HK1199960A1 - 用於製造適用於印刷電路板的 取向部件的擠壓工藝 - Google Patents

用於製造適用於印刷電路板的 取向部件的擠壓工藝

Info

Publication number
HK1199960A1
HK1199960A1 HK15100286.6A HK15100286A HK1199960A1 HK 1199960 A1 HK1199960 A1 HK 1199960A1 HK 15100286 A HK15100286 A HK 15100286A HK 1199960 A1 HK1199960 A1 HK 1199960A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
circuit board
printed circuit
extrusion process
directed component
Prior art date
Application number
HK15100286.6A
Other languages
English (en)
Inventor
Paul Kevin Hall
Keith Bryan Hardin
Zachary Charles Nathan Kratzer
Qing Zhang
Original Assignee
Lexmark Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark Int Inc filed Critical Lexmark Int Inc
Publication of HK1199960A1 publication Critical patent/HK1199960A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0248—Skew reduction or using delay lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
HK15100286.6A 2011-09-30 2015-01-12 用於製造適用於印刷電路板的 取向部件的擠壓工藝 HK1199960A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/250,812 US8752280B2 (en) 2011-09-30 2011-09-30 Extrusion process for manufacturing a Z-directed component for a printed circuit board
PCT/US2012/056840 WO2013048937A1 (en) 2011-09-30 2012-09-24 Extrusion process for manufacturing a z-directed component for a printed circuit board

Publications (1)

Publication Number Publication Date
HK1199960A1 true HK1199960A1 (zh) 2015-07-24

Family

ID=47991280

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15100286.6A HK1199960A1 (zh) 2011-09-30 2015-01-12 用於製造適用於印刷電路板的 取向部件的擠壓工藝

Country Status (7)

Country Link
US (2) US8752280B2 (zh)
EP (1) EP2761392B1 (zh)
KR (1) KR101947355B1 (zh)
CN (1) CN103858066B (zh)
HK (1) HK1199960A1 (zh)
SG (1) SG11201400182UA (zh)
WO (1) WO2013048937A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8943684B2 (en) * 2011-08-31 2015-02-03 Lexmark International, Inc. Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
US20130341078A1 (en) * 2012-06-20 2013-12-26 Keith Bryan Hardin Z-directed printed circuit board components having a removable end portion and methods therefor
CN102917535A (zh) * 2012-11-16 2013-02-06 东莞生益电子有限公司 导热金属芯及用该导热金属芯的pcb板
US11948724B2 (en) * 2021-06-18 2024-04-02 Vishay Dale Electronics, Llc Method for making a multi-thickness electro-magnetic device

