HU224359B1 - Forrasztóberendezés - Google Patents
Forrasztóberendezés Download PDFInfo
- Publication number
- HU224359B1 HU224359B1 HU0004090A HUP0004090A HU224359B1 HU 224359 B1 HU224359 B1 HU 224359B1 HU 0004090 A HU0004090 A HU 0004090A HU P0004090 A HUP0004090 A HU P0004090A HU 224359 B1 HU224359 B1 HU 224359B1
- Authority
- HU
- Hungary
- Prior art keywords
- gas
- soldering
- decontamination chamber
- soldering device
- flat building
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 49
- 238000009826 distribution Methods 0.000 claims abstract description 27
- 238000006073 displacement reaction Methods 0.000 claims abstract description 22
- 238000005202 decontamination Methods 0.000 claims description 72
- 230000003588 decontaminative effect Effects 0.000 claims description 72
- 210000000056 organ Anatomy 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 230000001590 oxidative effect Effects 0.000 abstract description 6
- 238000010276 construction Methods 0.000 abstract description 5
- 230000000712 assembly Effects 0.000 abstract description 4
- 238000000429 assembly Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 130
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000006199 nebulizer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Pipeline Systems (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Sampling And Sample Adjustment (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19749185A DE19749185A1 (de) | 1997-11-07 | 1997-11-07 | Mit einer Gasversorgung verbindbare Gasverteilung |
| PCT/EP1998/006964 WO1999024209A1 (de) | 1997-11-07 | 1998-11-03 | Mit einer gasversorgung verbindbare gasverteilung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| HUP0004090A2 HUP0004090A2 (en) | 2001-03-28 |
| HUP0004090A3 HUP0004090A3 (en) | 2002-01-28 |
| HU224359B1 true HU224359B1 (hu) | 2005-08-29 |
Family
ID=7847890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HU0004090A HU224359B1 (hu) | 1997-11-07 | 1998-11-03 | Forrasztóberendezés |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6378753B1 (cs) |
| EP (1) | EP1035939B1 (cs) |
| AT (1) | ATE240814T1 (cs) |
| BR (1) | BR9814113A (cs) |
| CA (1) | CA2308345C (cs) |
| CZ (1) | CZ300348B6 (cs) |
| DE (2) | DE19749185A1 (cs) |
| HU (1) | HU224359B1 (cs) |
| WO (1) | WO1999024209A1 (cs) |
| ZA (1) | ZA9810131B (cs) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002080950A (ja) * | 2000-09-07 | 2002-03-22 | Senju Metal Ind Co Ltd | ドロスから酸化物を分離する方法および噴流はんだ槽 |
| FR2847030B1 (fr) * | 2002-11-08 | 2005-12-02 | Air Liquide | Procede de sechage de matieres humides, notamment de boues, sans risque d'explosion |
| DE102005052076B4 (de) * | 2005-10-28 | 2007-09-20 | Messer Group Gmbh | Lötvorrichtung mit Gasverteilung |
| DE502007006711D1 (de) * | 2006-05-23 | 2011-04-28 | Linde Ag | Vorrichtung und Verfahren zum Wellenlöten |
| US8104662B2 (en) * | 2009-07-24 | 2012-01-31 | Flextronics Ap Llc | Inert environment enclosure |
| CN103212761B (zh) * | 2012-06-26 | 2015-05-06 | 深圳市堃琦鑫华股份有限公司 | 一种焊接方法 |
| DE102014018165B3 (de) * | 2014-12-09 | 2016-01-07 | Messer Austria Gmbh | Lötvorrichtung mit Gasverteilung |
| JP7695522B2 (ja) * | 2021-05-11 | 2025-06-19 | 澁谷工業株式会社 | ボンディング装置 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3064754D1 (en) * | 1979-07-09 | 1983-10-13 | Electrovert Ltd | Method and apparatus for vapour phase soldering |
| GB8324231D0 (en) * | 1983-09-09 | 1983-10-12 | Dolphin Machinery | Soldering apparatus |
| GB8824114D0 (en) * | 1988-10-14 | 1988-11-23 | Holden J | Vaporiser nozzle |
| JP2820261B2 (ja) * | 1989-03-02 | 1998-11-05 | 株式会社タムラ製作所 | 噴流式はんだ付け装置 |
| US5044542A (en) * | 1989-11-22 | 1991-09-03 | Electrovert Ltd. | Shield gas wave soldering |
| US5090651A (en) * | 1990-01-31 | 1992-02-25 | Electrovert Ltd. | Gas curtain additives and zoned tunnel for soldering |
