HK1243553A1 - 連接方法和接合體 - Google Patents

連接方法和接合體

Info

Publication number
HK1243553A1
HK1243553A1 HK18102880.9A HK18102880A HK1243553A1 HK 1243553 A1 HK1243553 A1 HK 1243553A1 HK 18102880 A HK18102880 A HK 18102880A HK 1243553 A1 HK1243553 A1 HK 1243553A1
Authority
HK
Hong Kong
Prior art keywords
assembly
connection method
connection
Prior art date
Application number
HK18102880.9A
Other languages
English (en)
Inventor
Naomi Kaku
Yasunobu Yamada
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1243553A1 publication Critical patent/HK1243553A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
HK18102880.9A 2015-03-18 2018-02-28 連接方法和接合體 HK1243553A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015054510A JP6493968B2 (ja) 2015-03-18 2015-03-18 接続方法、接合体、異方性導電フィルム、及び接合体の前駆体
PCT/JP2016/055439 WO2016147823A1 (ja) 2015-03-18 2016-02-24 接続方法、及び接合体

Publications (1)

Publication Number Publication Date
HK1243553A1 true HK1243553A1 (zh) 2018-07-13

Family

ID=56918701

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18102880.9A HK1243553A1 (zh) 2015-03-18 2018-02-28 連接方法和接合體

Country Status (5)

Country Link
JP (1) JP6493968B2 (zh)
CN (1) CN107251329B (zh)
HK (1) HK1243553A1 (zh)
TW (1) TWI696684B (zh)
WO (1) WO2016147823A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023061166A (ja) * 2021-10-19 2023-05-01 株式会社レゾナック 回路接続用接着剤テープ、接続構造体及び接続構造体の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
JP5143449B2 (ja) * 2007-03-02 2013-02-13 株式会社ダイセル 熱又は活性エネルギー線硬化型接着剤
JP2009001661A (ja) * 2007-06-21 2009-01-08 Asahi Kasei Electronics Co Ltd 接着剤及び接合体
JP2011199138A (ja) * 2010-03-23 2011-10-06 Fujikura Ltd 電子部品相互の接続方法及び接続構造
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
JP2013098504A (ja) * 2011-11-07 2013-05-20 Ohashi Seisakusho:Kk 接続構造体の製造装置及びその製造方法
KR101355857B1 (ko) * 2011-12-16 2014-01-27 제일모직주식회사 이방 전도성 필름용 조성물, 이로부터 제조된 이방 전도성 필름 및 반도체 장치
JP2014096531A (ja) * 2012-11-12 2014-05-22 Dexerials Corp 接続構造体の製造方法及び接続方法

Also Published As

Publication number Publication date
TWI696684B (zh) 2020-06-21
JP2016174126A (ja) 2016-09-29
WO2016147823A1 (ja) 2016-09-22
CN107251329B (zh) 2019-06-21
TW201634639A (zh) 2016-10-01
CN107251329A (zh) 2017-10-13
JP6493968B2 (ja) 2019-04-03

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