ID18715A - Struktur penunjang modul - Google Patents

Struktur penunjang modul

Info

Publication number
ID18715A
ID18715A IDP973507A ID973507A ID18715A ID 18715 A ID18715 A ID 18715A ID P973507 A IDP973507 A ID P973507A ID 973507 A ID973507 A ID 973507A ID 18715 A ID18715 A ID 18715A
Authority
ID
Indonesia
Prior art keywords
support structure
module support
module
support
Prior art date
Application number
IDP973507A
Other languages
English (en)
Indonesian (id)
Inventor
Hans-Ulrich Guenther
Paul Mazura
Volker Haag
Klaus Pfeifer
Klaus-Michael Thalau
Michael Joist
Udo Weiss
Original Assignee
Schroff Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7809997&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ID18715(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schroff Gmbh filed Critical Schroff Gmbh
Publication of ID18715A publication Critical patent/ID18715A/id

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • H05K9/0016Gaskets or seals having a spring contact
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28Clamped connections, spring connections
    • H01R4/48Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4809Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
IDP973507A 1996-10-25 1997-10-23 Struktur penunjang modul ID18715A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19644420A DE19644420C1 (de) 1996-10-25 1996-10-25 Baugruppenträger

Publications (1)

Publication Number Publication Date
ID18715A true ID18715A (id) 1998-04-30

Family

ID=7809997

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP973507A ID18715A (id) 1996-10-25 1997-10-23 Struktur penunjang modul

Country Status (12)

Country Link
US (1) US6134119A (cs)
EP (1) EP0838987B1 (cs)
JP (1) JP2875799B2 (cs)
KR (1) KR100286395B1 (cs)
AU (1) AU702195B2 (cs)
CA (1) CA2218571C (cs)
CZ (1) CZ285954B6 (cs)
DE (1) DE19644420C1 (cs)
ID (1) ID18715A (cs)
MY (1) MY132644A (cs)
PL (1) PL183733B1 (cs)
TW (1) TW379521B (cs)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0994643B1 (de) * 1998-10-14 2002-11-27 Schroff GmbH Baugruppenträger
DE19916882C1 (de) * 1999-04-14 2001-07-26 Apw Electronics Gmbh Als Gehäuse ausgebildeter Baugruppenträger
JP3673672B2 (ja) * 1999-06-18 2005-07-20 沖電気工業株式会社 ダミー表面板
TW415232U (en) * 1999-10-26 2000-12-11 Taipei Veterans General Hospit Electric physiology Faraday box
US20030236016A1 (en) * 2002-06-20 2003-12-25 The Furukawa Electric Co., Ltd. Tubular bus bar, insulating coating method therefor, and insulating coating structure therefor
US7102897B2 (en) * 2003-05-14 2006-09-05 Hitachi High-Technologies Corporation Circuit board module, circuit board chassis and electromagnetic shielding plate therefor
CN2636593Y (zh) * 2003-06-21 2004-08-25 鸿富锦精密工业(深圳)有限公司 插件安装结构
US7252521B2 (en) * 2003-07-25 2007-08-07 Utstarcom Korea Limited Injector/ejector and shelf structure grounded to card frame ground
US7495931B2 (en) * 2003-11-13 2009-02-24 Adc Telecommunications, Inc. Patch panel chassis
ITRM20050202A1 (it) * 2005-04-29 2006-10-30 Bticino Spa Dispositivo di collegamento elettrico fra un pannello ed un quadro elettrico.
DE102007063335A1 (de) 2007-12-27 2009-07-02 Herbert Waldmann Gmbh & Co. Kg Leuchte
CN202310409U (zh) * 2011-10-26 2012-07-04 中兴通讯股份有限公司 一种组合导轨
CN104789919B (zh) * 2015-04-02 2017-02-22 中航飞机股份有限公司西安飞机分公司 一种飞机滑轨类零件的火焰喷涂保护方法和保护夹具

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE319339C (de) * 1918-09-25 1920-03-04 Aeg Elektrisch leitende Verbindung
GB1483577A (en) * 1973-08-02 1977-08-24 Ard Anstalt Heat sink assemblies for mounting one or more electric circuits
US4154493A (en) * 1978-02-06 1979-05-15 The Birtcher Corporation Electrical apparatus housing assembly
EP0038652A3 (en) * 1980-04-21 1982-07-14 Vero Electronics Limited Electrical bonding of metal components
US4429937A (en) * 1981-07-22 1984-02-07 The Babcock & Wilcox Company Circuit board module mounting unit
GB2213328B (en) * 1987-12-03 1991-12-11 Loh Kg Rittal Werk Earthing device
DE4110800C1 (cs) * 1991-04-04 1992-07-23 Schroff Gmbh, 7541 Straubenhardt, De
DE4126576A1 (de) * 1991-05-03 1993-02-18 Licentia Gmbh Baugruppentraeger
US5373101A (en) * 1991-05-03 1994-12-13 Motorola, Inc. Electrical interconnect apparatus
DE9106954U1 (cs) * 1991-06-06 1991-10-10 Siemens Ag, 8000 Muenchen, De
US5386346A (en) * 1991-08-29 1995-01-31 Hubbell Incorporated Circuit card assembly with shielding assembly for reducing EMI emissions
DE4139473C1 (cs) * 1991-11-29 1993-04-01 Bicc-Vero Electronics Gmbh, 2800 Bremen, De
DE4237447A1 (de) * 1992-11-06 1994-05-11 Licentia Gmbh Baugruppenträger
DE4311246C1 (de) * 1993-04-06 1994-03-31 Schroff Gmbh Gehäuse für elektronische Geräte
DE4340934C2 (de) * 1993-12-01 1996-10-17 Loh Kg Rittal Werk Verfahren zum Aufbau eines Schaltschrankes und zum Einbau von Einbauten
US5539149A (en) * 1994-07-28 1996-07-23 Motorola, Inc. Radio frequency interference gasket
DE29602426U1 (de) * 1996-02-12 1996-04-04 Knuerr Mechanik Ag Gehäuse für elektrische und elektronische Bauelemente, Baugruppen und/oder Baugruppenträger
DE19644414C1 (de) * 1996-10-25 1997-08-28 Schroff Gmbh Abgeschirmter Baugruppenträger

Also Published As

Publication number Publication date
JP2875799B2 (ja) 1999-03-31
EP0838987A3 (en) 1998-06-10
US6134119A (en) 2000-10-17
AU702195B2 (en) 1999-02-18
KR100286395B1 (ko) 2001-04-16
CZ285954B6 (cs) 1999-12-15
DE19644420C1 (de) 1997-08-28
MY132644A (en) 2007-10-31
AU4285297A (en) 1998-05-07
TW379521B (en) 2000-01-11
PL322801A1 (en) 1998-04-27
JPH10135665A (ja) 1998-05-22
KR19980033116A (ko) 1998-07-25
EP0838987B1 (de) 1999-12-01
EP0838987A2 (de) 1998-04-29
PL183733B1 (pl) 2002-07-31
CZ341797A3 (cs) 1998-05-13
CA2218571A1 (en) 1998-04-25
CA2218571C (en) 2001-07-31

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