JP2013098504A - Apparatus and method for manufacturing connection structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and method for manufacturing a connection structure in order to improve production efficiency of the connection structure which is configured by including a substrate and a semiconductor chip when connecting the semiconductor chip to the substrate by using an anisotropic conductive adhesive agent performing two stages of heating.SOLUTION: In a preheat area A, auxiliary heating work is performed for heating a connection structure W at a first temperature in order to defoam air bubbles existent inside of an anisotropic conductive adhesive agent 3. In a crimp heating area, crimp heating work is performed for heating the connection structure W at a second temperature higher than the first temperature in order to press the semiconductor chip toward a substrate 1 and the anisotropic conductive adhesive agent and to heat and cure the anisotropic conductive adhesive agent. While the crimp heating work is performed on the preceding connection structure W in the crimp heating area, the auxiliary heating work is performed on the following connection structure W in the preheat area A.

Description

  The present invention relates to a connection structure manufacturing apparatus manufactured by connecting a substrate and a semiconductor chip with an anisotropic conductive adhesive (ACA) and a manufacturing method thereof, for example, an LED (light emitting diode). , A light emitting diode (IC) chip and an IC (integrated circuit, integrated circuit) chip can be used for connecting to a wiring board with an anisotropic conductive adhesive.

  The following Patent Document 1 describes a connection structure manufactured by connecting a substrate and a semiconductor chip with an anisotropic conductive adhesive. In this connection structure, a semiconductor chip is disposed on a substrate supplied with an anisotropic conductive adhesive, and the substrate and the semiconductor chip are connected via an anisotropic conductive adhesive. For this reason, the connection structure includes a substrate and a semiconductor chip disposed on the substrate and connected to the substrate with an anisotropic conductive adhesive.

JP 2011-82582 A

  The anisotropic conductive adhesive, which is a member for connecting the substrate and the semiconductor chip, is pre-heated at a first temperature higher than room temperature (room temperature), thereby anisotropy. Bubbles such as air existing inside the conductive adhesive are defoamed and / or the anisotropic conductive adhesive is temporarily cured, and the connection structure is heated at a second temperature higher than the first temperature. As a result, the anisotropic conductive adhesive is hardened, whereby there is one in which the substrate and the semiconductor chip are connected by the anisotropic conductive adhesive. When such an anisotropic conductive adhesive is used, the connection structure is preheated to the first temperature, and then the connection structure is heated to the second temperature in order to cure the anisotropic conductive adhesive. It is necessary to perform two-stage heating. For this reason, when using such an anisotropic conductive adhesive, it is possible to increase the number of connection structures to be produced per unit time, thereby improving the production efficiency. Desired.

  An object of the present invention is to connect a semiconductor chip to a substrate using an anisotropic conductive adhesive that has to be heated in two stages. An object of the present invention is to provide a connection structure manufacturing apparatus and a manufacturing method thereof capable of improving the production efficiency.

  An apparatus for manufacturing a connection structure according to the present invention manufactures a connection structure including a substrate and a semiconductor chip disposed on the substrate and connected to the substrate with an anisotropic conductive adhesive. The connecting structure is at a first temperature for defoaming bubbles present in the anisotropic conductive adhesive and / or pre-curing the anisotropic conductive adhesive. In an apparatus that is preheated and the connection structure is heated at a second temperature that is higher than the first temperature to cure the anisotropic conductive adhesive after the preheating, the connection structure is A preheating area for preheating at one temperature, and a pressure heating area for pressing the semiconductor chip toward the substrate and the anisotropic conductive adhesive and heating the connection structure at the second temperature Including When the pressure heating operation for the preceding connection structure is performed in the pressure heating area, the preliminary heating operation for the subsequent connection structure is performed in the preheating area. It is a feature.

  The manufacturing apparatus according to the present invention includes a preheating area for preheating the connection structure at a first temperature, pressurizing the semiconductor chip toward the substrate and the anisotropic conductive adhesive, and connecting the connection structure to the first structure. A crimping heating area for heating at two temperatures, and when the crimping heating operation is performed on the preceding connection structure in the crimping heating area, the subsequent connection structure in the preheat area Since the preheating operation is performed on the body, the crimping heating operation on the preceding connection structure and the preheating operation on the subsequent connection structure can be performed at the same time. The number of connection structures that can be increased can be increased, and the production efficiency can be improved.

  In the manufacturing apparatus according to the present invention, in order to transfer the connection structure from the preheat area side to the pressure heating area side, an adsorption transfer device that adsorbs the connection structure by suction from above can be used. In addition, the suction-type transfer device intervenes between the suction head that faces downward to suck the connection structure from above and the suction head and the connection structure, and the connection structure contacts the suction head. It is preferable to provide an elastic member for preventing this.

  According to this, in order to transfer the connection structure from the preheat area side to the pressure heating area side, even if this connection structure is adsorbed to the adsorption transfer device by the suction force of the suction head, the connection structure remains on the suction head. Since the contact can be prevented by the elastic member, the transfer can be performed while preventing the connection structure from being damaged.

  The elastic member may be of any structure and shape as long as it can prevent the connection structure from coming into contact with the suction head. For example, the elastic member has a cylindrical shape in which the suction head is housed. It is to make it a member.

  According to this, when the suction head sucks ambient air to suck the connection structure, the cylindrical elastic member surrounds the periphery of the suction head, so that the connection structure is sucked more reliably. Will be able to.

