HK1243553A1 - Connection method and assembly - Google Patents

Connection method and assembly

Info

Publication number
HK1243553A1
HK1243553A1 HK18102880.9A HK18102880A HK1243553A1 HK 1243553 A1 HK1243553 A1 HK 1243553A1 HK 18102880 A HK18102880 A HK 18102880A HK 1243553 A1 HK1243553 A1 HK 1243553A1
Authority
HK
Hong Kong
Prior art keywords
assembly
connection method
connection
Prior art date
Application number
HK18102880.9A
Other languages
Chinese (zh)
Inventor
Naomi Kaku
Yasunobu Yamada
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1243553A1 publication Critical patent/HK1243553A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
HK18102880.9A 2015-03-18 2018-02-28 Connection method and assembly HK1243553A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015054510A JP6493968B2 (en) 2015-03-18 2015-03-18 Connection method, bonded body, anisotropic conductive film, and bonded body precursor
PCT/JP2016/055439 WO2016147823A1 (en) 2015-03-18 2016-02-24 Connection method and assembly

Publications (1)

Publication Number Publication Date
HK1243553A1 true HK1243553A1 (en) 2018-07-13

Family

ID=56918701

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18102880.9A HK1243553A1 (en) 2015-03-18 2018-02-28 Connection method and assembly

Country Status (5)

Country Link
JP (1) JP6493968B2 (en)
CN (1) CN107251329B (en)
HK (1) HK1243553A1 (en)
TW (1) TWI696684B (en)
WO (1) WO2016147823A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023061166A (en) * 2021-10-19 2023-05-01 株式会社レゾナック Adhesive tape for circuit connection, connection structure, and method for producing connection structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323246A (en) * 2000-03-07 2001-11-22 Sony Chem Corp Adhesive for connecting electrode and bonding method using the adhesive
JP5143449B2 (en) * 2007-03-02 2013-02-13 株式会社ダイセル Thermal or active energy ray curable adhesive
JP2009001661A (en) * 2007-06-21 2009-01-08 Asahi Kasei Electronics Co Ltd Adhesive and bonded body
JP2011199138A (en) * 2010-03-23 2011-10-06 Fujikura Ltd Method and structure for connection between electronic component
JP5540916B2 (en) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 Method for manufacturing connection structure
JP2013098504A (en) * 2011-11-07 2013-05-20 Ohashi Seisakusho:Kk Apparatus and method for manufacturing connection structure
KR101355857B1 (en) * 2011-12-16 2014-01-27 제일모직주식회사 Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device
JP2014096531A (en) * 2012-11-12 2014-05-22 Dexerials Corp Method for manufacturing connection structure and connection method

Also Published As

Publication number Publication date
WO2016147823A1 (en) 2016-09-22
CN107251329A (en) 2017-10-13
CN107251329B (en) 2019-06-21
JP6493968B2 (en) 2019-04-03
TW201634639A (en) 2016-10-01
TWI696684B (en) 2020-06-21
JP2016174126A (en) 2016-09-29

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