HK43586A - Semiconductor integrated circuit device and fabrication method thereof - Google Patents

Semiconductor integrated circuit device and fabrication method thereof

Info

Publication number
HK43586A
HK43586A HK435/86A HK43586A HK43586A HK 43586 A HK43586 A HK 43586A HK 435/86 A HK435/86 A HK 435/86A HK 43586 A HK43586 A HK 43586A HK 43586 A HK43586 A HK 43586A
Authority
HK
Hong Kong
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
fabrication method
fabrication
Prior art date
Application number
HK435/86A
Other languages
English (en)
Inventor
Akira Muramatsu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK43586A publication Critical patent/HK43586A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8222—Bipolar technology
    • H01L21/8228—Complementary devices, e.g. complementary transistors
    • H01L21/82285—Complementary vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
    • H01L27/0229—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of bipolar structures
    • H01L27/0233—Integrated injection logic structures [I2L]
    • H01L27/0244—I2L structures integrated in combination with analog structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
    • H01L27/0823—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
    • H01L27/0828—Combination of direct and inverse vertical transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Element Separation (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
HK435/86A 1980-12-01 1986-06-09 Semiconductor integrated circuit device and fabrication method thereof HK43586A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55168044A JPS5792858A (en) 1980-12-01 1980-12-01 Semiconductor integrated circuit device and manufacture thereof

Publications (1)

Publication Number Publication Date
HK43586A true HK43586A (en) 1986-06-20

Family

ID=15860776

Family Applications (1)

Application Number Title Priority Date Filing Date
HK435/86A HK43586A (en) 1980-12-01 1986-06-09 Semiconductor integrated circuit device and fabrication method thereof

Country Status (8)

Country Link
US (1) US4502201A (xx)
JP (1) JPS5792858A (xx)
DE (1) DE3146779A1 (xx)
FR (1) FR2495379A1 (xx)
GB (1) GB2088627B (xx)
HK (1) HK43586A (xx)
IT (1) IT1139738B (xx)
MY (1) MY8600603A (xx)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210283A (ja) * 1982-05-31 1983-12-07 トステム株式会社 連段窓改装における旧窓枠除去方法
JPS58210281A (ja) * 1982-05-31 1983-12-07 トステム株式会社 連段窓改装における旧窓枠除去方法
US4797372A (en) * 1985-11-01 1989-01-10 Texas Instruments Incorporated Method of making a merge bipolar and complementary metal oxide semiconductor transistor device
US5023690A (en) * 1986-10-24 1991-06-11 Texas Instruments Incorporated Merged bipolar and complementary metal oxide semiconductor transistor device
EP0309788A1 (de) * 1987-09-30 1989-04-05 Siemens Aktiengesellschaft Verfahren zur Erzeugung eines versenkten Oxids
JP2005116973A (ja) * 2003-10-10 2005-04-28 Seiko Epson Corp 半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3962717A (en) * 1974-10-29 1976-06-08 Fairchild Camera And Instrument Corporation Oxide isolated integrated injection logic with selective guard ring
DE2455347A1 (de) * 1974-11-22 1976-05-26 Itt Ind Gmbh Deutsche Monolithisch integrierte festkoerperschaltung und herstellungsverfahren
FR2352403A1 (fr) * 1976-05-20 1977-12-16 Comp Generale Electricite Circuit integre rapide
US4157268A (en) * 1977-06-16 1979-06-05 International Business Machines Corporation Localized oxidation enhancement for an integrated injection logic circuit
DE2835632A1 (de) * 1978-08-14 1980-02-28 Bosch Gmbh Robert Monolithisch integrierte schaltung und verfahren zu ihrer herstellung
DE3020609C2 (de) * 1979-05-31 1985-11-07 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Verfahren zum Herstellen einer integrierten Schaltung mit wenigstens einem I↑2↑L-Element
JPS5696852A (en) * 1979-12-29 1981-08-05 Fujitsu Ltd Semiconductor device
DE3029013A1 (de) * 1980-07-31 1982-02-25 Robert Bosch Gmbh, 7000 Stuttgart Hochintegrierte, monolithische halbleiterschaltung

Also Published As

Publication number Publication date
MY8600603A (en) 1986-12-31
GB2088627B (en) 1985-01-03
JPS5792858A (en) 1982-06-09
IT8125073A0 (it) 1981-11-13
GB2088627A (en) 1982-06-09
US4502201A (en) 1985-03-05
DE3146779A1 (de) 1982-09-09
IT1139738B (it) 1986-09-24
FR2495379A1 (fr) 1982-06-04

Similar Documents

Publication Publication Date Title
DE3162416D1 (en) Semiconductor integrated circuit device
GB2087183B (en) Semiconductor integrated circuit device
DE3379621D1 (en) Semiconductor integrated circuit device and a method for manufacturing the same
MY8700804A (en) A semiconductor integrated circuit device and method of manufacturing the same
DE3174468D1 (en) Semiconductor device and method of manufacturing the same
DE3277855D1 (en) Semiconductor integrated circuit device
EP0176010A3 (en) Integrated circuit fabrication process and device
EP0051488A3 (en) Semiconductor device and method for manufacturing the same
DE3278873D1 (en) Semiconductor integrated circuit device
JPS574126A (en) Method and device for positioning opaque mask with integrated circuit wafer
HK46186A (en) Semiconductor integrated circuit device
GB2088629B (en) Improvements in semiconductor integrated circuit devices
DE3071715D1 (en) Semiconductor integrated circuit and wiring method therefor
GB2089611B (en) Semiconductor integrated circuit device
SG41087G (en) Semiconductor integrated circuit devices and method of manufacturing the same
HK41890A (en) Semiconductor device and fabrication process thereof
MY8600560A (en) Semiconductor integrated circuit device
MY8600690A (en) Semiconductor integrated circuit device
DE3175780D1 (en) Semiconductor integrated circuit devices
HK73586A (en) A semiconductor integrated circuit device and a method of making the same
GB2088627B (en) Semiconductor integrated circuit device and fabrication method thereof
MY8600559A (en) Semiconductor integrated circuit device and fabrication method thereof
GB8502453D0 (en) Semiconductor integrated circuit device
DE3171445D1 (en) Semiconductor integrated circuit device
GB2087149B (en) Semiconductor integrated circuit and its manufacture