  In addition, by providing the cylindrical elastic member with a bellows part that can be elastically deformed up and down, when the connection structure is sucked by the suction head sucking air, the sucked connection structure The bellows portion of the elastic member whose body is in contact with the lower end can be elastically contracted and deformed. When the connection structure is transferred from the preheating area side to the pressure heating area side by balancing the weight of the connection structure and the downward repulsive force due to the contraction deformation of the bellows part and the upward suction force of the suction head. Thus, the elastic member can prevent the connection structure from coming into contact with the suction head.

  Further, in the manufacturing apparatus according to the present invention, the anti-falling member for preventing the connection structure when the suction type transfer device is attracted to the suction type transfer device by the suction force of the suction head from falling. The fall prevention member may be movable back and forth in the horizontal direction toward the connection structure.

  According to this, when the connection structure is adsorbed to the adsorption transfer device by the suction force of the suction head and the connection structure is transferred from the preheat area side to the pressure heating area side, for example, suction by the suction head is performed. Even if a problem such as a drop in force occurs, the fall prevention member can be prevented from falling from the adsorption transfer device by previously moving the fall prevention member toward the connection structure.

  Furthermore, in the manufacturing apparatus according to the present invention, a preheating area for preheating the connection structure at the first temperature in the preheating area, and a connection structure disposed on the preheating body and mounting the connection structure A body mounting body, the connecting structure mounting body can be moved up and down with respect to the preheating body, and the connection structure mounting is performed after a preheating operation time for preheating the connection structure at the first temperature. The connecting structure may be separated from the preheating body by raising the body with respect to the preheating body.

  According to this, the connection structure is placed on the connection structure mounting body in the preheating area, and when a predetermined time elapses after the preheating operation of the connection structure by the preheating body is started, the connection structure mounting is performed. Since the mounting body rises with respect to the preheating body and the connection structure is separated from the preheating body, problems that occur when the connection structure is heated beyond the preheating time, for example, Problems such as the anisotropic conductive adhesive starting to cure more than the temporary curing described above can be solved.

  In addition, a plurality of positioning members for positioning the connection structure on the connection structure mounting body are arranged on the connection structure mounting body, and locations corresponding to two opposing sides of the connection structure It is preferable to provide a positioning inclined surface that extends obliquely downward while approaching each other on the two positioning members arranged in the above.

  According to this, since the two positioning members arranged at locations corresponding to the two opposite sides of the connecting structure are provided with positioning inclined surfaces extending obliquely downward while approaching each other, the connection When the structure is placed on the connection structure mounting body, the connection structure is placed on the connection structure mounting body while being naturally positioned at a predetermined position by the guiding action of these positioning inclined surfaces. For this reason, the preheating operation of the connection structure by the preheating body can be performed uniformly for the entire connection structure.

  Furthermore, in the manufacturing apparatus according to the present invention, when the preheating operation in the preheating area takes longer than the pressure heating operation in the pressure heating area, the number of preheating areas is larger than the number of pressure heating areas. It is good.

  According to this, it becomes possible to simultaneously perform preheating operations for a plurality of connection structures in each preheating area. For this reason, the connection structures heated up to the first temperature are sequentially applied to the pressure heating area. Thus, it is possible to efficiently produce a connection structure in which a semiconductor chip is connected to a substrate by an anisotropic conductive adhesive.

  Further, in the manufacturing apparatus according to the present invention, when at least two pressure heating areas are provided, at least three preheat areas are provided, and a belt conveyor type conveying device is provided for each pressure heating area. Of the at least three preheating areas, at least one preheating area is preferably disposed between the two belt conveyor type conveying devices.

  According to this, since at least one preheat area is arranged between two belt conveyor type transfer devices, this preheat area is used effectively for the space between the two belt conveyor type transfer devices. Thus, the entire manufacturing apparatus according to the present invention can be reduced in size.

  In the method for manufacturing a connection structure according to the present invention, a semiconductor chip is disposed on a substrate supplied with an anisotropic conductive adhesive, and the substrate and the semiconductor chip are connected with the anisotropic conductive adhesive. A connection structure is manufactured by the method, wherein the connection structure is defoamed to remove bubbles existing in the anisotropic conductive adhesive and / or the anisotropic conductive adhesive is temporarily cured. Preheating at a first temperature for causing the connection structure to heat at a second temperature higher than the first temperature to cure the anisotropic conductive adhesive after the preheating, A preheating step for preheating the connection structure at the first temperature; pressurizing the semiconductor chip toward the substrate and the anisotropic conductive adhesive; and heating the connection structure at the second temperature Crimping for A preheating operation for the subsequent connection structure in the preheating step when a pressure heating operation for the connection structure preceding in the pressure heating step is performed. It is characterized by.

  The manufacturing method according to the present invention includes a preheating step for preheating the connection structure at a first temperature, pressurizing the semiconductor chip toward the substrate and the anisotropic conductive adhesive, and connecting the connection structure to the first structure. A crimping heating process for heating at two temperatures, and when the crimping heating operation for the preceding connection structure in the crimping heating process is performed, the subsequent connection structure in the preheating process In order to perform the preheating operation for the connection structure, it is possible to simultaneously perform the pressure heating operation for the preceding connection structure and the preheating operation for the subsequent connection structure, and thus, the connection structure that can be produced per unit time. This can increase the number of products and improve production efficiency.

  Further, in the manufacturing method according to the present invention, when the preheating operation in the preheating process takes longer time than the pressure heating operation in the pressure heating process, the preliminary heating process for the plurality of connection structures is performed in the preheating process. The heating operation may be performed simultaneously.

  According to this, since the preheating process for a plurality of connection structures can be simultaneously performed in the preheating process, the connection structure preheated to the first temperature can be sequentially transferred to the pressure heating process. As a result, it is possible to efficiently produce a connection structure connected to the substrate by the anisotropic conductive adhesive in which the semiconductor chip is cured.

