ZA9810131B - Gas distribution system which can be connected to a gas supply - Google Patents

Gas distribution system which can be connected to a gas supply

Info

Publication number
ZA9810131B
ZA9810131B ZA9810131A ZA9810131A ZA9810131B ZA 9810131 B ZA9810131 B ZA 9810131B ZA 9810131 A ZA9810131 A ZA 9810131A ZA 9810131 A ZA9810131 A ZA 9810131A ZA 9810131 B ZA9810131 B ZA 9810131B
Authority
ZA
South Africa
Prior art keywords
gas
distribution system
gas distribution
shroud
transported
Prior art date
Application number
ZA9810131A
Other languages
English (en)
Inventor
Ralph Schellen
Jens Tauchmann
Original Assignee
Messer Griesheim Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Messer Griesheim Gmbh filed Critical Messer Griesheim Gmbh
Publication of ZA9810131B publication Critical patent/ZA9810131B/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Die Bonding (AREA)
  • Pipeline Systems (AREA)
ZA9810131A 1997-11-07 1998-11-05 Gas distribution system which can be connected to a gas supply ZA9810131B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19749185A DE19749185A1 (de) 1997-11-07 1997-11-07 Mit einer Gasversorgung verbindbare Gasverteilung

Publications (1)

Publication Number Publication Date
ZA9810131B true ZA9810131B (en) 1999-05-05

Family

ID=7847890

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA9810131A ZA9810131B (en) 1997-11-07 1998-11-05 Gas distribution system which can be connected to a gas supply

Country Status (10)

Country Link
US (1) US6378753B1 (cs)
EP (1) EP1035939B1 (cs)
AT (1) ATE240814T1 (cs)
BR (1) BR9814113A (cs)
CA (1) CA2308345C (cs)
CZ (1) CZ300348B6 (cs)
DE (2) DE19749185A1 (cs)
HU (1) HU224359B1 (cs)
WO (1) WO1999024209A1 (cs)
ZA (1) ZA9810131B (cs)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002080950A (ja) * 2000-09-07 2002-03-22 Senju Metal Ind Co Ltd ドロスから酸化物を分離する方法および噴流はんだ槽
FR2847030B1 (fr) * 2002-11-08 2005-12-02 Air Liquide Procede de sechage de matieres humides, notamment de boues, sans risque d'explosion
DE102005052076B4 (de) * 2005-10-28 2007-09-20 Messer Group Gmbh Lötvorrichtung mit Gasverteilung
ATE501805T1 (de) * 2006-05-23 2011-04-15 Linde Ag Vorrichtung und verfahren zum wellenlöten
US8104662B2 (en) * 2009-07-24 2012-01-31 Flextronics Ap Llc Inert environment enclosure
CN103212761B (zh) * 2012-06-26 2015-05-06 深圳市堃琦鑫华股份有限公司 一种焊接方法
DE102014018165B3 (de) * 2014-12-09 2016-01-07 Messer Austria Gmbh Lötvorrichtung mit Gasverteilung
JP7695522B2 (ja) * 2021-05-11 2025-06-19 澁谷工業株式会社 ボンディング装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4321031A (en) * 1979-07-09 1982-03-23 Woodgate Ralph W Method and apparatus for condensation heating
GB8324231D0 (en) * 1983-09-09 1983-10-12 Dolphin Machinery Soldering apparatus
GB8824114D0 (en) * 1988-10-14 1988-11-23 Holden J Vaporiser nozzle
JP2820261B2 (ja) * 1989-03-02 1998-11-05 株式会社タムラ製作所 噴流式はんだ付け装置
US5044542A (en) * 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
US5090651A (en) * 1990-01-31 1992-02-25 Electrovert Ltd. Gas curtain additives and zoned tunnel for soldering
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
FR2670986B1 (fr) * 1990-12-20 1996-08-02 Air Liquide Dispositif d'inertage de bain de soudure d'une machine de soudage a la vague.
US5176307A (en) * 1991-02-22 1993-01-05 Praxair Technology, Inc. Wave soldering in a protective atmosphere enclosure over a solder pot
NL9101383A (nl) * 1991-08-13 1993-03-01 Soltec Bv Soldeerinrichting met deken van zuurstofarm gas.
US5397049A (en) * 1991-12-06 1995-03-14 Electrovert Ltd. Gas shrouded solder wave with reduced solder splatter
DE4219913A1 (de) * 1992-06-17 1993-12-23 Linde Ag Schutzgas-Lötanlage mit spezieller Lötkammer
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
US5440101A (en) * 1993-04-19 1995-08-08 Research, Incorporated Continuous oven with a plurality of heating zones
US5297724A (en) * 1993-05-26 1994-03-29 The Boc Group, Inc. Wave soldering method and apparatus
US5568894A (en) * 1993-06-04 1996-10-29 Electrovert Ltd. Applying flux to a solder wave for wave soldering an element
FR2713952B1 (fr) * 1993-12-22 1996-01-12 Air Liquide Dispositif et procédé d'injection de gaz pour la formation d'une atmosphère contrôlée dans un espace confiné.
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
US5520320A (en) * 1994-04-22 1996-05-28 Air Liquide America Corporation Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere
US5509598A (en) * 1994-05-31 1996-04-23 The Boc Group, Inc. Wave soldering apparatus and process
US5593499A (en) * 1994-12-30 1997-01-14 Photocircuits Corporation Dual air knife for hot air solder levelling
FR2735053B1 (fr) * 1995-06-09 1997-07-25 Air Liquide Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche
DE19606850A1 (de) * 1996-02-23 1997-08-28 Linde Ag Vorrichtung zum Wellenlöten
FR2748410B1 (fr) * 1996-05-07 1998-06-05 Air Liquide Procede et machine de brasage ou etamage a la vague

Also Published As

Publication number Publication date
CA2308345A1 (en) 1999-05-20
HU224359B1 (hu) 2005-08-29
EP1035939B1 (de) 2003-05-21
DE59808494D1 (de) 2003-06-26
WO1999024209A1 (de) 1999-05-20
EP1035939A1 (de) 2000-09-20
CA2308345C (en) 2006-08-22
DE19749185A1 (de) 1999-05-12
CZ300348B6 (cs) 2009-04-29
ATE240814T1 (de) 2003-06-15
US6378753B1 (en) 2002-04-30
CZ20001650A3 (cs) 2001-03-14
HUP0004090A2 (en) 2001-03-28
BR9814113A (pt) 2000-10-03
HUP0004090A3 (en) 2002-01-28

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