HUE056047T2 - Fém/kerámia szubsztrát és annak gyártási eljárása - Google Patents

Fém/kerámia szubsztrát és annak gyártási eljárása

Info

Publication number
HUE056047T2
HUE056047T2 HUE19706539A HUE19706539A HUE056047T2 HU E056047 T2 HUE056047 T2 HU E056047T2 HU E19706539 A HUE19706539 A HU E19706539A HU E19706539 A HUE19706539 A HU E19706539A HU E056047 T2 HUE056047 T2 HU E056047T2
Authority
HU
Hungary
Prior art keywords
manufacturing
metal
ceramic substrate
ceramic
substrate
Prior art date
Application number
HUE19706539A
Other languages
English (en)
Inventor
Andreas Meyer
Stefan Britting
Original Assignee
Rogers Germany Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=65516582&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HUE056047(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rogers Germany Gmbh filed Critical Rogers Germany Gmbh
Publication of HUE056047T2 publication Critical patent/HUE056047T2/hu

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127—The active component for bonding being a refractory metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/348—Zirconia, hafnia, zirconates or hafnates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/365—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/58—Forming a gradient in composition or in properties across the laminate or the joined articles
    • C04B2237/588—Forming a gradient in composition or in properties across the laminate or the joined articles by joining layers or articles of the same composition but having different particle or grain sizes
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HUE19706539A 2018-02-28 2019-02-18 Fém/kerámia szubsztrát és annak gyártási eljárása HUE056047T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018104521.2A DE102018104521B4 (de) 2018-02-28 2018-02-28 Metall-Keramik-Substrate

Publications (1)

Publication Number Publication Date
HUE056047T2 true HUE056047T2 (hu) 2022-01-28

Family

ID=65516582

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE19706539A HUE056047T2 (hu) 2018-02-28 2019-02-18 Fém/kerámia szubsztrát és annak gyártási eljárása

Country Status (8)

Country Link
US (1) US11807584B2 (hu)
EP (2) EP3714485B1 (hu)
JP (1) JP7033660B2 (hu)
KR (1) KR102396988B1 (hu)
CN (1) CN111801791A (hu)
DE (1) DE102018104521B4 (hu)
HU (1) HUE056047T2 (hu)
WO (1) WO2019166259A1 (hu)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019135146B4 (de) * 2019-12-19 2022-11-24 Rogers Germany Gmbh Metall-Keramik-Substrat
DE102020127167B4 (de) * 2020-10-15 2022-08-18 Rogers Germany Gmbh Leiterplatte und Verfahren zur Herstellung eines als Einsatz vorgesehenen Metall-Keramik-Substrats für eine solche Leiterplatte
DE102021132945A1 (de) * 2021-12-14 2023-06-15 Rogers Germany Gmbh Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines solchen Trägersubstrats
DE102022106953A1 (de) * 2022-03-24 2023-09-28 Rogers Germany Gmbh Leiterplatte, Metall-Keramik-Substrat als Einsatz und Verfahren zur Herstellung einer Leiterplatte