  The manufacturing apparatus and the manufacturing method of the connection structure according to the present invention described above can be used for connecting an arbitrary semiconductor chip to a substrate with an anisotropic conductive adhesive. A chip or an IC chip may be used.

  According to the present invention, when a semiconductor chip is connected to a substrate using an anisotropic conductive adhesive that must be heated in two steps, the production of a connection structure including these substrate and semiconductor chip is produced. The effect that efficiency can be improved can be obtained.

FIG. 1 is an enlarged longitudinal sectional view showing a state of a connection structure during a preheating operation at a first temperature. FIG. 2 is an enlarged longitudinal sectional view showing a state of the connection structure after the pressure heating operation at the second temperature. FIG. 3 is a schematic plan view showing an outline of the entire manufacturing apparatus according to an embodiment of the present invention. FIG. 4 is a plan view showing an adsorbent of the adsorption transfer device shown in FIG. FIG. 5 is a front view of the adsorbent of the adsorption transfer device. FIG. 6 is an enlarged front view showing a portion of the suction head and the elastic member shown in FIG. FIG. 7 is a view similar to FIG. 6 showing the elastic member in cross section. FIG. 8 is a view similar to FIG. 6 showing when the suction head is sucking the connection structure and the fall prevention member shown in FIGS. 4 to 7 is retracted. FIG. 9 is a view similar to FIG. 6 showing when the suction head is sucking the connection structure and the fall prevention member is moving forward. FIG. 10 is a plan view showing a preheating device arranged in the preheat area. FIG. 11 is a front view of the preheating device. FIG. 12 is a side view of the preheating device. FIG. 13 is an enlarged front view showing a positioning member provided on the connection structure mounting body of the preheating device.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated based on drawing. In this embodiment, the semiconductor chip connected to the wiring board by the anisotropic conductive adhesive heated in two stages of the first temperature and the second temperature is an LED chip. A large number of LED chips having a minute size are arranged on a single substrate.

  In FIG. 1, the bump 2 and the anisotropic conductive adhesive 3 are supplied on the wiring substrate 1 having the electrode 1 </ b> A, and the connection terminal 4 </ b> A is further formed on the bump 2 and the anisotropic conductive adhesive 3. Shows a state in which the LED chip 4 is turned downward. FIG. 1 shows a state in which a large number of LED chips 4 are supplied to a single substrate 1. In FIG. 1, the wiring substrate 1, bumps 2, anisotropic conductive adhesive 3, and LED chips 4 are constituent elements. The state at the time of the preheating operation | work about the connection structure W manufactured in this way is shown. That is, FIG. 1 shows a case where the connection structure W is disposed in the preheating area A shown in FIG. 3 in order to heat the connection structure W at the first temperature. The anisotropic conductive adhesive 3 as an agent is in a paste form before being heated at the first temperature.

  FIG. 2 shows the connection structure W after being heated by pressure in the pressure heating area B shown in FIG. At this time, the LED chip 4 is pressed toward the bump 2, the anisotropic conductive adhesive 3 and the substrate 1, so that the connection terminal 4 </ b> A of the LED chip 4 exists in the anisotropic conductive adhesive 3. The conductive particles 3A and the bumps 2 are connected to the electrode 1A of the substrate 1, whereby the substrate 1 and the LED chip 4 are electrically connected, and the connection structure W is heated at the second temperature. Thus, the LED chip 4 is connected and fixed to the substrate 1 with the anisotropic conductive adhesive 3 by the curing of the anisotropic conductive adhesive 3 having a thermosetting property.

  In FIGS. 1 and 2, the anisotropic conductive adhesive 3 is supplied in a scattered manner to the position of the substrate 1 on which the respective LED chips 4 are arranged. Alternatively, the entire substrate 1 including the gap between the LED chips 4 may be supplied in a planar shape having a thickness.

  FIG. 3 shows a schematic plan view of the entire manufacturing apparatus according to this embodiment in which the preheating area A and the pressure heating area B are provided. In the present embodiment, a total of four preheating areas A are provided A1 to A4, and a total of two pressure heating areas B are provided B1 and B2. Two crimping heating areas B1 and B2 are arranged at positions shifted in the X direction among the X direction and the Y direction that are orthogonal to each other with respect to the four preheating areas A1 to A4. Yes. Of the four preheat areas A1 to A4, the three preheat areas A1 to A3 are arranged at positions shifted in the Y direction at the same position in the X direction, and the remaining one preheat area A4 is 3 It arrange | positions in the location which shifted | deviated to the X direction close | similar to the two crimping | compression-bonding heating areas B1 and B2 with respect to the piece preheating areas A1-A3. Further, the two crimping heating areas B1 and B2 are arranged at positions shifted in the Y direction at the same position in the X direction.

  In the manufacturing apparatus according to the present embodiment, a first transport device 11 and a second transport device 12 having the X direction as the transport direction are installed, and the second transport device 12 is provided for each of the two pressure heating areas B. Since it is installed, there are two second transfer devices 12A and 12B. Of the four preheat areas A1 to A4, the above-described one preheat area A4 is disposed between the second transfer devices 12A and 12B. For this reason, the preheat area A4 is arranged by effectively using the space between the two second transfer devices 12A and 12B, thereby achieving downsizing of the entire manufacturing apparatus according to the present embodiment. Has been.

