HK1255588B - 處理系統 - Google Patents

處理系統

Info

Publication number
HK1255588B
HK1255588B HK18114716.4A HK18114716A HK1255588B HK 1255588 B HK1255588 B HK 1255588B HK 18114716 A HK18114716 A HK 18114716A HK 1255588 B HK1255588 B HK 1255588B
Authority
HK
Hong Kong
Prior art keywords
processing system
processing
Prior art date
Application number
HK18114716.4A
Other languages
English (en)
Inventor
鬼頭義昭
加藤正紀
奈良圭
堀正和
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1255588B publication Critical patent/HK1255588B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00—Advancing webs
    • B65H20/30—Arrangements for accumulating surplus web
    • B65H20/32—Arrangements for accumulating surplus web by making loops
    • B65H20/34—Arrangements for accumulating surplus web by making loops with rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00—Advancing webs
    • B65H20/02—Advancing webs by friction roller
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00—Advancing webs
    • B65H20/24—Advancing webs by looping or like devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
    • B65H23/1888—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web and controlling web tension
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
    • B65H2511/10—Size; Dimensions
    • B65H2511/11—Length
    • B65H2511/112—Length of a loop, e.g. a free loop or a loop of dancer rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroluminescent Light Sources (AREA)
HK18114716.4A 2014-09-04 2017-05-29 處理系統 HK1255588B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014179887 2014-09-04

Publications (1)

Publication Number Publication Date
HK1255588B true HK1255588B (zh) 2020-06-12

Family

ID=55439899

Family Applications (2)

Application Number Title Priority Date Filing Date
HK18113921.7A HK1254829B (zh) 2014-09-04 2017-05-29 元件製造方法
HK18114716.4A HK1255588B (zh) 2014-09-04 2017-05-29 處理系統

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK18113921.7A HK1254829B (zh) 2014-09-04 2017-05-29 元件製造方法

Country Status (7)

Country Link
US (3) US10246287B2 (zh)
JP (3) JP6528775B2 (zh)
KR (4) KR102092155B1 (zh)
CN (7) CN110488576B (zh)
HK (2) HK1254829B (zh)
TW (4) TWI636344B (zh)
WO (1) WO2016035842A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10246287B2 (en) * 2014-09-04 2019-04-02 Nikon Corporation Processing system and device manufacturing method
KR102500771B1 (ko) * 2016-08-08 2023-02-17 가부시키가이샤 니콘 기판 처리 장치 및 기판 처리 방법
WO2019219966A1 (de) * 2018-05-18 2019-11-21 Gea Food Solutions Germany Gmbh Abrollen einer folienrolle in einer verpackungsmaschine
US10943791B2 (en) * 2018-10-31 2021-03-09 Taiwan Semiconductor Manufacturing Co., Ltd. Pattern formation method and method for manufacturing a semiconductor device
WO2022065048A1 (ja) * 2020-09-24 2022-03-31 株式会社ニコン パターン形成方法、電子デバイスの製造方法、及びパターン露光装置