Family Cites Families (149)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2005582A (en) 1934-03-06 1935-06-18 Bell Telephone Labor Inc Inductive device
US2188667A (en) 1935-01-08 1940-01-30 Globe Union Inc Resistor and method of making the same
US3148356A (en) 1959-09-14 1964-09-08 Jr George A Hedden Printed circuit connector
US3142783A (en) * 1959-12-22 1964-07-28 Hughes Aircraft Co Electrical circuit system
US3219886A (en) 1959-12-28 1965-11-23 Bunker Ramo Modular circuit fabrication
US3262033A (en) 1963-09-05 1966-07-19 John H Culbertson Variable capacitor
US3377611A (en) 1966-12-12 1968-04-09 Walter S. Pawl Rigid parallel sided squeeze slot connector
US3545079A (en) 1968-05-02 1970-12-08 Vitramon Inc Method of making multilayer circuit system
US3652971A (en) 1970-02-11 1972-03-28 Kendick Mfg Co Self-aligning slip ring capsule
US3666160A (en) 1970-06-30 1972-05-30 Contacts Inc Method and apparatus for feeding discrete parts to a cold heading machine
US3691326A (en) 1971-06-14 1972-09-12 Abraham Grossman Rotary thumbwheel switch construction
US3798394A (en) 1972-10-11 1974-03-19 Bell Telephone Labor Inc Keyboard switch assembly with conductive diaphragm operators and rotary switch operators for adjustably selecting a multidigit number
DE2448256C3 (de) 1974-10-10 1979-02-08 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur Herstellung von Glasfasern für optische Nachrichtenübertragung
US3996440A (en) 1975-04-04 1976-12-07 Rca Corporation Multiposition rotary switch with detent means
DE2532009C3 (de) 1975-07-17 1979-05-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung eines elektrischen Bauteiles aus mindestens zwei Einzelteilen, die durch eine Isolierschicht getrennt sind
US4109296A (en) 1977-08-01 1978-08-22 Ncr Corporation Machine insertable circuit board electronic component
US4109295A (en) 1977-08-01 1978-08-22 Ncr Corporation Solderless circuit board component
US4199209A (en) 1978-08-18 1980-04-22 Amp Incorporated Electrical interconnecting device
EP0020373B1 (en) 1978-12-04 1983-06-08 Caterpillar Tractor Co. Method of making and using a ceramic shell mold
US4381134A (en) 1981-03-13 1983-04-26 Bell Telephone Laboratories, Incorporated Electrical connector for plated-through holes
US4561486A (en) 1981-04-30 1985-12-31 Hoxan Corporation Method for fabricating polycrystalline silicon wafer
DK147397C (da) 1981-11-27 1985-02-04 Expandet Screw Anchors Fremgangsmaade til tilspidsning af en endedel af en ekstruderet plastmurploek eller et lignende roerformet plastlegeme og formevaerktoej til brug ved udoevelse af fremgangsmaaden
US4446505A (en) 1982-03-22 1984-05-01 Amp Incorporated Electrical connector for interconnecting printed circuit boards
JPS5942631U (ja) 1982-09-10 1984-03-19 株式会社村田製作所 雑音除去フイルタ
US4543715A (en) 1983-02-28 1985-10-01 Allied Corporation Method of forming vertical traces on printed circuit board
JPS59219002A (ja) 1983-05-26 1984-12-10 Elmec Corp 電子制御可変遅延線の調整方法
US4711015A (en) 1984-10-17 1987-12-08 Metalmeccanica Gori & Zucchi M.G.Z, S.P.A. Apparatus for handling and assembling axial electronic components on printed circuit cards
US4654472A (en) 1984-12-17 1987-03-31 Samuel Goldfarb Electronic component package with multiconductive base forms for multichannel mounting
US4675625A (en) 1985-03-26 1987-06-23 Rogers Corporation Rolled delay line of the coplanar line type
US4591947A (en) * 1985-05-22 1986-05-27 Corning Glass Works Tubular capacitor and method of making
US4654749A (en) 1985-07-30 1987-03-31 Murata Manufacturing Co., Ltd. High-voltage ceramic capacitor and method of producing the same
ATE61162T1 (de) 1985-12-11 1991-03-15 Burndy Electra Nv Kontaktstift.
US4850892A (en) 1985-12-16 1989-07-25 Wang Laboratories, Inc. Connecting apparatus for electrically connecting memory modules to a printed circuit board
US4735753A (en) 1986-07-28 1988-04-05 Ackermann Walter T Method of making a fastener
US4789346A (en) 1987-03-27 1988-12-06 Amp Incorporated Solder post alignment and retention system
US5010945A (en) 1988-11-10 1991-04-30 Lanxide Technology Company, Lp Investment casting technique for the formation of metal matrix composite bodies and products produced thereby
US4913863A (en) * 1989-01-30 1990-04-03 Hoechst Celanese Corporation Split extrusion die assembly for thermoplastic materials and methods of using the same