  The 1st conveying apparatus 11 is arrange | positioned among the 2nd 2 conveying apparatuses 12A and 12B at the conveyance direction rear side (X direction left side in FIG. 3) by the 2nd conveying apparatus 12A for crimping | bonding heating area B1. . The first transport device 11 is supplied with a connection structure W from a device (not shown) connected to the rear side in the X direction of the manufacturing apparatus according to this embodiment. Is forwarded a predetermined distance forward (right side in the X direction in FIG. 3) by the transport action of the first transport device 11.

  In addition, the 1st conveying apparatus 11 and the 2nd conveying apparatus 12 are belt conveyor type conveying apparatuses in which two narrow endless belts 13 are arranged at intervals in the Y direction which is the width direction. Both ends of the structure W in the Y direction are placed on the endless belt 13 so that the connection structure W is conveyed.

  In the manufacturing apparatus according to the present embodiment, a first transfer device 21 for transferring the connection structure W from the first transfer device 11 to each preheat area A is provided. It is also an apparatus for transferring the connection structure W that has been preheated in the preheating area A to the two second transfer apparatuses 12A and 12B. Further, the manufacturing apparatus according to the present embodiment is also provided with a second transfer device 22 for transferring the connection structure W from one second transfer device 12B to the other second transfer device 12A.

  The first transfer device 21 and the second transfer device 22 are arranged at a position higher than the transfer height position of the connection structure W by the first transfer device 11 and the second transfer device 12. For this reason, the 1st transfer apparatus 21 and the 2nd transfer apparatus 22 are provided with the adsorption body 23 which adsorb | sucks this connection structure W by attracting the connection structure W from above so that it may mention later. For this reason, the 1st transfer device 21 and the 2nd transfer device 22 are adsorption type transfer devices. The adsorbing body 23 can be moved up and down by an elevating device such as a cylinder, and when the adsorbing body 23 is lowered, the connection structure W is adsorbed and desorbed.

  The adsorbent 23 of the first transfer device 21 is attached to an arm member 21A extending in the X direction, and is guided by the arm member 21A and moved in the X direction by an X direction driving device (not shown). The arm member 21A is attached to an arm member 21B extending in the Y direction. The arm member 21A is guided by the arm member 21B and moved in the Y direction by a Y direction driving device (not shown). For this reason, the adsorbent 23 of the first transfer device 21 is movable in the X direction and the Y direction within the length of the arm members 21A and 21B.

  Further, the adsorbent 23 of the second transfer device 22 is attached to an arm member 22A extending in the Y direction, and is guided by the arm member 22A and moved in the Y direction by a Y direction driving device (not shown). For this reason, the adsorbent 23 of the second transfer device 22 is movable in the Y direction within the length of the arm member 22A.

  Each of the second transport devices 12 is provided with a feed device 24 for accurately sending the connection structure W that has been sent to the position in the X direction in the second transport device 12 to the pressure heating area B. . These feeding devices 24 have clamping means 24A arranged for each of the two endless belts 13 of the second conveying device 12, and these clamping devices that move in the X direction by a driving device (not shown). The attachment means 24A is composed of a pair of upper and lower sandwiching members that can be opened and closed vertically, and the connection structure W sandwiched between these sandwiching members is crimped by movement of the sandwiching means 24A in the X direction. It is sent accurately to the heating area B.

  A crimping device 25 is disposed at a location that coincides with the crimping heating area B1, B2 in each of the second transport devices 12A, 12B. These crimping devices 25 are cylinders or the like above the respective second transport devices 12A, 12B. 2 has a crimping head 25A that moves up and down by a lifting device and a crimping base 25B in FIG. 2 that is fixedly disposed at a position directly below the crimping head 25A.

  Further, as shown in FIG. 3, the preheating area A, the pressure heating area B, the first transport device 11 and the second transport device 12 are based on an optical system for detecting the connection structure W or the like. A sensor 26 is arranged. The detection signals from these sensors 26 are sent to a computer control device. This control device is based on the detection signal of the connection structure W from the sensor 26, and the belt conveyor type first and second transport devices 11 and 12, the suction type first and second transfer devices 21 and 22 described above, Each drive source of the device 24, a drive source and a heat source of a device for preheating the connection structure W in the preheating area A, and further a drive for pressure heating the connection structure W in the pressure heating area B The power source, the heating source, and the like are driven and controlled based on a program in which work procedures are set.

  Next, the control device controls the belt conveyor type first and second transport devices 11 and 12, the suction type first and second transfer devices 21 and 22, and the like based on the detection signal from the sensor 26 and the program. An overview of the preheating operation and the pressure heating operation performed by the above will be described first. In the following description, the lifting and lowering movement of the adsorbing body 23 performed by the adsorbing bodies 23 of the first and second transfer devices 21 and 22 to adsorb and release the adsorbing structure W at the lower limit is omitted.

  When the connection structure W is sent to the first transport device 11 from the above-described device connected to the rear side in the X direction of the manufacturing apparatus according to this embodiment, the first transport device 11 is connected to the first transport device 11. The body W is transported to a position in the X direction where the adsorbent 23 of the first transfer device 21 can adsorb the connection structure W. After this, the adsorbent 23 adsorbs the connection structure W, and the adsorbent 23 becomes X Move in the direction or Y direction. And the connection structure W is transferred to one preheating area A among the four preheating areas A by the adsorption body 23 performing adsorption cancellation. The transfer of the connection structure W by the first transport device 11 is performed in order to transfer each connection structure W sequentially sent from the above-described device (not shown) to the remaining three preheat areas A. Are performed sequentially.