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8520877U1 (de) * 1985-07-19 1985-09-05 Hoechst Ag, 6230 Frankfurt Wickelrolle zum Auf- und Abwickeln von Fotoresistmaterial
JPS6265046A (ja) * 1985-09-18 1987-03-24 Nitto Electric Ind Co Ltd 長尺基材用露光現像装置
CN1021931C (zh) * 1987-10-08 1993-08-25 米德公司 对准成象卷筒纸的方法和设备
JP2861530B2 (ja) * 1991-09-19 1999-02-24 日本電気株式会社 パターン形成方法
JP3094705B2 (ja) * 1992-11-30 2000-10-03 安藤電気株式会社 Ｉｃ搬送速度を制御するｉｃハンドラ
JP3183980B2 (ja) * 1993-01-28 2001-07-09 株式会社東芝 有機材料塗布装置
JP3340181B2 (ja) * 1993-04-20 2002-11-05 株式会社東芝 半導体の製造方法及びそのシステム
KR950034648A (ko) * 1994-05-25 1995-12-28 김광호 반도체장치의 제조방법
JP2000039696A (ja) * 1998-07-21 2000-02-08 Mitsubishi Paper Mills Ltd 感光材料処理装置
KR100811964B1 (ko) * 2000-09-28 2008-03-10 동경 엘렉트론 주식회사 레지스트 패턴 형성장치 및 그 방법
KR100375559B1 (ko) * 2001-07-03 2003-03-10 삼성전자주식회사 공정장치의 제어방법
EP1566699A3 (en) * 2004-02-23 2007-04-11 FUJIFILM Corporation Automatic development method of photosensitive lithographic printing plate and automatic development device thereof
JP4505242B2 (ja) * 2004-03-17 2010-07-21 富士フイルム株式会社 平版印刷方法
JP2006098725A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 描画位置の補正方法と、描画位置を補正可能な描画装置
CN100526992C (zh) * 2005-07-01 2009-08-12 株式会社尼康 曝光装置、曝光方法及设备制造方法
JP4536033B2 (ja) 2006-05-30 2010-09-01 三井金属鉱業株式会社 フレキシブルプリント配線基板の配線パターン検査方法および検査装置
JP4942174B2 (ja) * 2006-10-05 2012-05-30 東京エレクトロン株式会社 基板処理システムの処理レシピ最適化方法，基板処理システム，基板処理装置
JP4824723B2 (ja) * 2008-06-17 2011-11-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI480706B (zh) * 2008-10-15 2015-04-11 尼康股份有限公司 An exposure apparatus, a method of assembling the same, and a method of manufacturing the same
US8264666B2 (en) * 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device
JP5181100B2 (ja) * 2009-04-09 2013-04-10 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
JP4917652B2 (ja) * 2010-02-12 2012-04-18 東京エレクトロン株式会社 基板処理方法
JP5382456B2 (ja) * 2010-04-08 2014-01-08 株式会社ブイ・テクノロジー 露光方法及び露光装置
CN101943859B (zh) * 2010-07-13 2012-07-18 苏州苏大维格光电科技股份有限公司 一种卷对卷紫外纳米压印装置及方法
KR101896220B1 (ko) * 2011-04-25 2018-09-07 가부시키가이샤 니콘 기판처리장치
WO2013035696A1 (ja) * 2011-09-05 2013-03-14 株式会社ニコン 基板搬送装置及び基板処理装置
CN103477286A (zh) * 2011-09-07 2013-12-25 株式会社尼康 基板处理装置
WO2013059078A1 (en) * 2011-10-19 2013-04-25 Unipixel Displays, Inc. Photo-patterning using a translucent cylindrical master to form microscopic conductive lines on a flexible substrate
KR101623695B1 (ko) 2011-11-04 2016-05-23 가부시키가이샤 니콘 기판 처리 장치, 및 기판 처리 방법
JP5858734B2 (ja) * 2011-11-07 2016-02-10 株式会社カネカ 新規なフレキシブルプリント配線基板およびその作成方法
WO2013094286A1 (ja) * 2011-12-20 2013-06-27 株式会社ニコン 基板処理装置、デバイス製造システム、及びデバイス製造方法
TWI641915B (zh) * 2012-01-12 2018-11-21 尼康股份有限公司 基板處理裝置、基板處理方法、及圓筒狀光罩
JP6167541B2 (ja) * 2012-02-15 2017-07-26 パナソニックＩｐマネジメント株式会社 コンテンツデータ処理装置、及びコンテンツデータ処理方法
JP6206398B2 (ja) 2012-03-15 2017-10-04 株式会社ニコン マスクユニット、基板処理装置及びマスクユニット製造方法並びに基板処理方法
US9090095B2 (en) * 2012-06-04 2015-07-28 Micronic Mydata AB Optical writer for flexible foils
US8740061B2 (en) * 2012-07-06 2014-06-03 Hewlett-Packard Development Company, L.P. Recording information for a web manufacturing process
WO2014024594A1 (ja) * 2012-08-06 2014-02-13 株式会社ニコン 処理装置およびデバイス製造方法
CN104583874B (zh) * 2012-08-28 2017-11-03 株式会社尼康 衬底支承装置及曝光装置
TWI461120B (zh) * 2012-10-30 2014-11-11 Far Eastern New Century Corp 用於柔版印刷版之背基板及其製造方法
CN102929100B (zh) * 2012-11-22 2014-11-19 南昌欧菲光纳米科技有限公司 一种可对准卷对卷uv成型的装置及方法
JP2015018006A (ja) 2013-07-08 2015-01-29 株式会社ニコン 基板処理装置、デバイス製造システム及びデバイス製造方法
US10246287B2 (en) * 2014-09-04 2019-04-02 Nikon Corporation Processing system and device manufacturing method
JP6308111B2 (ja) * 2014-11-21 2018-04-11 トヨタ自動車株式会社 車両の制御装置

Also Published As

Publication number Publication date
JP2020166279A (ja) 2020-10-08
TWI709831B (zh) 2020-11-11
CN108762010B (zh) 2019-09-17
CN108762010A (zh) 2018-11-06
TW201843757A (zh) 2018-12-16
JP6528775B2 (ja) 2019-06-12
TWI636344B (zh) 2018-09-21
TWI729751B (zh) 2021-06-01
JP2019152873A (ja) 2019-09-12
CN110488576B (zh) 2023-05-16
KR20190141271A (ko) 2019-12-23
US10683185B2 (en) 2020-06-16
CN110488576A (zh) 2019-11-22
US20190177105A1 (en) 2019-06-13
US10246287B2 (en) 2019-04-02
JPWO2016035842A1 (ja) 2017-08-17
KR102092155B1 (ko) 2020-03-23
TW201617746A (zh) 2016-05-16
KR20210013370A (ko) 2021-02-03
KR102086463B1 (ko) 2020-03-09
CN110297403B (zh) 2023-07-28
CN110451316A (zh) 2019-11-15
KR20170048391A (ko) 2017-05-08
KR20190141272A (ko) 2019-12-23
TWI692830B (zh) 2020-05-01
WO2016035842A1 (ja) 2016-03-10
HK1254829B (zh) 2020-06-19
KR102211609B1 (ko) 2021-02-03
JP6881655B2 (ja) 2021-06-02
CN108663913A (zh) 2018-10-16
CN106687867B (zh) 2019-08-02
CN108663913B (zh) 2019-09-24
TW202028890A (zh) 2020-08-01
JP6708283B2 (ja) 2020-06-10
CN110187612B (zh) 2023-02-17
US20200270087A1 (en) 2020-08-27
US20170253451A1 (en) 2017-09-07
CN110187612A (zh) 2019-08-30
CN110451316B (zh) 2021-01-05
CN106687867A (zh) 2017-05-17
CN110297403A (zh) 2019-10-01
TW201843538A (zh) 2018-12-16

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