HK1200759A1 - Fixed-abrasive-grain wire-saw, method for manufacturing same, and method for cutting workpiece using same - Google Patents

Fixed-abrasive-grain wire-saw, method for manufacturing same, and method for cutting workpiece using same

Info

Publication number
HK1200759A1
HK1200759A1 HK15101379.2A HK15101379A HK1200759A1 HK 1200759 A1 HK1200759 A1 HK 1200759A1 HK 15101379 A HK15101379 A HK 15101379A HK 1200759 A1 HK1200759 A1 HK 1200759A1
Authority
HK
Hong Kong
Prior art keywords
same
abrasive
saw
fixed
cutting workpiece
Prior art date
Application number
HK15101379.2A
Other languages
English (en)
Chinese (zh)
Inventor
植田康弘
Original Assignee
Read Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Read Co Ltd filed Critical Read Co Ltd
Publication of HK1200759A1 publication Critical patent/HK1200759A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
HK15101379.2A 2012-05-31 2015-02-06 Fixed-abrasive-grain wire-saw, method for manufacturing same, and method for cutting workpiece using same HK1200759A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/064043 WO2013179434A1 (ja) 2012-05-31 2012-05-31 固定砥粒ワイヤーソーとその製造方法、及びそれを用いたワークの切断方法

Publications (1)

Publication Number Publication Date
HK1200759A1 true HK1200759A1 (en) 2015-08-14

Family

ID=49672688

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15101379.2A HK1200759A1 (en) 2012-05-31 2015-02-06 Fixed-abrasive-grain wire-saw, method for manufacturing same, and method for cutting workpiece using same

Country Status (9)

Country Link
US (1) US20150040884A1 (de)
EP (1) EP2857143A4 (de)
JP (1) JP6352176B2 (de)
KR (1) KR20150020527A (de)
CN (1) CN104136169A (de)
HK (1) HK1200759A1 (de)
MY (1) MY185161A (de)
PH (1) PH12014502652A1 (de)
WO (1) WO2013179434A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6172053B2 (ja) * 2014-05-28 2017-08-02 信越半導体株式会社 固定砥粒ワイヤ及びワイヤソー並びにワークの切断方法
CN104476689B (zh) * 2014-12-29 2016-07-06 盛利维尔（中国）新材料技术有限公司 一种旋转式加扭平边圆横截面金刚线
CN108136567B (zh) * 2015-09-30 2020-06-16 古河电气工业株式会社 线工具用金刚石磨粒以及线工具
JP6402700B2 (ja) * 2015-10-20 2018-10-10 信越半導体株式会社 ワークの切断方法及びワイヤソー
JP2017213627A (ja) * 2016-05-31 2017-12-07 株式会社Sumco ワークの切断方法
JP6839434B2 (ja) * 2016-08-31 2021-03-10 山形県 ナノカーボン繊維含有固定砥粒ワイヤーソーとその製造方法
JP6249319B1 (ja) * 2017-03-30 2017-12-20 パナソニックＩｐマネジメント株式会社 ソーワイヤー及び切断装置
JP7113365B2 (ja) * 2017-05-10 2022-08-05 パナソニックＩｐマネジメント株式会社 ソーワイヤー及び切断装置
CN107599193A (zh) * 2017-05-24 2018-01-19 浙江好亚能源股份有限公司 采用金钢线高精度切割的单晶硅片切片机
WO2019108112A1 (en) * 2017-11-30 2019-06-06 Husqvarna Ab Wire for a wire saw, a wire saw, a method and device for manufacturing a wire saw
JP6751900B2 (ja) * 2018-01-29 2020-09-09 パナソニックＩｐマネジメント株式会社 金属線及びソーワイヤー
JP6514821B1 (ja) * 2018-11-15 2019-05-15 トクセン工業株式会社 ソーワイヤ
JP7020454B2 (ja) * 2019-05-16 2022-02-16 信越半導体株式会社 ワークの切断方法及びワイヤソー

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513439B1 (de) 1971-05-12 1976-02-03
EP0705454B1 (de) * 1992-07-31 2000-10-04 E.I. Du Pont De Nemours And Company Partikel montageverfahren und produkt
CN2296355Y (zh) * 1997-04-16 1998-11-04 李清煌 布料植绒装置
US6755720B1 (en) * 1999-07-15 2004-06-29 Noritake Co., Limited Vitrified bond tool and method of manufacturing the same
CN2455384Y (zh) * 2000-11-03 2001-10-24 陈有根 滚筒刷
JP2002172564A (ja) * 2000-12-08 2002-06-18 Mitsubishi Materials Corp グラインディングロープ
JP2003305652A (ja) * 2002-04-15 2003-10-28 Mitsubishi Electric Corp 砥 石
US6915796B2 (en) * 2002-09-24 2005-07-12 Chien-Min Sung Superabrasive wire saw and associated methods of manufacture
JP4073328B2 (ja) * 2003-02-04 2008-04-09 株式会社リード 単層固定砥粒ワイヤーソー及びその製造方法並びに切断方法
CN101407089A (zh) * 2006-09-08 2009-04-15 广东科达机电股份有限公司 粉态色料涂胶布料方法及布料设备
US20080098659A1 (en) * 2006-10-26 2008-05-01 Chien-Min Sung Methods for securing individual abrasive particles to a substrate in a predetermined pattern
JP4640353B2 (ja) * 2007-02-16 2011-03-02 三菱電機株式会社 砥石の製造方法
JP5576177B2 (ja) * 2010-04-28 2014-08-20 株式会社リード 固定砥粒ワイヤーソー及びその製造方法
CN201816799U (zh) * 2010-07-14 2011-05-04 福建腾新食品股份有限公司 包装膜自动涂色设备
JP2012066335A (ja) * 2010-09-22 2012-04-05 Sumco Corp 電着固定砥粒ワイヤ

Also Published As

Publication number Publication date
CN104136169A (zh) 2014-11-05
KR20150020527A (ko) 2015-02-26
EP2857143A4 (de) 2016-05-18
WO2013179434A1 (ja) 2013-12-05
EP2857143A1 (de) 2015-04-08
PH12014502652A1 (en) 2015-01-21
JPWO2013179434A1 (ja) 2016-01-14
MY185161A (en) 2021-04-30
JP6352176B2 (ja) 2018-07-04
US20150040884A1 (en) 2015-02-12

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