HK1244068B - 聚合物組合物或預聚物組合物或者包含此類組合物的壓花漆及其用途 - Google Patents

聚合物組合物或預聚物組合物或者包含此類組合物的壓花漆及其用途

Info

Publication number
HK1244068B
HK1244068B HK18103675.6A HK18103675A HK1244068B HK 1244068 B HK1244068 B HK 1244068B HK 18103675 A HK18103675 A HK 18103675A HK 1244068 B HK1244068 B HK 1244068B
Authority
HK
Hong Kong
Prior art keywords
composition
poly
embossing lacquer
prepolymer
prepolymer composition
Prior art date
Application number
HK18103675.6A
Other languages
English (en)
Inventor
Dieter Nees
Markus Leitgeb
Barbara Stadlober
Stephan Ruttloff
André Lintschnig
Valentin Satzinger
Original Assignee
Joanneum Res Forschungsgmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joanneum Res Forschungsgmbh filed Critical Joanneum Res Forschungsgmbh
Publication of HK1244068B publication Critical patent/HK1244068B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Paints Or Removers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
HK18103675.6A 2014-12-10 2018-03-16 聚合物組合物或預聚物組合物或者包含此類組合物的壓花漆及其用途 HK1244068B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA888/2014A AT516559B1 (de) 2014-12-10 2014-12-10 Poly- bzw. Präpolymerzusammensetzung bzw. Prägelack, umfassend eine derartige Zusammensetzung sowie Verwendung derselben
PCT/AT2015/000157 WO2016090395A1 (de) 2014-12-10 2015-12-09 Poly- bzw. präpolymerzusammensetzung bzw. prägelack, umfassend eine derartige zusammenstzung und verwendung desselben

Publications (1)

Publication Number Publication Date
HK1244068B true HK1244068B (zh) 2020-03-20

Family

ID=55066254

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18103675.6A HK1244068B (zh) 2014-12-10 2018-03-16 聚合物組合物或預聚物組合物或者包含此類組合物的壓花漆及其用途

Country Status (10)

Country Link
US (1) US10308768B2 (zh)
EP (1) EP3230796B1 (zh)
JP (1) JP6640870B2 (zh)
KR (1) KR102423758B1 (zh)
CN (1) CN107533287B (zh)
AT (1) AT516559B1 (zh)
DK (1) DK3230796T3 (zh)
ES (1) ES2743812T3 (zh)
HK (1) HK1244068B (zh)
WO (1) WO2016090395A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017201990A1 (de) 2017-02-08 2018-08-09 Lufthansa Technik Ag Aushärtbare Vorläuferbeschichtung, daraus hergestellte mikrostrukturierte Oberflächenbeschichtung und Verfahren zur Herstellung einer mikrostrukturierten Oberflächenbeschichtung
DE102017201991A1 (de) 2017-02-08 2018-08-09 Lufthansa Technik Ag Prägelackzusammensetzung, daraus hergestellte mikrostrukturierte Oberfläche und Flugzeugbauteil mit einer solchen mikrostrukturierten Oberfläche
DE102017202675A1 (de) 2017-02-20 2018-08-23 Lufthansa Technik Ag Prägelackzusammensetzung, daraus hergestellte mikrostrukturierte Oberfläche und Flugzeugbauteil mit einer solchen mikrostrukturierten Oberfläche
DE102017218543A1 (de) * 2017-10-17 2019-04-18 Lufthansa Technik Ag Strömungsoptimierte Oberfläche und Fahrzeug mit einer derartigen strömungsoptimierten Oberfläche
ES2887015T3 (es) 2018-03-28 2021-12-21 Basf Coatings Gmbh Procedimiento para la transferencia de una estructura gofrada a la superficie de un agente de recubrimiento y material compuesto utilizable como matriz de gofrado
BR112020019348B1 (pt) * 2018-03-28 2023-01-17 Basf Coatings Gmbh Método para transferir uma estrutura gravada em relevo, terceiro compósito b2b1f1, e, uso do terceiro compósito b2b1f1
CN108977048A (zh) * 2018-06-08 2018-12-11 上海展辰涂料有限公司 一种uv耐磨高硬度地板漆
JP7105171B2 (ja) * 2018-10-30 2022-07-22 三菱電線工業株式会社 シール材及びそれに用いるコーティング剤
US20200207142A1 (en) * 2019-01-02 2020-07-02 Macdermid Graphics Solutions Llc Liquid Photopolymer Resin Compositions for Flexographic Printing
FI4034368T3 (fi) 2019-09-25 2024-02-08 Basf Coatings Gmbh Menetelmä kohokuvioidun rakenteen siirtämiseksi pinnoitteen pinnalle ja kohokuviointimuottina käyttökelpoinen komposiitti
DE102020123252A1 (de) * 2019-12-12 2021-06-17 Heliatek Gmbh Beschichtung für ein optoelektronisches Bauelement, Verfahren zur Herstellung einer solchen Beschichtung, optoelektronisches Bauelement mit einer solchen Beschichtung
CN111077732A (zh) * 2019-12-20 2020-04-28 深圳市华星光电半导体显示技术有限公司 光耦合输出透镜的材料组成物及制造方法
EP4160312A1 (en) * 2021-10-04 2023-04-05 Joanneum Research Forschungsgesellschaft mbH Elastic embossing lacquer having high optical dispersion
EP4423572A1 (de) * 2021-10-26 2024-09-04 Joanneum Research Forschungsgesellschaft mbH Prägelacke mit aliphatischen photoinitiatoren und biobasierte mikrostruktursysteme
DE102021134562A1 (de) * 2021-12-23 2023-06-29 INM - Leibniz-Institut für Neue Materialien gemeinnützige Gesellschaft mit beschränkter Haftung Härtbare Zusammensetzung und ihre Anwendung
CN115894919B (zh) * 2022-11-15 2024-02-09 中国科学院兰州化学物理研究所 一种交联梯度双晶相聚氨酯及其制备方法和应用

