HK148995A - Hot-press head for connection of electrodes - Google Patents

Hot-press head for connection of electrodes Download PDF

Info

Publication number
HK148995A
HK148995A HK148995A HK148995A HK148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A
Authority
HK
Hong Kong
Prior art keywords
hot
pad
electrodes
press head
concavity
Prior art date
Application number
HK148995A
Other languages
English (en)
Inventor
Kawaguchi Toshiyuki
Original Assignee
Shin-Etsu Polymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Polymer Co Ltd filed Critical Shin-Etsu Polymer Co Ltd
Publication of HK148995A publication Critical patent/HK148995A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
  • Resistance Heating (AREA)
HK148995A 1988-05-24 1995-09-21 Hot-press head for connection of electrodes HK148995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988068285U JPH055675Y2 (enExample) 1988-05-24 1988-05-24

Publications (1)

Publication Number Publication Date
HK148995A true HK148995A (en) 1995-09-29

Family

ID=13369341

Family Applications (1)

Application Number Title Priority Date Filing Date
HK148995A HK148995A (en) 1988-05-24 1995-09-21 Hot-press head for connection of electrodes

Country Status (4)

Country Link
JP (1) JPH055675Y2 (enExample)
KR (1) KR950008482B1 (enExample)
GB (1) GB2218932B (enExample)
HK (1) HK148995A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3233195B2 (ja) * 1996-07-02 2001-11-26 信越ポリマー株式会社 半導体素子検査用ソケット
DE10352754B3 (de) * 2003-11-12 2005-06-30 Bachmann Kunststoff Technologien Gmbh Heiss-Pressvorrichtung mit einem Pressblech und mindestens einem elastischen Belag
JP2009188114A (ja) * 2008-02-05 2009-08-20 Three M Innovative Properties Co フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器
CN101870179B (zh) * 2010-05-26 2012-01-25 太原重工股份有限公司 一种炭素和电极压机的恒温压头
CN103200780A (zh) * 2012-01-09 2013-07-10 苏州世鼎电子有限公司 铜箔线路与罩体基板的热压贴合方法
JP5628460B1 (ja) * 2013-03-28 2014-11-19 東芝ホクト電子株式会社 発光装置、その製造方法、および発光装置使用装置
CN103538126A (zh) * 2013-10-22 2014-01-29 昆山市联昆热压板有限公司 一种改进型热压板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB565998A (en) * 1943-06-03 1944-12-07 British Tyre & Rubber Company Improvements in or relating to press tools
US3664902A (en) * 1970-01-09 1972-05-23 Bell Telephone Labor Inc Nonuniform pressure bonding method
JPS63114087A (ja) * 1986-10-29 1988-05-18 松下電器産業株式会社 熱圧着方法

Also Published As

Publication number Publication date
GB8910827D0 (en) 1989-06-28
KR950008482B1 (ko) 1995-07-31
KR890017073A (ko) 1989-12-15
GB2218932B (en) 1992-10-28
GB2218932A (en) 1989-11-29
JPH01170981U (enExample) 1989-12-04
JPH055675Y2 (enExample) 1993-02-15

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PF Patent in force
PE Patent expired

Effective date: 20090510