HK1211904A1 - Mold release film for led production led - Google Patents

Mold release film for led production led

Info

Publication number
HK1211904A1
HK1211904A1 HK15112728.7A HK15112728A HK1211904A1 HK 1211904 A1 HK1211904 A1 HK 1211904A1 HK 15112728 A HK15112728 A HK 15112728A HK 1211904 A1 HK1211904 A1 HK 1211904A1
Authority
HK
Hong Kong
Prior art keywords
led
release film
mold release
production
led production
Prior art date
Application number
HK15112728.7A
Other languages
Chinese (zh)
Inventor
南條成
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Publication of HK1211904A1 publication Critical patent/HK1211904A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2274/00Thermoplastic elastomer material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
HK15112728.7A 2013-04-24 2015-12-25 Mold release film for led production led HK1211904A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013091314 2013-04-24
PCT/JP2014/060769 WO2014175127A1 (en) 2013-04-24 2014-04-16 Mold release film for led production

Publications (1)

Publication Number Publication Date
HK1211904A1 true HK1211904A1 (en) 2016-06-03

Family

ID=51791706

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15112728.7A HK1211904A1 (en) 2013-04-24 2015-12-25 Mold release film for led production led

Country Status (6)

Country Link
JP (1) JP6351576B2 (en)
KR (1) KR102202907B1 (en)
CN (1) CN105008126A (en)
HK (1) HK1211904A1 (en)
TW (1) TWI608936B (en)
WO (1) WO2014175127A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102457647B1 (en) * 2016-09-15 2022-10-24 미쯔비시 케미컬 주식회사 Adhesive sheet laminate, shaped adhesive sheet laminate, and method for producing same
CN114633534A (en) * 2022-04-12 2022-06-17 广东鸿翔瑞材料科技有限公司 High-temperature-resistant release film and preparation method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001129940A (en) * 1999-11-02 2001-05-15 Unitika Ltd Fluoroplastic resin coated polyester film
JP4099355B2 (en) * 2001-06-29 2008-06-11 積水化学工業株式会社 Sheet
JP4033691B2 (en) * 2002-03-06 2008-01-16 ユニチカ株式会社 Method for producing fluororesin-coated polyester film
TWI476103B (en) 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
JPWO2008012940A1 (en) * 2006-07-24 2009-12-17 株式会社クラレ Release film for printed wiring board manufacturing
JP5631586B2 (en) * 2007-03-19 2014-11-26 リンテック株式会社 Release sheet and adhesive
JP5258310B2 (en) * 2008-01-21 2013-08-07 日本ゴア株式会社 Fluororesin-coated polymer film for polymer electrolyte membrane reinforcement, reinforced polymer electrolyte membrane and membrane electrode assembly
JP5517573B2 (en) 2008-12-02 2014-06-11 ユニチカ株式会社 Release film
JP2011005664A (en) * 2009-06-23 2011-01-13 Dainippon Printing Co Ltd Mold release film and method for manufacturing the same
JP2011088352A (en) * 2009-10-22 2011-05-06 Unitika Ltd Release film
KR101242330B1 (en) * 2009-12-30 2013-03-12 (주)엘지하우시스 Release film and preparation method thereof
JP5472996B2 (en) * 2010-03-24 2014-04-16 信越ポリマー株式会社 Release film

Also Published As

Publication number Publication date
CN105008126A (en) 2015-10-28
WO2014175127A1 (en) 2014-10-30
KR20160002726A (en) 2016-01-08
TWI608936B (en) 2017-12-21
JPWO2014175127A1 (en) 2017-02-23
KR102202907B1 (en) 2021-01-14
JP6351576B2 (en) 2018-07-04
TW201500199A (en) 2015-01-01

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