  In each preheating area A, the anisotropic conductive adhesive 3 is preheated to the connection structure W arranged between the substrate 1 and the LED chip 4, and the heating time in this preheating operation and The heating temperature (first temperature) is, for example, 120 seconds and 80 ° C. If bubbles such as air are present inside the anisotropic conductive adhesive 3 due to the preheating operation in which the connection structure W is heated to the first temperature, the bubbles escape, that is, The bubbles are degassed, and the anisotropic conductive adhesive 3 is temporarily cured by this preheating operation. Due to the defoaming, when the connection structure W is heated at the second temperature in the pressure heating area B, the substrate 1 and the LED chip 4 are reliably electrically connected by the cured anisotropic conductive adhesive 3. The LED chip 4 can be temporarily fixed to the substrate 1 by the anisotropic conductive adhesive 3 by the temporary curing of the anisotropic conductive adhesive 3, and the connection structure is maintained while maintaining the temporarily fixed state. The body W can be sent from the preheating area A to the pressure heating area B. As described above, FIG. 1 shows the state of the connection structure W in the preheat area A.

  The connection structure W in each preheat area A is one of the two second transfer devices 12A and 12B by the adsorbent 23 of the first transfer device 21 from the connection structure W that has reached the heating time. 2 Transferred to the transport device 12A. This 2nd conveying apparatus 12A conveys the connection structure W to the position of the X direction which can send to the crimping | compression-bonding heating area B1 with the sending apparatus 24, and then the feeding apparatus 24 carries out the connection structure W of the crimping | heating heating area B1 Send to exact position.

  The connection structure W sent to the crimping heating area B1 is placed on the crimping table 25B shown in FIG. 2 of the crimping device 25 arranged in the crimping heating area B1, and the crimping device 25 is lowered. The pressure is applied by the pressure bonding head 25A. Thereby, the LED chip 4 of the connection structure W is pressed toward the bump 2, the anisotropic conductive adhesive 3, and the substrate 1, and an electric heater is built in at the time of this pressing. The connection structure W is heated to the second temperature at which the anisotropic conductive adhesive 3 is thermally cured by the pressure bonding head 25A and / or the pressure bonding table 25B. The state of the connection structure W when heated to the second temperature is shown in FIG.

  The crimping heating operation of the connection structure W by the crimping head 25A and the crimping table 25B performed in this way is performed between the crimping head 25A and the connection structure W, as shown in FIG. This is performed by interposing a buffer material tape 27 supplied from the apparatus. Thereby, a large number of LED chips 4 arranged on one substrate 1 are uniformly pressed by the buffer material tape 27. .

  The heating time and heating temperature (second temperature) in the pressure bonding heating operation of the connection structure W performed in this way are, for example, 30 seconds and 230 ° C. The heating time of the above-described preheating operation is It is longer than the heating time of the crimping heating operation.

  When the connection structure W is heated by both the pressure bonding head 25A and the pressure bonding table 25B, the temperatures of the pressure bonding head 25A and the pressure bonding table 25B are not the same. For example, the pressure bonding table is higher than the temperature of the pressure bonding head 25A. The temperature of 25B may be lowered.

  The connection structure W that has been subjected to the crimping heating operation is transported to the terminal end of the transport device 12A by the second transport device 12A, and is transferred to a device not shown in the figure to perform the next work process. The crimping heating operation in the crimping heating area B1 and the delivery to an unillustrated device are sequentially transferred from the respective preheating area A to the second transport device 12A, and the respective connection structures W after the crimping heating operation are finished. Done in order.

  In the above, when the crimping heating operation for the preceding connection structure W is performed in the crimping heating area B1, the preliminary heating operation for the subsequent connection structure W is performed in the preheating area A, For this reason, the pressure heating operation for the preceding connection structure W and the preheating operation for the subsequent connection structure W are performed simultaneously. Therefore, according to the present embodiment, it is possible to increase the number of connection structures W that can be produced per unit time, thereby improving the production efficiency.

  Further, even if the preheating time in the preheating area A is longer than the pressure heating time in the pressure heating area B1, a plurality of preheating areas A are provided A1 to A4, and this number is larger than the number of pressure heating areas. Therefore, the preheating operation for the plurality of connection structures W can be simultaneously performed in the respective preheat areas A1 to A4. Accordingly, each connection structure W can be preheated to the first temperature in the preheating area A, and the connection structure W that has reached the first temperature by being heated to the preheating time is sequentially crimped. It can be transferred to the heating area.

  Furthermore, in this embodiment, since the two crimping heating areas B are provided B1 and B2, and the second conveying device 12 is also provided two 12A and 12B, for example, the crimping heating time in the crimping heating area B1 is provided. For example, when the connection structure W that has been preheated in the preheating area A is transferred by the first transfer device 21 by the adsorbent 23 of the second transfer device 12A, the connection structure W is disposed in the second transfer device 12A. When the crimping heating operation for the preceding connection structure W is still performed in the crimping heating area B1, the connection structure W for which the preheating operation in the preheating area A has been completed is transferred to the first transfer device. 21 is transported to the second transport device 12B by the adsorbing body 23, and the crimping heating operation for the connection structure W is performed in the crimping heating area B2 provided in the second transport device 12B. It may be performed by crimping device 25 disposed in the crimping heated area B2.

  Then, the connection structure W that has been subjected to the pressure heating operation is transferred from the second transfer device 12B to the second transfer device 12A by the adsorbent 23 of the second transfer device 22, and the connection structure W is transferred from the second transfer device 12A. Can be transferred to a device not shown in the same manner as the connection structure W described above.

  Next, the adsorbent 23 provided in the first transfer device 21 and the second transfer device 22 will be described.

