HK1219568A1 - 具有選擇性地修改的電氣性質的引線的電子器件 - Google Patents
具有選擇性地修改的電氣性質的引線的電子器件Info
- Publication number
- HK1219568A1 HK1219568A1 HK16107483.1A HK16107483A HK1219568A1 HK 1219568 A1 HK1219568 A1 HK 1219568A1 HK 16107483 A HK16107483 A HK 16107483A HK 1219568 A1 HK1219568 A1 HK 1219568A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- lead
- electronic device
- electrical properties
- selectively modified
- modified electrical
- Prior art date
Links
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361842945P | 2013-07-03 | 2013-07-03 | |
PCT/EP2014/001824 WO2015000595A1 (en) | 2013-07-03 | 2014-07-02 | Electronic device having a lead with selectively modified electrical properties |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1219568A1 true HK1219568A1 (zh) | 2017-04-07 |
Family
ID=51063399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16107483.1A HK1219568A1 (zh) | 2013-07-03 | 2016-06-28 | 具有選擇性地修改的電氣性質的引線的電子器件 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9673137B2 (zh) |
EP (1) | EP3017470B1 (zh) |
JP (1) | JP6450378B2 (zh) |
KR (1) | KR102035774B1 (zh) |
CN (1) | CN105518856B (zh) |
CA (1) | CA2915155C (zh) |
HK (1) | HK1219568A1 (zh) |
TW (1) | TWM496230U (zh) |
WO (1) | WO2015000595A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6457505B2 (ja) * | 2013-07-03 | 2019-01-23 | ローゼンベルガー ホーフフレクベンツテクニーク ゲーエムベーハー ウント ツェーオー カーゲー | 誘電体および金属で被覆されたワイヤを有する基板レスダイパッケージおよびその製造方法 |
CN108364878B (zh) * | 2018-02-01 | 2019-09-17 | 深圳市华讯方舟微电子科技有限公司 | 微组装方法及芯片装置 |
US11715722B2 (en) * | 2020-04-30 | 2023-08-01 | Wolfspeed, Inc. | Wirebond-constructed inductors |
US11557565B2 (en) | 2020-10-06 | 2023-01-17 | Nxp Usa, Inc. | Semiconductor device assembly and method therefor |
US11502054B2 (en) * | 2020-11-11 | 2022-11-15 | Nxp Usa, Inc. | Semiconductor device assembly and method therefor |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0412538A (ja) * | 1990-05-01 | 1992-01-17 | Hitachi Ltd | 半導体装置 |
JP2990128B2 (ja) * | 1997-10-16 | 1999-12-13 | 九州日本電気株式会社 | 半導体装置内部接続用被覆金属細線 |
JP2002184934A (ja) * | 2000-12-13 | 2002-06-28 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US6608390B2 (en) * | 2001-11-13 | 2003-08-19 | Kulicke & Soffa Investments, Inc. | Wirebonded semiconductor package structure and method of manufacture |
TW571375B (en) * | 2002-11-13 | 2004-01-11 | Advanced Semiconductor Eng | Semiconductor package structure with ground and method for manufacturing thereof |
JP2005064248A (ja) * | 2003-08-12 | 2005-03-10 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US7202109B1 (en) * | 2004-11-17 | 2007-04-10 | National Semiconductor Corporation | Insulation and reinforcement of individual bonding wires in integrated circuit packages |
JP2007115771A (ja) * | 2005-10-18 | 2007-05-10 | Nec System Technologies Ltd | Lsiピン |
EP2002478B1 (en) * | 2006-03-23 | 2016-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electrically enhanced wirebond package |
KR100874925B1 (ko) * | 2007-06-04 | 2008-12-19 | 삼성전자주식회사 | 반도체 패키지, 그 제조 방법, 이를 포함하는 카드 및 이를포함하는 시스템 |
US8581113B2 (en) | 2007-12-19 | 2013-11-12 | Bridgewave Communications, Inc. | Low cost high frequency device package and methods |
US20100025864A1 (en) * | 2008-07-31 | 2010-02-04 | International Business Machines Corporation | Shielded wirebond |
US8377749B1 (en) * | 2009-09-15 | 2013-02-19 | Applied Micro Circuits Corporation | Integrated circuit transmission line |
TWI484616B (zh) * | 2011-10-06 | 2015-05-11 | Adl Engineering Inc | 具電磁干擾屏蔽之封裝模組 |
-
2014
- 2014-07-02 EP EP14735474.0A patent/EP3017470B1/en active Active
- 2014-07-02 KR KR1020157037291A patent/KR102035774B1/ko active IP Right Grant
- 2014-07-02 CN CN201480038210.8A patent/CN105518856B/zh active Active
- 2014-07-02 CA CA2915155A patent/CA2915155C/en active Active
- 2014-07-02 JP JP2016522337A patent/JP6450378B2/ja active Active
- 2014-07-02 US US14/902,158 patent/US9673137B2/en active Active
- 2014-07-02 WO PCT/EP2014/001824 patent/WO2015000595A1/en active Application Filing
- 2014-07-02 TW TW103211710U patent/TWM496230U/zh unknown
-
2016
- 2016-06-28 HK HK16107483.1A patent/HK1219568A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CA2915155C (en) | 2019-09-03 |
JP6450378B2 (ja) | 2019-01-09 |
EP3017470A1 (en) | 2016-05-11 |
KR102035774B1 (ko) | 2019-10-23 |
JP2016524337A (ja) | 2016-08-12 |
EP3017470B1 (en) | 2018-10-24 |
CN105518856A (zh) | 2016-04-20 |
US20160190047A1 (en) | 2016-06-30 |
CA2915155A1 (en) | 2015-01-08 |
WO2015000595A1 (en) | 2015-01-08 |
CN105518856B (zh) | 2018-07-17 |
US9673137B2 (en) | 2017-06-06 |
TWM496230U (zh) | 2015-02-21 |
KR20160026920A (ko) | 2016-03-09 |
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