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766634A (en) 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3744120A (en) 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
JPS55132048A (en) 1979-04-03 1980-10-14 Toshiba Corp Semiconductor device
EP0789397B1 (en) 1996-02-07 2004-05-06 Hitachi, Ltd. Circuit board and semiconductor device using the circuit board
EP0922682A1 (en) * 1997-12-12 1999-06-16 FINMECCANICA S.p.A. AZIENDA ANSALDO Method of forming a joint between a ceramic substrate and a metal component
US6320754B1 (en) 1999-08-06 2001-11-20 Agilent Technologies, Inc. Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package
JP2003168770A (ja) * 2001-12-04 2003-06-13 Toshiba Corp 窒化ケイ素回路基板
JP3770849B2 (ja) * 2002-03-28 2006-04-26 電気化学工業株式会社 接合体の製造方法
JP4270140B2 (ja) * 2005-02-17 2009-05-27 日立金属株式会社 窒化珪素回路基板およびそれを用いた半導体モジュール
JP5413707B2 (ja) 2005-06-06 2014-02-12 Ｄｏｗａエレクトロニクス株式会社 金属−セラミック複合基板及びその製造方法
US8563869B2 (en) 2005-08-29 2013-10-22 Hitachi Metals, Ltd. Circuit board and semiconductor module using this, production method for circuit board
DE102007030389B4 (de) 2007-03-30 2015-08-13 Rogers Germany Gmbh Moduleinheit mit einer Wärmesenke
US9586382B2 (en) 2008-01-24 2017-03-07 National Taiwan University Ceramic/metal composite structure
DE102010024520B4 (de) * 2010-06-21 2017-08-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erhöhung der thermo-mechanischen Beständigkeit eines Metall-Keramik-Substrats
JP5218621B2 (ja) 2011-10-28 2013-06-26 日立金属株式会社 回路基板およびこれを用いた半導体モジュール
JP6154383B2 (ja) * 2012-08-23 2017-07-05 日産自動車株式会社 絶縁基板、多層セラミック絶縁基板、パワー半導体装置と絶縁基板の接合構造体、及びパワー半導体モジュール
DE102014105000B4 (de) 2014-04-08 2021-02-25 Infineon Technologies Ag Verfahren zur Herstellung und zum Bestücken eines Schaltungsträgers
DE102014220650A1 (de) 2014-10-13 2016-04-14 Heraeus Deutschland GmbH & Co. KG Optimiertes Leiterbahndesign von metallischen Materialien auf keramischen Substanzen
JP6170486B2 (ja) * 2014-12-05 2017-07-26 デンカ株式会社 セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール
CN107207366B (zh) 2015-01-23 2020-11-24 株式会社东芝 高热导性氮化硅烧结体、使用了其的氮化硅基板及氮化硅电路基板以及半导体装置
KR101643748B1 (ko) 2015-08-13 2016-07-29 충남대학교산학협력단 결핵 진단용 바이오마커 마이크로 rna
US10160690B2 (en) 2015-09-28 2018-12-25 Kabushiki Kaisha Toshiba Silicon nitride circuit board and semiconductor module using the same
WO2017095884A1 (en) 2015-12-01 2017-06-08 Materion Corporation Metal-on-ceramic substrates
EP3407379A4 (en) * 2016-01-22 2019-10-09 Toppan Printing Co., Ltd. SUBSTRATE FOR PACKAGING AND METHOD FOR PRODUCING THE SAID SUBSTRATE
JP2017224656A (ja) * 2016-06-13 2017-12-21 Ｎｇｋエレクトロデバイス株式会社 金属−セラミックス複合基板および半導体装置
JP7211949B2 (ja) * 2017-08-04 2023-01-24 デンカ株式会社 セラミックス回路基板

Also Published As

Publication number Publication date
EP3714485B1 (de) 2021-06-23
CN111801791A (zh) 2020-10-20
KR102396988B1 (ko) 2022-05-13
EP3905319A1 (de) 2021-11-03
JP7033660B2 (ja) 2022-03-10
EP3714485A1 (de) 2020-09-30
JP2021509542A (ja) 2021-03-25
KR20200116121A (ko) 2020-10-08
US11807584B2 (en) 2023-11-07
WO2019166259A1 (de) 2019-09-06
DE102018104521A1 (de) 2019-08-29
US20210188719A1 (en) 2021-06-24
DE102018104521B4 (de) 2022-11-17

Similar Documents

Publication Publication Date Title
EP3352198A4 (en) SIC COMPOSITE SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
EP3474643A4 (en) CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR
EP3647299A4 (en) MULTI-LAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF
EP3441506A4 (en) POLYCRYSTALLINE SIC SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
SG11202004253QA (en) Oil-and-fat composition and manufacturing method thereof
HUE056047T2 (hu) Fém/kerámia szubsztrát és annak gyártási eljárása
EP3573088A4 (en) COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE COMPOSITE SUBSTRATE
EP3633807A4 (en) LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD OF LIGHT EMITTING ELEMENT
EP3869557A4 (en) LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURE THEREOF
EP3439442A4 (en) CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR
EP3648266A4 (en) LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
SG11202103709VA (en) Semiconductor structure and method of forming the same
EP3748701A4 (en) LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURE THEREOF
EP3828318A4 (en) SIC WAFER AND SIC WAFER MANUFACTURING METHOD
EP3590361A4 (en) COMPOSITION CONTAINING LUTEOLIN AND ITS MANUFACTURING PROCESS
GB2552312B (en) Ceramic objects and methods for manufacturing the same
EP3675604A4 (en) METHOD OF MANUFACTURING A CERAMIC SUBSTRATE AND A CERAMIC SUBSTRATE
EP3608956A4 (en) INTEGRATED SUBSTRATE AND MANUFACTURING METHOD THEREOF
EP3852507A4 (en) ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT
EP3738940A4 (en) MORTAR AND METHOD FOR MANUFACTURING THEREOF
EP3682975A4 (en) ELECTRONIC COMPONENT OR PRECURSORS THEREOF AND PROCESS FOR ITS MANUFACTURING
EP3595021A4 (en) SEMICONDUCTOR ELECTROLUMINESCENT ELEMENT AND PROCESS FOR MANUFACTURING A SEMICONDUCTOR ELECTROLUMINESCENT ELEMENT
EP3367764A4 (en) MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
EP3522208A4 (en) SUBSTRATE PLACEMENT STAGE, AND METHOD FOR MANUFACTURING SUBSTRATE PLACEMENT STAGE
EP3799965A4 (en) METALLIZED CERAMIC SUBSTRATE AND METHOD OF PRODUCTION THEREOF