HK1211904A1 - Mold release film for led production led - Google Patents

Mold release film for led production led

Info

Publication number
HK1211904A1
HK1211904A1 HK15112728.7A HK15112728A HK1211904A1 HK 1211904 A1 HK1211904 A1 HK 1211904A1 HK 15112728 A HK15112728 A HK 15112728A HK 1211904 A1 HK1211904 A1 HK 1211904A1
Authority
HK
Hong Kong
Prior art keywords
led
release film
mold release
production
led production
Prior art date
Application number
HK15112728.7A
Other languages
English (en)
Chinese (zh)
Inventor
南條成
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Publication of HK1211904A1 publication Critical patent/HK1211904A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2274/00—Thermoplastic elastomer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
HK15112728.7A 2013-04-24 2015-12-25 Mold release film for led production led HK1211904A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013091314 2013-04-24
PCT/JP2014/060769 WO2014175127A1 (ja) 2013-04-24 2014-04-16 Ｌｅｄ製造用離型フィルム

Publications (1)

Publication Number Publication Date
HK1211904A1 true HK1211904A1 (en) 2016-06-03

Family

ID=51791706

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15112728.7A HK1211904A1 (en) 2013-04-24 2015-12-25 Mold release film for led production led

Country Status (6)

Country Link
JP (1) JP6351576B2 (ko)
KR (1) KR102202907B1 (ko)
CN (1) CN105008126A (ko)
HK (1) HK1211904A1 (ko)
TW (1) TWI608936B (ko)
WO (1) WO2014175127A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102457647B1 (ko) * 2016-09-15 2022-10-24 미쯔비시 케미컬 주식회사 점착 시트 적층체, 부형 점착 시트 적층체 및 그 제조방법
CN114633534A (zh) * 2022-04-12 2022-06-17 广东鸿翔瑞材料科技有限公司 耐高温离型膜及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001129940A (ja) * 1999-11-02 2001-05-15 Unitika Ltd フッ素樹脂コートポリエステルフィルム
JP4099355B2 (ja) * 2001-06-29 2008-06-11 積水化学工業株式会社 シート
JP4033691B2 (ja) * 2002-03-06 2008-01-16 ユニチカ株式会社 フッ素樹脂コートポリエステルフィルムの製造方法
TWI476103B (zh) 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
CN101489778A (zh) * 2006-07-24 2009-07-22 株式会社可乐丽 印刷电路板制造用脱模薄膜
KR101435449B1 (ko) * 2007-03-19 2014-08-28 린텍 가부시키가이샤 박리시트 및 점착체
JP5258310B2 (ja) * 2008-01-21 2013-08-07 日本ゴア株式会社 高分子電解質膜補強用フッ素樹脂コートポリマーフィルム、補強された高分子電解質膜および膜電極組立体
JP5517573B2 (ja) 2008-12-02 2014-06-11 ユニチカ株式会社 離型フィルム
JP2011005664A (ja) * 2009-06-23 2011-01-13 Dainippon Printing Co Ltd 離型フィルムおよびその製造方法
JP2011088352A (ja) * 2009-10-22 2011-05-06 Unitika Ltd 離型フィルム
KR101242330B1 (ko) * 2009-12-30 2013-03-12 (주)엘지하우시스 이형필름 및 이의 제조방법
JP5472996B2 (ja) * 2010-03-24 2014-04-16 信越ポリマー株式会社 離型用フィルム

Also Published As

Publication number Publication date
KR20160002726A (ko) 2016-01-08
WO2014175127A1 (ja) 2014-10-30
TWI608936B (zh) 2017-12-21
CN105008126A (zh) 2015-10-28
KR102202907B1 (ko) 2021-01-14
JPWO2014175127A1 (ja) 2017-02-23
JP6351576B2 (ja) 2018-07-04
TW201500199A (zh) 2015-01-01

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