HK1255356A1 - 連接方法 - Google Patents

連接方法

Info

Publication number
HK1255356A1
HK1255356A1 HK18114495.1A HK18114495A HK1255356A1 HK 1255356 A1 HK1255356 A1 HK 1255356A1 HK 18114495 A HK18114495 A HK 18114495A HK 1255356 A1 HK1255356 A1 HK 1255356A1
Authority
HK
Hong Kong
Prior art keywords
connection method
connection
Prior art date
Application number
HK18114495.1A
Other languages
English (en)
Inventor
稻瀨圭亮
Original Assignee
迪睿合株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪睿合株式會社 filed Critical 迪睿合株式會社
Publication of HK1255356A1 publication Critical patent/HK1255356A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
HK18114495.1A 2015-12-14 2018-11-14 連接方法 HK1255356A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015243532A JP2017112148A (ja) 2015-12-14 2015-12-14 接続方法
PCT/JP2016/085600 WO2017104417A1 (ja) 2015-12-14 2016-11-30 接続方法

Publications (1)

Publication Number Publication Date
HK1255356A1 true HK1255356A1 (zh) 2019-08-16

Family

ID=59056367

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18114495.1A HK1255356A1 (zh) 2015-12-14 2018-11-14 連接方法

Country Status (6)

Country Link
JP (1) JP2017112148A (zh)
KR (1) KR20180040667A (zh)
CN (1) CN108292611A (zh)
HK (1) HK1255356A1 (zh)
TW (1) TW201724925A (zh)
WO (1) WO2017104417A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020041032A (ja) * 2018-09-07 2020-03-19 デクセリアルズ株式会社 接続構造体の製造方法および接続フィルム
CN114585251A (zh) * 2022-02-16 2022-06-03 深圳市华星光电半导体显示技术有限公司 绑定装置和绑定方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3801666B2 (ja) * 1995-05-22 2006-07-26 日立化成工業株式会社 電極の接続方法およびこれに用いる接続部材
JP2003064324A (ja) * 2001-06-11 2003-03-05 Hitachi Chem Co Ltd 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体
JP2005101125A (ja) * 2003-09-24 2005-04-14 Seiko Epson Corp 半導体装置の製造方法及び半導体装置、回路基板並びに電子機器
JP2005235530A (ja) * 2004-02-18 2005-09-02 Hitachi Chem Co Ltd 回路接続材料
JP2008282978A (ja) * 2007-05-10 2008-11-20 Toshiba Matsushita Display Technology Co Ltd 半導体素子の実装方法及び液晶表示パネルの製造方法
JP2009186707A (ja) * 2008-02-06 2009-08-20 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置
CN101724361B (zh) * 2008-12-30 2011-12-07 四川虹欧显示器件有限公司 各向异性导电胶和导电膜以及电连接方法
JP5333863B2 (ja) * 2009-08-26 2013-11-06 株式会社ジェイテクト 回転角検出装置
JPWO2011024720A1 (ja) * 2009-08-26 2013-01-31 積水化学工業株式会社 接続構造体の製造方法
JP6259177B2 (ja) * 2012-04-16 2018-01-10 早川ゴム株式会社 異方性導電フィルムの接着方法
JP2014096531A (ja) * 2012-11-12 2014-05-22 Dexerials Corp 接続構造体の製造方法及び接続方法
JP6425899B2 (ja) * 2014-03-11 2018-11-21 デクセリアルズ株式会社 異方性導電接着剤、接続体の製造方法及び電子部品の接続方法

Also Published As

Publication number Publication date
JP2017112148A (ja) 2017-06-22
WO2017104417A1 (ja) 2017-06-22
TW201724925A (zh) 2017-07-01
CN108292611A (zh) 2018-07-17
KR20180040667A (ko) 2018-04-20

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