  FIG. 4 shows a plan view of the adsorbing body 23, and FIG. 5 shows a front view of the adsorbing body 23. A cylinder 31 having a pair of actuators 31A is fixed on the upper surface of the main body 30 which is a plate shape of the adsorbent body 23. Pins 32 are provided on these actuators 31A which open and close by air pressure supplied to the cylinder body. The connecting member 33 is connected via A drop preventing member 36 is connected to each connecting member 33 via a guide bar 35 guided by a guide member 34, and the pair of drop preventing members 36 are connected to the pair of actuators 31 </ b> A outside the main body 30. It reciprocates in the horizontal direction by opening and closing movements.

  Further, as shown in FIG. 4, a plurality of air suction portions 37 connected to an air suction device such as a compressor are arranged on the outer peripheral portion of the main body 30, and these air suction portions 37 are also shown in FIG. FIG. 6 is an enlarged view of a portion of the air suction portion 37 in FIG. 5, and FIG. 7 is a cross-sectional view of a part of FIG. As can be seen from FIGS. 6 and 7, a suction head 38 is provided for each air suction portion 37 on the lower surface of the main body 30, and each suction head 38 is attached downward to the main body 30. An air suction passage 38 </ b> A formed through the interior of the air passage 38 is connected to the air suction device via an air suction portion 37 and an air circuit.

  An elastic member 39 that is elastically deformable because it is made of, for example, a soft synthetic resin is attached to the lower surface of the main body 30 downward. The elastic member 39 accommodates the suction head 38 inside. This is a cylindrical member. A bellows portion 39A is formed in the lower part of the cylindrical elastic member 39. Therefore, the elastic member 39 is elastically deformable up and down in the bellows portion 39A.

  The pair of normal fall prevention members 36 are retracted as shown in FIG. 8, but when the connection structure W is adsorbed to the adsorbent 23 by the suction of air by the suction head 38, in other words, As will be described later, when the connection structure W is attracted to the lower surface of the elastic member 39 by the suction force of the suction head 38, the pair of fall prevention members 36 are, as shown in FIG. The pair of actuators 31A move forward and backward toward the connection structure W. An extension portion 36A extending inward in the horizontal direction is formed at the lower end of each fall prevention member 36 that is a bent product of sheet metal, and the fall prevention member 36 is connected to the extension portion 36A. When moving forward with respect to W, as shown in FIG. 9, it reaches a position below the end of the connection structure W with a slight gap from the connection structure W.

  As shown in FIG. 5, the base member 41 is coupled to the main body 30 of the adsorbent body 23 configured as described above via the cylinder 31 and the space member 40 installed in the main body 30. When the base member 41 is lifted and lowered by a lifting device such as a cylinder, the entire adsorbent 23 is also lifted and lowered.

  When the adsorbent 23 adsorbs the connection structure W in order to transfer the connection structure W from the preheat area A or the like to the second transport device 12 or the like, in other words, the adsorbent 23 descends toward the preheat area A. Sometimes, the fall prevention member 36 is retracted as shown in FIG. For this reason, when the air suction passages 38A of the respective suction heads 38 suck in the surrounding air, the connection structure W is attracted to the lower surface of the elastic member 39 by the suction force from above by the suction heads 38. The bellows portion 39A of the elastic member 39 is elastically contracted and deformed upward by the ascending force generated in the connection structure W by the suction force.

  For this reason, according to the present embodiment, the elastic member 39 is interposed between the suction head 38 and the connection structure W. Therefore, the weight of the connection structure W and the elasticity due to the contraction deformation of the bellows portion 39A. When the downward repulsive force of the member 39 and the upward suction force by the suction head 38 are balanced, the attachment of the connection structure W by the suction body 23 and the connection structure W coming into contact with the suction head 38 are elastic members. 39 to prevent this from happening. Accordingly, the connection structure W is secured from the preheating area A or the like by the first and second transfer devices 21 and 22 provided with the adsorbing body 23 in a state in which the safety of the connection structure W is ensured. It can be transferred to the transfer device 12 or the like.

  Further, the elastic member 39 of the present embodiment has a cylindrical shape in which the suction head 38 is housed, and the elastic member 39 surrounds the periphery of the suction head 38, so that the suction head 38 sucks the ambient air. Thus, the suction of the connection structure W by the suction head 38 and the suction to the suction body 23 can be performed more reliably.

  When the connection structure W is attracted to the adsorbent 23 by the suction force of the suction head 38 as described above, the pair of fall prevention members 36 face the connection structure W, as shown in FIG. And move forward. After this, the connection structure W reaches the upper position of the second transport device 12 and the like by the ascent of the adsorbent 23 and the movement in the X direction and the Y direction. As the prevention member 36 moves backward with respect to the connection structure W as shown in FIG. 8 and the suction force by the suction head 38 disappears, the suction of the connection structure W by the suction body 23 is performed. The connection structure W has been transferred to a predetermined location such as the second transport device 12.

  As described above, when the connection structure W is transferred from the preheat area A or the like to the second transport device 12 or the like by the adsorbent 23, the extension portion of the fall prevention member 36 that is moving forward toward the connection structure W As shown in FIG. 9, 36 </ b> A reaches the lower position of the end portion of the connection structure W. For this reason, even if the suction force of the suction head 38 decreases or disappears for some reason during the transfer of the connection structure W and the suction of the connection structure W by the suction body 23 is released, for example, the connection structure W Can be prevented from falling from the adsorbent 23 by the fall prevention member 36.

  In addition, the sensor which detects that adsorption | suction of the connection structure W was cancelled | released is provided in the adsorption body 23, and this control apparatus is set to this embodiment by sending the signal from this sensor to the above-mentioned control apparatus. The operation of the manufacturing apparatus is automatically stopped.

