EP3675604A4 - Method for producing ceramic substrate, and ceramic substrate - Google Patents
Method for producing ceramic substrate, and ceramic substrate Download PDFInfo
- Publication number
- EP3675604A4 EP3675604A4 EP18848939.7A EP18848939A EP3675604A4 EP 3675604 A4 EP3675604 A4 EP 3675604A4 EP 18848939 A EP18848939 A EP 18848939A EP 3675604 A4 EP3675604 A4 EP 3675604A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- ceramic substrate
- producing
- producing ceramic
- substrate
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title 2
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20170107002 | 2017-08-24 | ||
PCT/KR2018/009722 WO2019039883A1 (en) | 2017-08-24 | 2018-08-23 | Method for producing ceramic substrate, and ceramic substrate |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3675604A1 EP3675604A1 (en) | 2020-07-01 |
EP3675604A4 true EP3675604A4 (en) | 2020-10-07 |
EP3675604B1 EP3675604B1 (en) | 2023-02-22 |
Family
ID=65761682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18848939.7A Active EP3675604B1 (en) | 2017-08-24 | 2018-08-23 | Method for producing ceramic substrate, and ceramic substrate |
Country Status (5)
Country | Link |
---|---|
US (1) | US11355355B2 (en) |
EP (1) | EP3675604B1 (en) |
KR (1) | KR20190022383A (en) |
CN (1) | CN110945971B (en) |
WO (1) | WO2019039883A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200127511A (en) * | 2019-05-02 | 2020-11-11 | 주식회사 아모센스 | Ceramic substrate and manufacturing method for the same |
WO2021095843A1 (en) * | 2019-11-15 | 2021-05-20 | デンカ株式会社 | Ceramic substrate, composite substrate, circuit board, method for producing ceramic substrate, method for producing composite substrate, method for producing circuit board, and method for producing plurality of circuit boards |
US11582866B1 (en) * | 2021-07-22 | 2023-02-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems including a power device-embedded PCB directly joined with a cooling assembly and method of forming the same |
CN116504683B (en) * | 2023-06-25 | 2023-08-25 | 江苏富乐华半导体科技股份有限公司 | Method for controlling warpage of copper DBC (copper-nickel) product |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786703A (en) * | 1993-09-10 | 1995-03-31 | Toshiba Corp | Ceramic circuit board |
EP0670667A1 (en) * | 1994-02-24 | 1995-09-06 | Plessey Semiconductors Limited | Direct copper bonded substrates |
EP1345480A2 (en) * | 2002-03-15 | 2003-09-17 | Dowa Mining Co., Ltd. | Ceramic circuit board and power module |
US20130186677A1 (en) * | 2008-09-08 | 2013-07-25 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4839461B2 (en) * | 2001-02-23 | 2011-12-21 | Dowaメタルテック株式会社 | Method for manufacturing aluminum oxide circuit board |
JP4969738B2 (en) * | 2001-06-28 | 2012-07-04 | 株式会社東芝 | Ceramic circuit board and semiconductor module using the same |
JP2004207587A (en) | 2002-12-26 | 2004-07-22 | Dowa Mining Co Ltd | Metal-ceramics bonding substrate and its manufacturing method |
KR100731604B1 (en) | 2006-06-16 | 2007-06-22 | 삼성전기주식회사 | Method for manufacturing printed circuit board with high stiffness |
JP2008235852A (en) * | 2007-02-23 | 2008-10-02 | Hitachi Metals Ltd | Ceramic substrate and semiconductor module using the same |
KR101053141B1 (en) | 2009-06-08 | 2011-08-02 | 서울과학기술대학교 산학협력단 | Dummy pattern design method to suppress warpage of printed circuit board |
JP5047315B2 (en) * | 2010-01-26 | 2012-10-10 | 株式会社東芝 | Ceramic circuit board |
JP5522263B2 (en) * | 2010-09-28 | 2014-06-18 | 株式会社村田製作所 | Piezoelectric device and method for manufacturing piezoelectric device |
JP5821389B2 (en) * | 2011-04-20 | 2015-11-24 | 三菱マテリアル株式会社 | Power module substrate manufacturing method and power module substrate |
JP5725178B2 (en) * | 2011-06-30 | 2015-05-27 | 日立金属株式会社 | Brazing material, brazing material paste, ceramic circuit board, ceramic master circuit board and power semiconductor module |
-
2018
- 2018-08-23 US US16/630,073 patent/US11355355B2/en active Active
- 2018-08-23 KR KR1020180098396A patent/KR20190022383A/en not_active IP Right Cessation
- 2018-08-23 WO PCT/KR2018/009722 patent/WO2019039883A1/en unknown
- 2018-08-23 CN CN201880048669.4A patent/CN110945971B/en active Active
- 2018-08-23 EP EP18848939.7A patent/EP3675604B1/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786703A (en) * | 1993-09-10 | 1995-03-31 | Toshiba Corp | Ceramic circuit board |
EP0670667A1 (en) * | 1994-02-24 | 1995-09-06 | Plessey Semiconductors Limited | Direct copper bonded substrates |
EP1345480A2 (en) * | 2002-03-15 | 2003-09-17 | Dowa Mining Co., Ltd. | Ceramic circuit board and power module |
US20130186677A1 (en) * | 2008-09-08 | 2013-07-25 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
US20200357660A1 (en) | 2020-11-12 |
EP3675604B1 (en) | 2023-02-22 |
CN110945971B (en) | 2023-09-26 |
CN110945971A (en) | 2020-03-31 |
EP3675604A1 (en) | 2020-07-01 |
WO2019039883A1 (en) | 2019-02-28 |
US11355355B2 (en) | 2022-06-07 |
KR20190022383A (en) | 2019-03-06 |
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