HK1212301A1 - Multilayer film and shielded printed wiring board - Google Patents

Multilayer film and shielded printed wiring board

Info

Publication number
HK1212301A1
HK1212301A1 HK16100297.2A HK16100297A HK1212301A1 HK 1212301 A1 HK1212301 A1 HK 1212301A1 HK 16100297 A HK16100297 A HK 16100297A HK 1212301 A1 HK1212301 A1 HK 1212301A1
Authority
HK
Hong Kong
Prior art keywords
wiring board
printed wiring
multilayer film
shielded printed
shielded
Prior art date
Application number
HK16100297.2A
Other languages
English (en)
Chinese (zh)
Inventor
启彰 篠原
真次 芳野
Original Assignee
Tatsuta Densen Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Densen Kk filed Critical Tatsuta Densen Kk
Publication of HK1212301A1 publication Critical patent/HK1212301A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
HK16100297.2A 2012-11-19 2016-01-12 Multilayer film and shielded printed wiring board HK1212301A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012253166 2012-11-19
PCT/JP2013/081143 WO2014077406A1 (ja) 2012-11-19 2013-11-19 積層フィルム及びシールドプリント配線板

Publications (1)

Publication Number Publication Date
HK1212301A1 true HK1212301A1 (en) 2016-06-10

Family

ID=50731313

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16100297.2A HK1212301A1 (en) 2012-11-19 2016-01-12 Multilayer film and shielded printed wiring board

Country Status (6)

Country Link
JP (1) JP6014680B2 (xx)
KR (1) KR101949302B1 (xx)
CN (1) CN104797420B (xx)
HK (1) HK1212301A1 (xx)
TW (1) TWI613956B (xx)
WO (1) WO2014077406A1 (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018056329A (ja) * 2016-09-29 2018-04-05 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
KR102024608B1 (ko) * 2017-01-11 2019-09-24 엘지전자 주식회사 센서
JP6345855B1 (ja) * 2017-01-17 2018-06-20 太陽インキ製造株式会社 感光性フィルム積層体およびそれを用いて形成された硬化物
JP6863908B2 (ja) * 2018-01-12 2021-04-21 タツタ電線株式会社 電磁波シールドフィルム
JP6426865B1 (ja) * 2018-02-20 2018-11-21 タツタ電線株式会社 電磁波シールドフィルム
JP6978994B2 (ja) * 2018-02-20 2021-12-08 タツタ電線株式会社 転写フィルム
JP7345457B2 (ja) * 2018-05-16 2023-09-15 株式会社レゾナック 感光性フィルム及び永久マスクレジストの形成方法
CN110769667B (zh) * 2018-07-27 2023-12-05 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
JP7256618B2 (ja) * 2018-08-29 2023-04-12 タツタ電線株式会社 転写フィルム付電磁波シールドフィルム、転写フィルム付電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法
TWI768213B (zh) * 2018-11-08 2022-06-21 日商拓自達電線股份有限公司 電磁波屏蔽膜、電磁波屏蔽膜之製造方法及屏蔽印刷配線板之製造方法
JP7268446B2 (ja) * 2019-03-29 2023-05-08 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11208193A (ja) * 1998-01-26 1999-08-03 Dainippon Printing Co Ltd 転写シート
JP4524024B2 (ja) 2000-06-26 2010-08-11 藤森工業株式会社 離型フィルム
JP4099355B2 (ja) * 2001-06-29 2008-06-11 積水化学工業株式会社 シート
JP2003211602A (ja) * 2002-01-24 2003-07-29 Sumitomo Bakelite Co Ltd 離型多層フィルム及びカバーレイ成形方法
JP4201548B2 (ja) * 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
WO2007055225A1 (ja) * 2005-11-08 2007-05-18 Toray Industries, Inc. ポリエステル積層フィルムおよび転写箔
JP2007175885A (ja) * 2005-12-27 2007-07-12 Asahi Kasei Chemicals Corp 離型フィルム
KR100803619B1 (ko) * 2006-10-30 2008-02-19 도레이새한 주식회사 윈도우 엠보싱 가공용 폴리에스테르 필름 및 그 제조방법
JP5023765B2 (ja) 2007-03-30 2012-09-12 住友ベークライト株式会社 離型フィルムと回路基板の製造方法
JP5139156B2 (ja) * 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
JP2011088352A (ja) * 2009-10-22 2011-05-06 Unitika Ltd 離型フィルム
KR101873071B1 (ko) * 2010-03-12 2018-06-29 세키스이가가쿠 고교가부시키가이샤 이형 필름 및 이형 필름의 제조 방법
JP5308465B2 (ja) * 2011-01-28 2013-10-09 タツタ電線株式会社 シールドプリント配線板

Also Published As

Publication number Publication date
CN104797420B (zh) 2018-01-12
WO2014077406A1 (ja) 2014-05-22
JPWO2014077406A1 (ja) 2017-01-05
TWI613956B (zh) 2018-02-01
KR20150087353A (ko) 2015-07-29
JP6014680B2 (ja) 2016-10-25
KR101949302B1 (ko) 2019-02-18
CN104797420A (zh) 2015-07-22
TW201429379A (zh) 2014-07-16

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