  Next, the apparatus installed in each preheat area A is demonstrated. 10 to 13 show the preheating device 50 installed in these preheating areas A, FIG. 10 is a plan view of the preheating device 50, and FIG. 11 is a front view of the preheating device 50. FIG. 12 is a side view of the preheating device 50. As shown in FIGS. 11 and 12, a preheating body 53 is placed on a machine base 51 forming a base portion of the preheating device 50 via a plurality of support members 52. . The preheating body 53 includes a thick plate-like heating member 54 in which an electric heater 54A as a heating source is incorporated, and a table 55 disposed on the heating member 54, and is attached to a side surface of the heating member 54. The projection 55A formed on the side surface of the table 55 is coupled to the bracket 56 so that the heating member 54 and the table 55 stacked in the vertical direction are connected and integrated.

  In addition, since the upper and lower ends of the support member 52 are formed of the heat insulating member 52 </ b> A, the heat of the heating member 54 is prevented from being transmitted to the machine base 51.

  The preliminary heating body 53 is provided with a connection structure mounting body 57 on which the connection structure W is mounted. As can be seen from FIGS. It has a pair of mounting members 57 </ b> A disposed on both sides of the heating body 53. As shown in FIG. 12, these mounting members 57A are moved up and down by a piston rod 59A of a cylinder 59 attached upward to the machine base 51 via a bracket 58. This up-and-down movement of the member 57 </ b> A is performed by guiding a guide bar 60 having an upper end coupled to the mounting member 57 </ b> A by a guide member 61 installed on the machine base 51.

  When each mounting member 57A is lowered to the lowest position, the upper surface of the mounting member 57A reaches the same height position as the upper surface of the preheating body 53 or a height position lower than the upper surface. Further, when each placement member 57 </ b> A is raised to the uppermost position, the upper surface of the placement member 57 </ b> A reaches a height position higher than the upper surface of the preheating body 53.

  As shown in FIG. 10, the overall shape of the connection structure W is a quadrangular shape in plan view. A positioning member 62 for positioning the connection structure W in the connection structure mounting body 57 is attached to each of the pair of mounting members 57A. When the connection structure W is placed on the upper surface of each placement member 57A, the positioning members 62 that are configured to face each other with the connection structure W therebetween.

  For this reason, the above-mentioned connection structure mounting body 57 in which the pair of mounting members 57A are constituent members includes two pieces arranged at locations corresponding to two opposite sides of the connection structure W. Two sets of positioning members 62 are arranged, and each of the two positioning members 62 extends diagonally downward while approaching each other, as shown in FIG. A positioning inclined surface 62A is provided.

  When the connection structure W is transferred from the first transfer device 11 to the preheat area A by the adsorbent 23 of the first transfer device 21, the connection structure mounting body 57 is operated by the contraction operation of the piston rod 59 </ b> A of the cylinder 59. The connection structure W is located on the connection structure mounting body 57 that is at the same height position as the upper surface of the preheating body 53 or a lower position lower than the upper surface and thus reaches the lower position. It is delivered from the adsorbing body 23 of the transfer device 21, and this delivery is performed by a positioning action by the positioning member 62 disposed on the connection structure mounting body 57 at a position higher than the upper surface of the preheating body 53. The connection structure W is positioned at an accurate position of the connection structure mounting body 57 or the preheating body 53. In addition, the connection structure W is transferred from the first transfer device 21 to the connection structure mounting body 57 by the sensor 26 arranged in the preheat area A shown in FIG. It is detected by the sensor 26 arranged on the table 55 that constitutes, and the detection signal from this sensor 26 is input to the aforementioned control device.

  As described above, the connection structure W is positioned by the positioning member 62 and rides on the upper surface of the preheating body 53. Accordingly, the preheating operation for preheating the connection structure W to the first temperature is performed. Is started by the preheating body 53. The time from the start of the preheating operation is measured by a timer means included in the control device to which the detection signal of the connection structure W is input from the sensor 26. That is, when it is detected by the sensor 26 that the connection structure W is on the upper surface of the preheating body 53, the timer means of the control device to which the detection signal is input starts counting time, However, when the time for the preheating operation, that is, the time for defoaming the bubbles existing in the anisotropic conductive adhesive 3 as described above (for example, 120 seconds described above), Causes the piston rod 59 </ b> A of the cylinder 59 to extend and thereby the connection structure W and the connection structure mounting body 57 rise to a position higher than the preheating body 53.

  Thus, the connection structure W is separated from the preheating body 53, and the operation of preheating the connection structure W in the preheating area A is completed. Thereafter, the connection structure W is transferred to the second transfer device 12A or 12B by the adsorbent 23 of the first transfer device 21 as described above, and further sent to the pressure heating area B. In the preheat area A, the piston rod 59A of the cylinder 59 contracts, whereby the connection structure mounting body 57 is lowered to the initial lowered position and waits for the connection structure W to be sent next. .

  As described above, in the present embodiment, when the preheating operation for the connection structure W performed by the preheating body 53 reaches a preset time, the piston rod 59A of the cylinder 59 extends and operates. Since the connection structure mounting body 57 is separated from the preheating body 53, the connection structure W is moved from the first temperature by the preheating body 53 that is always at a temperature higher than the first temperature. It is possible to prevent excessive heating to a high temperature, and it is possible to prevent the occurrence of problems such as the anisotropic conductive adhesive 3 starting to cure beyond the above-described temporary curing due to this excessive heating.

