HK1255356A1 - Connection method - Google Patents

Connection method

Info

Publication number
HK1255356A1
HK1255356A1 HK18114495.1A HK18114495A HK1255356A1 HK 1255356 A1 HK1255356 A1 HK 1255356A1 HK 18114495 A HK18114495 A HK 18114495A HK 1255356 A1 HK1255356 A1 HK 1255356A1
Authority
HK
Hong Kong
Prior art keywords
connection method
connection
Prior art date
Application number
HK18114495.1A
Other languages
Chinese (zh)
Inventor
稻瀨圭亮
Original Assignee
迪睿合株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪睿合株式會社 filed Critical 迪睿合株式會社
Publication of HK1255356A1 publication Critical patent/HK1255356A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
HK18114495.1A 2015-12-14 2018-11-14 Connection method HK1255356A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015243532A JP2017112148A (en) 2015-12-14 2015-12-14 Connection method
PCT/JP2016/085600 WO2017104417A1 (en) 2015-12-14 2016-11-30 Connection method

Publications (1)

Publication Number Publication Date
HK1255356A1 true HK1255356A1 (en) 2019-08-16

Family

ID=59056367

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18114495.1A HK1255356A1 (en) 2015-12-14 2018-11-14 Connection method

Country Status (6)

Country Link
JP (1) JP2017112148A (en)
KR (1) KR20180040667A (en)
CN (1) CN108292611A (en)
HK (1) HK1255356A1 (en)
TW (1) TW201724925A (en)
WO (1) WO2017104417A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020041032A (en) * 2018-09-07 2020-03-19 デクセリアルズ株式会社 Manufacturing method of connection structure and connection film
CN114585251A (en) * 2022-02-16 2022-06-03 深圳市华星光电半导体显示技术有限公司 Binding device and binding method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3801666B2 (en) * 1995-05-22 2006-07-26 日立化成工業株式会社 Electrode connection method and connection member used therefor
JP2003064324A (en) * 2001-06-11 2003-03-05 Hitachi Chem Co Ltd Anisotropic electroconductive adhesive film, connection method for circuit board using the same and circuit board connected body
JP2005101125A (en) * 2003-09-24 2005-04-14 Seiko Epson Corp Semiconductor device, method of manufacturing same, circuit board, and electronic equipment
JP2005235530A (en) * 2004-02-18 2005-09-02 Hitachi Chem Co Ltd Circuit connection material
JP2008282978A (en) * 2007-05-10 2008-11-20 Toshiba Matsushita Display Technology Co Ltd Mounting method of semiconductor element, and manufacturing method of liquid crystal display panel
JP2009186707A (en) * 2008-02-06 2009-08-20 Seiko Epson Corp Method of manufacturing electro-optical device and electro-optical device
CN101724361B (en) * 2008-12-30 2011-12-07 四川虹欧显示器件有限公司 Aeolotropic conductive adhesive and conductive film and electric connection method thereof
WO2011024720A1 (en) * 2009-08-26 2011-03-03 積水化学工業株式会社 Method for manufacturing connection structure
JP5333863B2 (en) * 2009-08-26 2013-11-06 株式会社ジェイテクト Rotation angle detector
JP6259177B2 (en) * 2012-04-16 2018-01-10 早川ゴム株式会社 Method for bonding anisotropic conductive film
JP2014096531A (en) * 2012-11-12 2014-05-22 Dexerials Corp Method for manufacturing connection structure and connection method
JP6425899B2 (en) * 2014-03-11 2018-11-21 デクセリアルズ株式会社 ANISOTROPIC CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING CONNECTION AND METHOD FOR CONNECTING ELECTRONIC COMPONENTS

Also Published As

Publication number Publication date
CN108292611A (en) 2018-07-17
TW201724925A (en) 2017-07-01
KR20180040667A (en) 2018-04-20
WO2017104417A1 (en) 2017-06-22
JP2017112148A (en) 2017-06-22

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