HK1218991A1 - 包括具有至少部分被電介質層包圍的多個金屬芯的互連件的互連系統 - Google Patents
包括具有至少部分被電介質層包圍的多個金屬芯的互連件的互連系統Info
- Publication number
- HK1218991A1 HK1218991A1 HK16106942.8A HK16106942A HK1218991A1 HK 1218991 A1 HK1218991 A1 HK 1218991A1 HK 16106942 A HK16106942 A HK 16106942A HK 1218991 A1 HK1218991 A1 HK 1218991A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- interconnect
- dielectric layer
- partially surrounded
- metal cores
- interconnect system
- Prior art date
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- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
- H01L2224/85935—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by heating means, e.g. reflowing
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
- H01L2224/85935—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by heating means, e.g. reflowing
- H01L2224/85939—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by heating means, e.g. reflowing using a laser
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- H—ELECTRICITY
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- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
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- H—ELECTRICITY
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- H01L2225/06537—Electromagnetic shielding
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- H—ELECTRICITY
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- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
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- H—ELECTRICITY
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
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- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Remote Sensing (AREA)
- Materials Engineering (AREA)
- Fluid Mechanics (AREA)
- Chemical & Material Sciences (AREA)
- Astronomy & Astrophysics (AREA)
- Aviation & Aerospace Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361842954P | 2013-07-03 | 2013-07-03 | |
US201361842949P | 2013-07-03 | 2013-07-03 | |
US201361842948P | 2013-07-03 | 2013-07-03 | |
PCT/EP2014/001823 WO2015000594A1 (en) | 2013-07-03 | 2014-07-02 | An interconnect system comprising an interconnect having a plurality of metal cores at least partially surrounded by a dielectric layer |
Publications (1)
Publication Number | Publication Date |
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HK1218991A1 true HK1218991A1 (zh) | 2017-03-17 |
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Family Applications (1)
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HK16106942.8A HK1218991A1 (zh) | 2013-07-03 | 2016-06-16 | 包括具有至少部分被電介質層包圍的多個金屬芯的互連件的互連系統 |
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US (1) | US9812420B2 (zh) |
EP (1) | EP3017472A1 (zh) |
JP (1) | JP2016524336A (zh) |
KR (1) | KR20160029037A (zh) |
CN (1) | CN105359267B (zh) |
CA (1) | CA2915407C (zh) |
HK (1) | HK1218991A1 (zh) |
TW (1) | TWM506373U (zh) |
WO (1) | WO2015000594A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017095385A1 (en) * | 2015-11-30 | 2017-06-08 | Intel Corporation | Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material |
EP3297093B1 (de) * | 2016-09-16 | 2019-01-02 | Rosenberger Hochfrequenztechnik GmbH & Co. KG | Steckverbinder zum verbinden einer optischen faser und eines elektrischen leiters |
US20190206827A1 (en) * | 2017-12-29 | 2019-07-04 | Intel Corporation | Semiconductor package with externally accessible wirebonds |
US11812545B2 (en) | 2020-01-08 | 2023-11-07 | Delta Electronics (Shanghai) Co., Ltd | Power supply system and electronic device |
CN113098234B (zh) * | 2020-01-08 | 2022-11-01 | 台达电子企业管理(上海)有限公司 | 供电系统 |
CN111900144B (zh) * | 2020-08-12 | 2021-11-12 | 深圳安捷丽新技术有限公司 | 高速互连的接地参考形状 |
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US5491610A (en) * | 1994-09-09 | 1996-02-13 | International Business Machines Corporation | Electronic package having active means to maintain its operating temperature constant |
JP2570645B2 (ja) * | 1994-12-28 | 1997-01-08 | 日本電気株式会社 | 半導体装置 |
US20020006526A1 (en) * | 1999-10-11 | 2002-01-17 | Polese Frank J. | Aluminum silicon carbide and copper clad material and manufacturing process |
US6956283B1 (en) * | 2000-05-16 | 2005-10-18 | Peterson Kenneth A | Encapsulants for protecting MEMS devices during post-packaging release etch |
JP2002184934A (ja) * | 2000-12-13 | 2002-06-28 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US20050156322A1 (en) * | 2001-08-31 | 2005-07-21 | Smith Lee J. | Thin semiconductor package including stacked dies |
US6608390B2 (en) * | 2001-11-13 | 2003-08-19 | Kulicke & Soffa Investments, Inc. | Wirebonded semiconductor package structure and method of manufacture |
US6770822B2 (en) | 2002-02-22 | 2004-08-03 | Bridgewave Communications, Inc. | High frequency device packages and methods |
US6992629B2 (en) * | 2003-09-03 | 2006-01-31 | Raytheon Company | Embedded RF vertical interconnect for flexible conformal antenna |
US7671449B2 (en) * | 2005-05-04 | 2010-03-02 | Sun Microsystems, Inc. | Structures and methods for an application of a flexible bridge |
US7450378B2 (en) * | 2006-10-25 | 2008-11-11 | Gm Global Technology Operations, Inc. | Power module having self-contained cooling system |
JP4316607B2 (ja) * | 2006-12-27 | 2009-08-19 | 株式会社東芝 | アンテナ装置及び無線通信装置 |
US7969022B1 (en) * | 2007-03-21 | 2011-06-28 | Marvell International Ltd. | Die-to-die wire-bonding |
KR100874925B1 (ko) * | 2007-06-04 | 2008-12-19 | 삼성전자주식회사 | 반도체 패키지, 그 제조 방법, 이를 포함하는 카드 및 이를포함하는 시스템 |
US8581113B2 (en) * | 2007-12-19 | 2013-11-12 | Bridgewave Communications, Inc. | Low cost high frequency device package and methods |
US7884444B2 (en) * | 2008-07-22 | 2011-02-08 | Infineon Technologies Ag | Semiconductor device including a transformer on chip |
US20100258952A1 (en) | 2009-04-08 | 2010-10-14 | Interconnect Portfolio Llc | Interconnection of IC Chips by Flex Circuit Superstructure |
US8377749B1 (en) * | 2009-09-15 | 2013-02-19 | Applied Micro Circuits Corporation | Integrated circuit transmission line |
TWI484616B (zh) * | 2011-10-06 | 2015-05-11 | Adl Engineering Inc | 具電磁干擾屏蔽之封裝模組 |
TWM498961U (zh) * | 2013-07-03 | 2015-04-11 | Rosenberger Hochfrequenztech | 高頻寬互連線的熱絕緣結構 |
US9554463B2 (en) * | 2014-03-07 | 2017-01-24 | Rogers Corporation | Circuit materials, circuit laminates, and articles formed therefrom |
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2014
- 2014-07-02 CN CN201480038207.6A patent/CN105359267B/zh active Active
- 2014-07-02 KR KR1020157037293A patent/KR20160029037A/ko not_active Application Discontinuation
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TWM506373U (zh) | 2015-08-01 |
CA2915407C (en) | 2020-09-29 |
US20160379952A1 (en) | 2016-12-29 |
CA2915407A1 (en) | 2015-01-08 |
EP3017472A1 (en) | 2016-05-11 |
JP2016524336A (ja) | 2016-08-12 |
WO2015000594A1 (en) | 2015-01-08 |
CN105359267A (zh) | 2016-02-24 |
CN105359267B (zh) | 2018-06-05 |
KR20160029037A (ko) | 2016-03-14 |
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