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2834768A1 (de) * 1977-08-23 1979-03-08 Grace W R & Co Verfahren zur herstellung einer druckplatte und sie enthaltende haertbare polymerzusammensetzung
CA1172112A (en) * 1980-12-12 1984-08-07 Richard P. Plunkett Process for making conductive coatings
US5744514A (en) * 1996-10-31 1998-04-28 Borden Chemical, Inc. Coated optical fibers having a reduced content of extractable and volatile material
KR100638123B1 (ko) 2002-07-22 2006-10-24 미쓰이 가가쿠 가부시키가이샤 무기 초미립자를 함유하는 수지 조성물
US7521015B2 (en) * 2005-07-22 2009-04-21 3M Innovative Properties Company Curable thiol-ene compositions for optical articles
DE102007007914A1 (de) * 2007-02-14 2008-08-21 Giesecke & Devrient Gmbh Prägelack für mikrooptische Sicherheitselemente
US20090047531A1 (en) * 2007-08-17 2009-02-19 Ppg Industries Ohio, Inc. Packages having radiation-curable coatings
WO2009148138A1 (ja) * 2008-06-05 2009-12-10 旭硝子株式会社 ナノインプリント用モールド、その製造方法および表面に微細凹凸構造を有する樹脂成形体ならびにワイヤグリッド型偏光子の製造方法
JP2010000612A (ja) * 2008-06-18 2010-01-07 Fujifilm Corp ナノインプリント用硬化性組成物、パターン形成方法
KR20100031074A (ko) * 2008-09-11 2010-03-19 후지필름 가부시키가이샤 감광성 조성물 및 기판의 가공 기판의 제조 방법
JP2011240643A (ja) * 2010-05-20 2011-12-01 Bridgestone Corp 樹脂製フィルムを用いた凹凸パターンの形成方法、その方法に使用する装置
EP2445029A1 (en) * 2010-10-25 2012-04-25 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Multilayered protective layer, organic opto-electric device and method of manufacturing the same
WO2012061702A1 (en) * 2010-11-04 2012-05-10 The Regents Of The University Of Colorado, A Body Corporate Dual-cure polymer systems
WO2013002734A1 (en) * 2011-06-28 2013-01-03 Agency For Science, Technology And Research Imprinting apparatus and method
CN103087087B (zh) * 2011-10-27 2015-11-25 上海交通大学 含巯基多官能团的低倍多聚硅氧烷化合物及其组合物和压印的软模板
EP2819822B1 (en) * 2012-03-01 2016-09-28 Stratasys Ltd. Cationic polymerizable compositions and methods of use thereof
JP2015096559A (ja) * 2012-03-02 2015-05-21 電気化学工業株式会社 樹脂組成物
WO2014006142A1 (de) * 2012-07-04 2014-01-09 Basf Coatings Gmbh Uv- und thermisch härtende klarlackzusammensetzung für die kraftfahrzeug-reparaturlackierung
US10154881B2 (en) * 2012-08-10 2018-12-18 Arizona Board Of Regents For And On Behalf Of Arizona State University Methods and compositions for tissue adhesives
JP6041740B2 (ja) 2012-09-28 2016-12-14 関西ペイント株式会社 水性塗料組成物及び塗膜形成方法
JP6361862B2 (ja) * 2014-03-28 2018-07-25 株式会社スリーボンド 光硬化性樹脂組成物

Also Published As

Publication number Publication date
JP6640870B2 (ja) 2020-02-05
WO2016090395A1 (de) 2016-06-16
KR20170093229A (ko) 2017-08-14
EP3230796B1 (de) 2019-06-05
US10308768B2 (en) 2019-06-04
JP2018505288A (ja) 2018-02-22
CN107533287A (zh) 2018-01-02
KR102423758B1 (ko) 2022-07-20
US20170349707A1 (en) 2017-12-07
WO2016090395A8 (de) 2018-09-07
AT516559B1 (de) 2017-12-15
ES2743812T3 (es) 2020-02-20
AT516559A1 (de) 2016-06-15
DK3230796T3 (da) 2019-07-15
CN107533287B (zh) 2021-06-01
EP3230796A1 (de) 2017-10-18

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