| US5228614A (en) * | 1990-07-09 | 1993-07-20 | Electrovert Ltd. | Solder nozzle with gas knife jet |
| FR2670986B1 (fr) * | 1990-12-20 | 1996-08-02 | Air Liquide | Dispositif d'inertage de bain de soudure d'une machine de soudage a la vague. |
| US5176307A (en) * | 1991-02-22 | 1993-01-05 | Praxair Technology, Inc. | Wave soldering in a protective atmosphere enclosure over a solder pot |
| NL9101383A (nl) * | 1991-08-13 | 1993-03-01 | Soltec Bv | Soldeerinrichting met deken van zuurstofarm gas. |
| US5397049A (en) * | 1991-12-06 | 1995-03-14 | Electrovert Ltd. | Gas shrouded solder wave with reduced solder splatter |
| DE4219913A1 (de) * | 1992-06-17 | 1993-12-23 | Linde Ag | Schutzgas-Lötanlage mit spezieller Lötkammer |
| US5345061A (en) * | 1992-09-15 | 1994-09-06 | Vitronics Corporation | Convection/infrared solder reflow apparatus utilizing controlled gas flow |
| US5440101A (en) * | 1993-04-19 | 1995-08-08 | Research, Incorporated | Continuous oven with a plurality of heating zones |
| US5297724A (en) * | 1993-05-26 | 1994-03-29 | The Boc Group, Inc. | Wave soldering method and apparatus |
| US5568894A (en) * | 1993-06-04 | 1996-10-29 | Electrovert Ltd. | Applying flux to a solder wave for wave soldering an element |
| FR2713952B1 (fr) * | 1993-12-22 | 1996-01-12 | Air Liquide | Dispositif et procédé d'injection de gaz pour la formation d'une atmosphère contrôlée dans un espace confiné. |
| US5409159A (en) * | 1994-02-28 | 1995-04-25 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and methods for inerting solder during wave soldering operations |
| US5520320A (en) * | 1994-04-22 | 1996-05-28 | Air Liquide America Corporation | Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere |
| US5509598A (en) * | 1994-05-31 | 1996-04-23 | The Boc Group, Inc. | Wave soldering apparatus and process |
| US5593499A (en) * | 1994-12-30 | 1997-01-14 | Photocircuits Corporation | Dual air knife for hot air solder levelling |
| FR2735053B1 (fr) * | 1995-06-09 | 1997-07-25 | Air Liquide | Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche |
| DE19606850A1 (de) * | 1996-02-23 | 1997-08-28 | Linde Ag | Vorrichtung zum Wellenlöten |
| FR2748410B1 (fr) * | 1996-05-07 | 1998-06-05 | Air Liquide | Procede et machine de brasage ou etamage a la vague |
-
1997
- 1997-11-07 DE DE19749185A patent/DE19749185A1/de not_active Ceased
-
1998
- 1998-11-03 CZ CZ20001650A patent/CZ300348B6/cs not_active IP Right Cessation
- 1998-11-03 US US09/530,904 patent/US6378753B1/en not_active Expired - Lifetime
- 1998-11-03 CA CA002308345A patent/CA2308345C/en not_active Expired - Lifetime
- 1998-11-03 HU HU0004090A patent/HU224359B1/hu not_active IP Right Cessation
- 1998-11-03 WO PCT/EP1998/006964 patent/WO1999024209A1/de not_active Ceased
- 1998-11-03 BR BR9814113-9A patent/BR9814113A/pt not_active IP Right Cessation
- 1998-11-03 AT AT98962316T patent/ATE240814T1/de not_active IP Right Cessation
- 1998-11-03 EP EP98962316A patent/EP1035939B1/de not_active Expired - Lifetime
- 1998-11-03 DE DE59808494T patent/DE59808494D1/de not_active Expired - Lifetime
- 1998-11-05 ZA ZA9810131A patent/ZA9810131B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA2308345A1 (en) | 1999-05-20 |
| DE59808494D1 (de) | 2003-06-26 |
| HUP0004090A3 (en) | 2002-01-28 |
| US6378753B1 (en) | 2002-04-30 |
| EP1035939A1 (de) | 2000-09-20 |
| CA2308345C (en) | 2006-08-22 |
| CZ300348B6 (cs) | 2009-04-29 |
| HUP0004090A2 (en) | 2001-03-28 |
| DE19749185A1 (de) | 1999-05-12 |
| EP1035939B1 (de) | 2003-05-21 |
| BR9814113A (pt) | 2000-10-03 |
| ATE240814T1 (de) | 2003-06-15 |
| WO1999024209A1 (de) | 1999-05-20 |
| ZA9810131B (en) | 1999-05-05 |
| CZ20001650A3 (cs) | 2001-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| HFG4 | Patent granted, date of granting |
Effective date: 20050718 |
|
| MM4A | Lapse of definitive patent protection due to non-payment of fees |