US5030144A (en) 1990-04-13 1991-07-09 North American Specialties Corporation Solder-bearing lead
US5147985A (en) 1990-08-14 1992-09-15 The Scabbard Corporation Sheet batteries as substrate for electronic circuit
US5166096A (en) 1991-10-29 1992-11-24 International Business Machines Corporation Process for fabricating self-aligned contact studs for semiconductor structures
US5240671A (en) * 1992-06-01 1993-08-31 Microelectronics And Computer Technology Corporation Method of forming recessed patterns in insulating substrates
EP0608628A3 (en) 1992-12-25 1995-01-18 Kawasaki Steel Co Method for manufacturing a semiconductor device having a multi-layer interconnection structure.
US5406444A (en) 1993-03-29 1995-04-11 Medtronic, Inc. Coated tantalum feedthrough pin
US5603847A (en) 1993-04-07 1997-02-18 Zycon Corporation Annular circuit components coupled with printed circuit board through-hole
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
EP0732777A3 (en) 1995-03-14 1997-06-18 At & T Corp Row of electromagnetic interference suppression contacts
US5783026A (en) 1995-05-24 1998-07-21 International Business Machines Corporation Apparatus for stacking sheets by carriers
JPH0974072A (ja) 1995-09-05 1997-03-18 Toshiba Corp 半導体装置の製造方法
US5650759A (en) 1995-11-09 1997-07-22 Hittman Materials & Medical Components, Inc. Filtered feedthrough assembly having a mounted chip capacitor for medical implantable devices and method of manufacture therefor
US6329715B1 (en) 1996-09-20 2001-12-11 Tdk Corporation Passive electronic parts, IC parts, and wafer
US5858145A (en) 1996-10-15 1999-01-12 Sarnoff Corporation Method to control cavity dimensions of fired multilayer circuit boards on a support
GB2324648A (en) 1997-03-26 1998-10-28 Jack Wang Burn and explosion-resistant circuit package for a varistor chip
US5870921A (en) 1997-07-31 1999-02-16 Piccinin; Gabriel Extrusion die for semi-hollow and hollow extruded shapes and tube
JP3277854B2 (ja) 1997-08-08 2002-04-22 株式会社村田製作所 ノイズ抑制機能付き絶縁被覆電線
JP3322199B2 (ja) 1998-01-06 2002-09-09 株式会社村田製作所 多層セラミック基板およびその製造方法
US6045615A (en) 1998-01-28 2000-04-04 International Business Machines Corporation Homogeneous screening nozzle
US6068782A (en) 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
US6165864A (en) 1998-07-28 2000-12-26 Siemens Aktiengesellschaft Tapered electrode for stacked capacitors
US6725536B1 (en) 1999-03-10 2004-04-27 Micron Technology, Inc. Methods for the fabrication of electrical connectors
US6388208B1 (en) 1999-06-11 2002-05-14 Teradyne, Inc. Multi-connection via with electrically isolated segments
US6280019B1 (en) 1999-08-30 2001-08-28 Hewlett-Packard Company Segmented resistor inkjet drop generator with current crowding reduction
DE19949985C2 (de) 1999-10-15 2001-08-16 Sie Sensorik Ind Elektronik Gm Kapazitiver Sensor zur Detektion des Füllstandes eines Mediums in einem Behälter
US6319018B1 (en) 2000-02-29 2001-11-20 Avaya Technology Corp. Circuit board electrical and physical connection system and method
US6581276B2 (en) 2000-04-04 2003-06-24 Amerasia International Technology, Inc. Fine-pitch flexible connector, and method for making same
US6778404B1 (en) 2000-06-02 2004-08-17 Micron Technology Inc Stackable ball grid array
US6754551B1 (en) 2000-06-29 2004-06-22 Printar Ltd. Jet print apparatus and method for printed circuit board manufacturing
US20020086188A1 (en) 2000-10-12 2002-07-04 Eugene Halsey Reduced contrast improved transmission conductively coated transparent substrate
US6621012B2 (en) 2001-02-01 2003-09-16 International Business Machines Corporation Insertion of electrical component within a via of a printed circuit board
JP4002076B2 (ja) 2001-04-19 2007-10-31 Ｔｄｋ株式会社 マスクを用いたスピンコーティング装置およびスピンコーティング用マスク
US6509530B2 (en) 2001-06-22 2003-01-21 Intel Corporation Via intersect pad for electronic components and methods of manufacture
US6593535B2 (en) 2001-06-26 2003-07-15 Teradyne, Inc. Direct inner layer interconnect for a high speed printed circuit board
US20030081370A1 (en) 2001-10-15 2003-05-01 Haskell Donald K. Apparatus and process for the control of electromagnetic fields on the surface of EMI filter capacitors
US6747217B1 (en) 2001-11-20 2004-06-08 Unisys Corporation Alternative to through-hole-plating in a printed circuit board
US6490148B1 (en) 2002-01-02 2002-12-03 Greatbatch-Hittman, Incorporated Installation of filter capacitors into feedthroughs for implantable medical devices
