HK1211904A1 - Mold release film for led production led - Google Patents
Mold release film for led production ledInfo
- Publication number
- HK1211904A1 HK1211904A1 HK15112728.7A HK15112728A HK1211904A1 HK 1211904 A1 HK1211904 A1 HK 1211904A1 HK 15112728 A HK15112728 A HK 15112728A HK 1211904 A1 HK1211904 A1 HK 1211904A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- led
- release film
- mold release
- production
- led production
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2274/00—Thermoplastic elastomer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013091314 | 2013-04-24 | ||
PCT/JP2014/060769 WO2014175127A1 (en) | 2013-04-24 | 2014-04-16 | Mold release film for led production |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1211904A1 true HK1211904A1 (en) | 2016-06-03 |
Family
ID=51791706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15112728.7A HK1211904A1 (en) | 2013-04-24 | 2015-12-25 | Mold release film for led production led |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6351576B2 (en) |
KR (1) | KR102202907B1 (en) |
CN (1) | CN105008126A (en) |
HK (1) | HK1211904A1 (en) |
TW (1) | TWI608936B (en) |
WO (1) | WO2014175127A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102457647B1 (en) * | 2016-09-15 | 2022-10-24 | 미쯔비시 케미컬 주식회사 | Adhesive sheet laminate, shaped adhesive sheet laminate, and method for producing same |
CN114633534A (en) * | 2022-04-12 | 2022-06-17 | 广东鸿翔瑞材料科技有限公司 | High-temperature-resistant release film and preparation method thereof |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001129940A (en) * | 1999-11-02 | 2001-05-15 | Unitika Ltd | Fluoroplastic resin coated polyester film |
JP4099355B2 (en) * | 2001-06-29 | 2008-06-11 | 積水化学工業株式会社 | Sheet |
JP4033691B2 (en) * | 2002-03-06 | 2008-01-16 | ユニチカ株式会社 | Method for producing fluororesin-coated polyester film |
TWI476103B (en) | 2003-07-01 | 2015-03-11 | Sumitomo Bakelite Co | A release film and a method of manufacturing a flexible printed wiring board using the release film |
JPWO2008012940A1 (en) * | 2006-07-24 | 2009-12-17 | 株式会社クラレ | Release film for printed wiring board manufacturing |
JP5631586B2 (en) * | 2007-03-19 | 2014-11-26 | リンテック株式会社 | Release sheet and adhesive |
JP5258310B2 (en) * | 2008-01-21 | 2013-08-07 | 日本ゴア株式会社 | Fluororesin-coated polymer film for polymer electrolyte membrane reinforcement, reinforced polymer electrolyte membrane and membrane electrode assembly |
JP5517573B2 (en) | 2008-12-02 | 2014-06-11 | ユニチカ株式会社 | Release film |
JP2011005664A (en) * | 2009-06-23 | 2011-01-13 | Dainippon Printing Co Ltd | Mold release film and method for manufacturing the same |
JP2011088352A (en) * | 2009-10-22 | 2011-05-06 | Unitika Ltd | Release film |
KR101242330B1 (en) * | 2009-12-30 | 2013-03-12 | (주)엘지하우시스 | Release film and preparation method thereof |
JP5472996B2 (en) * | 2010-03-24 | 2014-04-16 | 信越ポリマー株式会社 | Release film |
-
2014
- 2014-04-16 JP JP2015513699A patent/JP6351576B2/en active Active
- 2014-04-16 WO PCT/JP2014/060769 patent/WO2014175127A1/en active Application Filing
- 2014-04-16 KR KR1020157026004A patent/KR102202907B1/en active IP Right Grant
- 2014-04-16 CN CN201480013789.2A patent/CN105008126A/en active Pending
- 2014-04-21 TW TW103114353A patent/TWI608936B/en active
-
2015
- 2015-12-25 HK HK15112728.7A patent/HK1211904A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN105008126A (en) | 2015-10-28 |
WO2014175127A1 (en) | 2014-10-30 |
KR20160002726A (en) | 2016-01-08 |
TWI608936B (en) | 2017-12-21 |
JPWO2014175127A1 (en) | 2017-02-23 |
KR102202907B1 (en) | 2021-01-14 |
JP6351576B2 (en) | 2018-07-04 |
TW201500199A (en) | 2015-01-01 |
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