SG11201400434WA - Method for slicing workpiece and wire saw - Google Patents

Method for slicing workpiece and wire saw

Info

Publication number
SG11201400434WA
SG11201400434WA SG11201400434WA SG11201400434WA SG11201400434WA SG 11201400434W A SG11201400434W A SG 11201400434WA SG 11201400434W A SG11201400434W A SG 11201400434WA SG 11201400434W A SG11201400434W A SG 11201400434WA SG 11201400434W A SG11201400434W A SG 11201400434WA
Authority
SG
Singapore
Prior art keywords
wire saw
slicing
workpiece
slicing workpiece
saw
Prior art date
Application number
SG11201400434WA
Inventor
Yukio Itoi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201400434WA publication Critical patent/SG11201400434WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201400434WA 2011-10-04 2012-08-29 Method for slicing workpiece and wire saw SG11201400434WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011220093A JP5590001B2 (en) 2011-10-04 2011-10-04 Work cutting method and wire saw
PCT/JP2012/005419 WO2013051183A1 (en) 2011-10-04 2012-08-29 Workpiece cutting method and wire saw

Publications (1)

Publication Number Publication Date
SG11201400434WA true SG11201400434WA (en) 2014-08-28

Family

ID=48043369

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201400434WA SG11201400434WA (en) 2011-10-04 2012-08-29 Method for slicing workpiece and wire saw

Country Status (8)

Country Link
US (1) US9707635B2 (en)
JP (1) JP5590001B2 (en)
KR (1) KR101905833B1 (en)
CN (1) CN103842129B (en)
DE (1) DE112012004125B4 (en)
SG (1) SG11201400434WA (en)
TW (1) TWI523716B (en)
WO (1) WO2013051183A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014208187B4 (en) 2014-04-30 2023-07-06 Siltronic Ag Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece
CN104842251B (en) * 2015-05-22 2017-04-19 南通尚道机械制造有限公司 Numerical control wire grinding and cutting machining center
JP6272801B2 (en) * 2015-07-27 2018-01-31 信越半導体株式会社 Work holder and work cutting method
JP6493243B2 (en) * 2016-02-15 2019-04-03 株式会社Sumco Wafer manufacturing method
CN108044821A (en) * 2018-02-07 2018-05-18 湖南宇晶机器股份有限公司 A kind of U-shaped short wheelbase high-speed and high-efficiency multi-line cutting method
CN108466376A (en) * 2018-03-20 2018-08-31 山东大海新能源发展有限公司 A kind of diamond wire extracting machine for cutting silicon materials
CN108942597A (en) * 2018-07-23 2018-12-07 罗开亮 High-strength steel strip environmental protection and energy saving burnishing device
EP3943265A1 (en) * 2020-07-21 2022-01-26 Siltronic AG Method and device for simultaneously separating a plurality of plates from a workpiece

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3194099A (en) * 1961-09-11 1965-07-13 Palter Herman Punch press having cam means directly driving rotary work-feed means
US3400494A (en) * 1965-09-24 1968-09-10 Seitz Russell Apparatus for machining hard materials
US3774490A (en) * 1968-11-18 1973-11-27 Restaurant Equipment Design Co Slicing device
JPS54112084A (en) * 1978-02-21 1979-09-01 Matsushita Electric Ind Co Ltd Wire type machining device
JPS588558A (en) 1981-04-15 1983-01-18 三晃技研株式会社 Device for crushing and discharging adhesive material
JPS588558U (en) * 1981-07-07 1983-01-20 シチズン時計株式会社 Multi-groove pulley of mechanical wire saw
JP2673544B2 (en) * 1988-06-14 1997-11-05 株式会社日平トヤマ Cutting method for brittle materials
JP2674207B2 (en) * 1989-05-08 1997-11-12 住友金属工業株式会社 Cutting method for brittle materials
JPH10249701A (en) 1997-03-17 1998-09-22 Super Silicon Kenkyusho:Kk Wire saw cutting method and device for ingot
US6371101B1 (en) * 1997-05-07 2002-04-16 Hct Shaping Systems Sa Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers
JPH11138412A (en) * 1997-11-14 1999-05-25 Tokyo Seimitsu Co Ltd Wire saw having fixed abrasive grains and its cutting method of workpiece to be cut
JP2000005999A (en) * 1998-06-24 2000-01-11 Tokyo Seimitsu Co Ltd Groove roller for wire saw
JP2008100298A (en) * 2006-10-17 2008-05-01 Seiko Epson Corp Multi-wire saw apparatus, and method for adjusting multi-wire saw apparatus
JP5003294B2 (en) * 2007-06-08 2012-08-15 信越半導体株式会社 Cutting method
CN101618519B (en) * 2008-07-01 2011-09-14 内蒙古晟纳吉光伏材料有限公司 Method and device thereof for linearly cutting silicon slice
JP5056645B2 (en) 2008-07-23 2012-10-24 信越半導体株式会社 Work cutting method and wire saw
JP2010110865A (en) * 2008-11-07 2010-05-20 Kanai Hiroaki Wire saw machine
JP5201086B2 (en) 2009-06-10 2013-06-05 信越半導体株式会社 Work cutting method
US20110126813A1 (en) 2009-12-01 2011-06-02 Diamond Wire Technology, Inc. Multi-wire wafer cutting apparatus and method
DE102010005718B4 (en) * 2010-01-26 2011-09-22 Schott Solar Ag Wire guide roller for use in wire saws
TW201441355A (en) * 2013-04-19 2014-11-01 Saint Gobain Abrasives Inc Abrasive article and method of forming
DE102013219468B4 (en) * 2013-09-26 2015-04-23 Siltronic Ag A method of simultaneously separating a plurality of slices from a workpiece

Also Published As

Publication number Publication date
TW201328803A (en) 2013-07-16
WO2013051183A1 (en) 2013-04-11
CN103842129A (en) 2014-06-04
KR101905833B1 (en) 2018-10-08
TWI523716B (en) 2016-03-01
JP5590001B2 (en) 2014-09-17
KR20140073515A (en) 2014-06-16
DE112012004125T5 (en) 2014-07-10
US9707635B2 (en) 2017-07-18
US20140216222A1 (en) 2014-08-07
JP2013078824A (en) 2013-05-02
CN103842129B (en) 2016-06-01
DE112012004125B4 (en) 2022-07-14

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