US6948943B2 (en) 2002-03-06 2005-09-27 Intel Corporation Shunting arrangements to reduce high currents in grid array connectors
US7319197B2 (en) 2002-05-23 2008-01-15 International Business Machines Corporation Structure of stacked vias in multiple layer electrode device carriers
US6950066B2 (en) 2002-08-22 2005-09-27 Skycross, Inc. Apparatus and method for forming a monolithic surface-mountable antenna
KR100467834B1 (ko) 2002-12-23 2005-01-25 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
WO2004061931A1 (ja) 2002-12-26 2004-07-22 Fujitsu Limited 多層配線構造を有する半導体装置およびその製造方法
DE10319383A1 (de) 2003-04-30 2004-11-18 Delphi Technologies, Inc., Troy Elektrischer Drehschalter
TW570397U (en) 2003-05-09 2004-01-01 Hon Hai Prec Ind Co Ltd Modular jack
JP2004355999A (ja) 2003-05-30 2004-12-16 Sumitomo Wiring Syst Ltd 回路基板用端子
US6870252B2 (en) 2003-06-18 2005-03-22 Sun Microsystems, Inc. Chip packaging and connection for reduced EMI
KR100649580B1 (ko) 2003-12-15 2006-11-28 삼성전기주식회사 스핀코팅에 의한 적층세라믹 커패시터의 제조방법 및적층세라믹 커패시터
US7486498B2 (en) 2004-01-12 2009-02-03 Case Western Reserve University Strong substrate alloy and compressively stressed dielectric film for capacitor with high energy density
US7258549B2 (en) 2004-02-20 2007-08-21 Matsushita Electric Industrial Co., Ltd. Connection member and mount assembly and production method of the same
US20050286238A1 (en) 2004-06-24 2005-12-29 Joy Stephen C Device and method of manufacture of an interconnection structure for printed circuit boards
US20060009038A1 (en) 2004-07-12 2006-01-12 International Business Machines Corporation Processing for overcoming extreme topography
JP2006041276A (ja) 2004-07-28 2006-02-09 Toshiba Corp 半導体装置およびその製造方法
US7199016B2 (en) 2004-08-13 2007-04-03 Raytheon Company Integrated circuit resistor
US7567163B2 (en) 2004-08-31 2009-07-28 Pulse Engineering, Inc. Precision inductive devices and methods
KR100598275B1 (ko) 2004-09-15 2006-07-10 삼성전기주식회사 수동소자 내장형 인쇄회로기판 및 그 제조 방법
US7663064B2 (en) 2004-09-25 2010-02-16 Banpil Photonics, Inc. High-speed flex printed circuit and method of manufacturing
JP4220460B2 (ja) 2004-11-30 2009-02-04 Ｔｄｋ株式会社 外部電極形成方法
US7652896B2 (en) 2004-12-29 2010-01-26 Hewlett-Packard Development Company, L.P. Component for impedance matching
KR100632554B1 (ko) 2004-12-30 2006-10-11 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
WO2006076258A2 (en) 2005-01-10 2006-07-20 Tortured Path-Emi Solutions Llc Three-dimensional configurations providing electromagnetic interference shielding for electronics enclosures
CN101405917A (zh) 2005-03-15 2009-04-08 伊凯思公司 用于将大体三维结构附接到大体二维结构的系统和方法
US7548432B2 (en) 2005-03-24 2009-06-16 Agency For Science, Technology And Research Embedded capacitor structure
JP2006310441A (ja) 2005-04-27 2006-11-09 Matsushita Electric Ind Co Ltd 回転型電子部品
US7834527B2 (en) 2005-05-05 2010-11-16 SmartMotion Technologies, Inc. Dielectric elastomer fiber transducers
CN100531511C (zh) 2005-05-28 2009-08-19 鸿富锦精密工业（深圳）有限公司 具有改良差分过孔的印刷电路板
WO2006132086A1 (ja) 2005-06-10 2006-12-14 Murata Manufacturing Co., Ltd. 誘電体セラミック、及び積層セラミックコンデンサ
JP2007027683A (ja) 2005-06-15 2007-02-01 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US20060286696A1 (en) 2005-06-21 2006-12-21 Peiffer Joel S Passive electrical article
US7238892B2 (en) 2005-07-25 2007-07-03 Hewlett-Packard Development Company, L.P. Printed circuit board including pads with vacancies
WO2007014655A2 (en) 2005-08-01 2007-02-08 Technoform Caprano Und Brunnhofer Gmbh & Co. Kg A composite spacer strip material
US20070099513A1 (en) 2005-10-31 2007-05-03 Savage Dan J Plug-in device and method of making the same
US7599191B2 (en) 2005-11-01 2009-10-06 Avx Corporation Electrochemical low ESR capacitor with connector
SE529278C2 (sv) 2005-11-07 2007-06-19 Abb Technology Ltd Kondensatorelement, förfarande för tillverkning av ett kondensatorelement samt användning av en kraftkondensator
US7404250B2 (en) 2005-12-02 2008-07-29 Cisco Technology, Inc. Method for fabricating a printed circuit board having a coaxial via
US20090046441A1 (en) 2006-01-06 2009-02-19 Nec Corporation Wiring board for mounting semiconductor device, manufacturing method of the same, and wiring board assembly
US7638988B2 (en) 2006-02-21 2009-12-29 Virginia Tech Intellectual Properties, Inc. Co-fired ceramic inductors with variable inductance, and voltage regulator having same
