HK1244068B - 聚合物組合物或預聚物組合物或者包含此類組合物的壓花漆及其用途 - Google Patents

聚合物組合物或預聚物組合物或者包含此類組合物的壓花漆及其用途

Info

Publication number
HK1244068B
HK1244068B HK18103675.6A HK18103675A HK1244068B HK 1244068 B HK1244068 B HK 1244068B HK 18103675 A HK18103675 A HK 18103675A HK 1244068 B HK1244068 B HK 1244068B
Authority
HK
Hong Kong
Prior art keywords
composition
poly
embossing lacquer
prepolymer
prepolymer composition
Prior art date
Application number
HK18103675.6A
Other languages
English (en)
Inventor
Dieter Nees
Markus Leitgeb
Barbara Stadlober
Stephan Ruttloff
André Lintschnig
Valentin Satzinger
Original Assignee
Joanneum Res Forschungsgmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joanneum Res Forschungsgmbh filed Critical Joanneum Res Forschungsgmbh
Publication of HK1244068B publication Critical patent/HK1244068B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
HK18103675.6A 2014-12-10 2018-03-16 聚合物組合物或預聚物組合物或者包含此類組合物的壓花漆及其用途 HK1244068B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA888/2014A AT516559B1 (de) 2014-12-10 2014-12-10 Poly- bzw. Präpolymerzusammensetzung bzw. Prägelack, umfassend eine derartige Zusammensetzung sowie Verwendung derselben
PCT/AT2015/000157 WO2016090395A1 (de) 2014-12-10 2015-12-09 Poly- bzw. präpolymerzusammensetzung bzw. prägelack, umfassend eine derartige zusammenstzung und verwendung desselben

Publications (1)

Publication Number Publication Date
HK1244068B true HK1244068B (zh) 2020-03-20

Family

ID=55066254

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18103675.6A HK1244068B (zh) 2014-12-10 2018-03-16 聚合物組合物或預聚物組合物或者包含此類組合物的壓花漆及其用途

Country Status (10)

Country Link
US (1) US10308768B2 (zh)
EP (1) EP3230796B1 (zh)
JP (1) JP6640870B2 (zh)
KR (1) KR102423758B1 (zh)
CN (1) CN107533287B (zh)
AT (1) AT516559B1 (zh)
DK (1) DK3230796T3 (zh)
ES (1) ES2743812T3 (zh)
HK (1) HK1244068B (zh)
WO (1) WO2016090395A1 (zh)

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DE102017201990A1 (de) 2017-02-08 2018-08-09 Lufthansa Technik Ag Aushärtbare Vorläuferbeschichtung, daraus hergestellte mikrostrukturierte Oberflächenbeschichtung und Verfahren zur Herstellung einer mikrostrukturierten Oberflächenbeschichtung
DE102017201991A1 (de) 2017-02-08 2018-08-09 Lufthansa Technik Ag Prägelackzusammensetzung, daraus hergestellte mikrostrukturierte Oberfläche und Flugzeugbauteil mit einer solchen mikrostrukturierten Oberfläche
DE102017202675A1 (de) 2017-02-20 2018-08-23 Lufthansa Technik Ag Prägelackzusammensetzung, daraus hergestellte mikrostrukturierte Oberfläche und Flugzeugbauteil mit einer solchen mikrostrukturierten Oberfläche
DE102017218543A1 (de) * 2017-10-17 2019-04-18 Lufthansa Technik Ag Strömungsoptimierte Oberfläche und Fahrzeug mit einer derartigen strömungsoptimierten Oberfläche
BR112020019222B1 (pt) 2018-03-28 2023-01-31 Basf Coatings Gmbh Compósito, uso do compósito, e, método para transferir uma estrutura gravada em relevo para pelo menos uma parte de uma superfície de uma composição de revestimento
CA3093570A1 (en) 2018-03-28 2019-10-03 Basf Coatings Gmbh Method for transferring an embossed structure to the surface of a coating, and composite comprising said coating
CN108977048A (zh) * 2018-06-08 2018-12-11 上海展辰涂料有限公司 一种uv耐磨高硬度地板漆
JP7105171B2 (ja) * 2018-10-30 2022-07-22 三菱電線工業株式会社 シール材及びそれに用いるコーティング剤
US20200207142A1 (en) * 2019-01-02 2020-07-02 Macdermid Graphics Solutions Llc Liquid Photopolymer Resin Compositions for Flexographic Printing
AU2020352593A1 (en) 2019-09-25 2022-04-07 Basf Coatings Gmbh Method for transferring an embossed structure to the surface of a coating, and composite employable as embossing mold
DE102020123252A1 (de) * 2019-12-12 2021-06-17 Heliatek Gmbh Beschichtung für ein optoelektronisches Bauelement, Verfahren zur Herstellung einer solchen Beschichtung, optoelektronisches Bauelement mit einer solchen Beschichtung
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EP4160312A1 (en) * 2021-10-04 2023-04-05 Joanneum Research Forschungsgesellschaft mbH Elastic embossing lacquer having high optical dispersion
WO2023072369A1 (de) * 2021-10-26 2023-05-04 Joanneum Research Forschungsgesellschaft Mbh Prägelacke mit aliphatischen photoinitiatoren und biobasierte mikrostruktursysteme
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Also Published As

Publication number Publication date
AT516559A1 (de) 2016-06-15
CN107533287B (zh) 2021-06-01
KR102423758B1 (ko) 2022-07-20
US10308768B2 (en) 2019-06-04
EP3230796B1 (de) 2019-06-05
JP2018505288A (ja) 2018-02-22
US20170349707A1 (en) 2017-12-07
ES2743812T3 (es) 2020-02-20
DK3230796T3 (da) 2019-07-15
WO2016090395A8 (de) 2018-09-07
WO2016090395A1 (de) 2016-06-16
JP6640870B2 (ja) 2020-02-05
EP3230796A1 (de) 2017-10-18
KR20170093229A (ko) 2017-08-14
CN107533287A (zh) 2018-01-02
AT516559B1 (de) 2017-12-15

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