CN1251421A (zh) 2000-04-26
JP2000101298A (ja) 2000-04-07
US6473188B1 (en) 2002-10-29
ITMI991962A0 (it) 1999-09-22
KR100287787B1 (ko) 2001-04-16
DE19944721A1 (de) 2000-05-18

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