  Further, the connection structure mounting body 57 is provided with a plurality of positioning members 62 for positioning the connection structure W with the connection structure mounting body 57 or the preheating body 53 and connected to the connection structure mounting body 57. The positioning member 62, which is a set of two arranged at locations corresponding to two opposite sides of the structure W, is provided with a positioning inclined surface 62A that extends obliquely downward while approaching each other. As shown by the two-dot chain line in FIG. 13, the connection structure W is positioned at an accurate position by the positioning action by the positioning inclined surfaces 62A and mounted on the connection structure mounting body 57. Will be placed.

  For this reason, when the connection structure mounting body 57 is lowered to the lowest position, the whole of the connection structure W including a large number of LED chips 4 is preheated uniformly by the preheating body 53. Can do.

  The present invention can be used for connecting a semiconductor chip such as an LED chip or an IC chip to a substrate with an anisotropic conductive adhesive.

DESCRIPTION OF SYMBOLS 1 Board | substrate 3 Anisotropic conductive adhesive 4 LED chip | tip which is a semiconductor chip 11,12 Belt conveyor type conveying apparatus 21,22 Adsorption-type transfer apparatus 23 Adsorbent body 25 Crimping apparatus 25A Crimping head 25B Crimping stand 36 Fall prevention member 38 Suction head 39 elastic member 39A bellows part 50 preheating device 53 preheating body 57 connection structure mounting body 62 positioning member 62A positioning inclined surface W connection structure A preheat area B pressure heating area

Claims (9)

An apparatus for manufacturing a connection structure including a substrate and a semiconductor chip disposed on the substrate and connected to the substrate with an anisotropic conductive adhesive, the connection structure comprising: Pre-heated at a first temperature for defoaming bubbles present in the anisotropic conductive adhesive and / or pre-curing the anisotropic conductive adhesive, and after the pre-heating, the connection structure Is heated at a second temperature higher than the first temperature to cure the anisotropic conductive adhesive,
A preheating area for preheating the connection structure at the first temperature, and pressurizing the semiconductor chip toward the substrate and the anisotropic conductive adhesive, and the connection structure at the second temperature A crimp heating area for heating, and
When the crimping heating operation for the preceding connection structure is performed in the crimping heating area, the preliminary heating operation for the subsequent connection structure is performed in the preheating area. Manufacturing apparatus for connecting structure.   2. The connection structure manufacturing apparatus according to claim 1, wherein the connection structure is adsorbed by a suction force from above, and the adsorbed connection structure is transferred from the preheat area side to the pressure heating area side. A suction transfer device, and the suction transfer device intervenes between the suction head and the connection structure, and a suction head that faces downward to suck the connection structure from above. And an elastic member for preventing the connection structure from coming into contact with the suction head.   The manufacturing apparatus of the connection structure according to claim 2, wherein the connection structure when the adsorption transfer device is adsorbed by the adsorption transfer device by the suction force of the suction head falls. An apparatus for manufacturing a connection structure, comprising: a fall prevention member for preventing the fall, wherein the fall prevention member is movable in a horizontal direction toward the connection structure.   In the manufacturing apparatus of the connection structure according to any one of claims 1 to 3, the preheating area includes a preheating body for preheating the connection structure at the first temperature, and the preheating body. And a connection structure mounting body on which the connection structure is mounted. The connection structure mounting body is movable up and down with respect to the preheating body, and the connection structure is mounted on the connection structure mounting body. After the preheating time for preheating at the first temperature has elapsed, the connection structure mounting body rises with respect to the preheating body, so that the connection structure is separated from the preheating body. An apparatus for manufacturing a connection structure, comprising:   5. The connection structure manufacturing apparatus according to claim 4, wherein the connection structure mounting body includes a plurality of positioning members for positioning the connection structure on the connection structure mounting body. The two positioning members arranged at locations corresponding to two opposite sides of the connection structure are provided with positioning inclined surfaces extending obliquely downward while approaching each other. Manufacturing apparatus for connecting structure.   In the connection structure manufacturing apparatus according to any one of claims 1 to 5, the preheating operation in the preheating area takes longer than the pressure heating operation in the pressure heating area, and the number of the preheat areas is The connection structure manufacturing apparatus is characterized in that the number is larger than the number of the crimping heating areas.   The apparatus for manufacturing a connection structure according to claim 6, wherein at least two pressure heating areas are provided, at least three preheating areas are provided, and a belt conveyor type conveying device is provided for each pressure heating area. The apparatus for manufacturing a connection structure according to claim 1, wherein at least one of the at least three preheating areas is disposed between the two belt conveyor type conveying devices. A method of manufacturing a connection structure by placing semiconductor chips on a substrate supplied with an anisotropic conductive adhesive and connecting the substrate and the semiconductor chip with the anisotropic conductive adhesive. The connection structure is preheated at a first temperature for defoaming bubbles present in the anisotropic conductive adhesive and / or pre-curing the anisotropic conductive adhesive, In the method of heating the connection structure after preheating at a second temperature higher than the first temperature in order to cure the anisotropic conductive adhesive,
A preheating step for preheating the connection structure at the first temperature; and pressurizing the semiconductor chip toward the substrate and the anisotropic conductive adhesive; and the connection structure at the second temperature. A crimping heating step for heating, and
A connection structure in which a preheating operation for the subsequent connection structure is performed in the preheating step when a pressure heating operation for the connection structure preceding in the compression heating step is performed. Body manufacturing method.   The method for manufacturing a connection structure according to claim 8, wherein the preheating operation in the preheating step takes longer than the pressure heating operation in the pressure heating step, and a plurality of the connections are made in the preheating step. A method for manufacturing a connection structure, wherein the preheating operation for the structure is performed simultaneously.

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