US7843302B2 (en) 2006-05-08 2010-11-30 Ibiden Co., Ltd. Inductor and electric power supply using it
JP4293560B2 (ja) 2006-07-12 2009-07-08 Ｔｄｋ株式会社 積層コンデンサアレイ
US7704614B2 (en) 2006-10-20 2010-04-27 Seagate Technology Llc Process for fabricating patterned magnetic recording media
US8133762B2 (en) 2009-03-17 2012-03-13 Stats Chippac, Ltd. Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core
KR100735339B1 (ko) 2006-12-29 2007-07-04 삼성전기주식회사 박막 캐패시터 내장형 배선 기판의 제조방법
TWI324901B (en) 2007-01-08 2010-05-11 Unimicron Technology Corp Printed circuit board structure integrating electronic components
US8153906B2 (en) 2007-01-10 2012-04-10 Hsu Hsiuan-Ju Interconnection structure for improving signal integrity
US7782629B2 (en) 2007-02-26 2010-08-24 Flextronics Ap, Llc Embedding an electronic component between surfaces of a printed circuit board
KR100849791B1 (ko) 2007-03-12 2008-07-31 삼성전기주식회사 캐패시터 내장형 인쇄회로기판
US7674987B2 (en) 2007-03-29 2010-03-09 Ibiden Co., Ltd. Multilayer printed circuit board
US7804678B2 (en) 2007-04-25 2010-09-28 Industrial Technology Research Institute Capacitor devices
KR100907896B1 (ko) 2007-06-22 2009-07-14 주식회사 동부하이텍 시스템 인 패키지의 금속 전극 형성방법
JP4895936B2 (ja) 2007-07-19 2012-03-14 新光電気工業株式会社 導電性ボールの搭載方法
JP2009094333A (ja) 2007-10-10 2009-04-30 Nippon Mektron Ltd キャパシタを内蔵したプリント配線板およびその製造方法
US7847191B2 (en) 2007-11-06 2010-12-07 Xerox Corporation Electrical component, manufacturing system and method
US8115113B2 (en) 2007-11-30 2012-02-14 Ibiden Co., Ltd. Multilayer printed wiring board with a built-in capacitor
US20090154872A1 (en) 2007-12-18 2009-06-18 Sherrer David S Electronic device package and method of formation
US8064214B2 (en) 2008-01-04 2011-11-22 Dialogic Corporation Press fit passive component
KR101004843B1 (ko) 2008-09-05 2010-12-28 삼성전기주식회사 세라믹 다층 회로 기판 및 그의 제조 방법
US7891980B2 (en) 2008-11-05 2011-02-22 Dialogic Corporation Interconnect device with discrete in-line components
US8107254B2 (en) 2008-11-20 2012-01-31 International Business Machines Corporation Integrating capacitors into vias of printed circuit boards
US7843056B2 (en) 2009-02-20 2010-11-30 National Semiconductor Corporation Integrated circuit micro-module
US7989270B2 (en) 2009-03-13 2011-08-02 Stats Chippac, Ltd. Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
US8094429B2 (en) 2009-06-22 2012-01-10 Industrial Technology Research Institute Multilayer capacitors and methods for making the same
US20100331643A1 (en) * 2009-06-30 2010-12-30 Abbott Diabetes Care Inc. Extruded Analyte Sensors and Methods of Using Same
US8437827B2 (en) 2009-06-30 2013-05-07 Abbott Diabetes Care Inc. Extruded analyte sensors and methods of using same
US20110017581A1 (en) 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Switch Components for Printed Circuit Boards
US8278568B2 (en) 2009-07-23 2012-10-02 Lexmark International, Inc. Z-directed variable value components for printed circuit boards
US20110017502A1 (en) 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Components for Printed Circuit Boards
US8735734B2 (en) 2009-07-23 2014-05-27 Lexmark International, Inc. Z-directed delay line components for printed circuit boards
US20110017504A1 (en) 2009-07-23 2011-01-27 Keith Bryan Hardin Z-Directed Ferrite Bead Components for Printed Circuit Boards
US8237061B2 (en) 2009-07-23 2012-08-07 Lexmark International, Inc. Z-directed filter components for printed circuit boards
US8198548B2 (en) 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed capacitor components for printed circuit boards
US8198547B2 (en) 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed pass-through components for printed circuit boards
US8273996B2 (en) 2009-07-23 2012-09-25 Lexmark International, Inc. Z-directed connector components for printed circuit boards
US8021930B2 (en) 2009-08-12 2011-09-20 Stats Chippac, Ltd. Semiconductor device and method of forming dam material around periphery of die to reduce warpage

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EP2761392A4 (en) 2016-08-17
WO2013048937A1 (en) 2013-04-04
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US20140237816A1 (en) 2014-08-28
KR20140077175A (ko) 2014-06-23
CN103858066A (zh) 2014-06-11
CN103858066B (zh) 2018-01-02
EP2761392A1 (en) 2014-08-06
US8752280B2 (en) 2014-06-17
SG11201400182UA (en) 2014-05-29
EP2761392B1 (en) 2018-11-28

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