HK1175300A1 - Germanium-based quantum well devices - Google Patents
Germanium-based quantum well devicesInfo
- Publication number
- HK1175300A1 HK1175300A1 HK13102218.7A HK13102218A HK1175300A1 HK 1175300 A1 HK1175300 A1 HK 1175300A1 HK 13102218 A HK13102218 A HK 13102218A HK 1175300 A1 HK1175300 A1 HK 1175300A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- germanium
- quantum well
- based quantum
- well devices
- devices
- Prior art date
Links
- 229910052732 germanium Inorganic materials 0.000 title 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title 1
Classifications
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
- H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
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- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
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- H01L21/02532—Silicon, silicon germanium, germanium
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- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
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- H01L29/151—Compositional structures
- H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
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- H01L29/66409—Unipolar field-effect transistors
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66553—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using inside spacers, permanent or not
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- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
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- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/655,468 US8193523B2 (en) | 2009-12-30 | 2009-12-30 | Germanium-based quantum well devices |
PCT/US2010/059620 WO2011090583A2 (fr) | 2009-12-30 | 2010-12-09 | Dispositifs à puits quantique à base de germanium |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1175300A1 true HK1175300A1 (en) | 2013-06-28 |
Family
ID=44186313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13102218.7A HK1175300A1 (en) | 2009-12-30 | 2013-02-21 | Germanium-based quantum well devices |
Country Status (8)
Country | Link |
---|---|
US (5) | US8193523B2 (fr) |
EP (2) | EP2519974A4 (fr) |
JP (2) | JP5670473B2 (fr) |
KR (2) | KR101640420B1 (fr) |
CN (1) | CN102687273B (fr) |
HK (1) | HK1175300A1 (fr) |
TW (2) | TWI467758B (fr) |
WO (1) | WO2011090583A2 (fr) |
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US8193523B2 (en) * | 2009-12-30 | 2012-06-05 | Intel Corporation | Germanium-based quantum well devices |
JP5506036B2 (ja) * | 2010-03-02 | 2014-05-28 | 古河電気工業株式会社 | 半導体トランジスタ |
US9099388B2 (en) * | 2011-10-21 | 2015-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | III-V multi-channel FinFETs |
US8610172B2 (en) * | 2011-12-15 | 2013-12-17 | International Business Machines Corporation | FETs with hybrid channel materials |
WO2013095343A1 (fr) | 2011-12-19 | 2013-06-27 | Intel Corporation | Transistors à nanofils du groupe iii-n |
CN106847805B (zh) * | 2011-12-23 | 2020-08-21 | 英特尔公司 | 具有包含不同材料取向或组成的纳米线或半导体主体的共衬底半导体器件 |
EP2701198A3 (fr) | 2012-08-24 | 2017-06-28 | Imec | Dispositif avec couche contrainte pour confinement de puits quantique et son procédé de fabrication |
US8823059B2 (en) * | 2012-09-27 | 2014-09-02 | Intel Corporation | Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack |
US8896101B2 (en) | 2012-12-21 | 2014-11-25 | Intel Corporation | Nonplanar III-N transistors with compositionally graded semiconductor channels |
US9166363B2 (en) * | 2012-12-31 | 2015-10-20 | Faquir C. Jain | Enhanced optical gain and lasing in indirect gap semiconductor thin films and nanostructures |
CN103390591B (zh) | 2013-07-22 | 2015-11-25 | 中国科学院半导体研究所 | 硅基高迁移率Ⅲ-V/Ge沟道的CMOS制备方法 |
KR20150025622A (ko) * | 2013-08-29 | 2015-03-11 | 삼성전자주식회사 | 반도체 구조물 및 그 제조방법 |
US20160204207A1 (en) * | 2013-09-27 | 2016-07-14 | Intel Corporation | Composite High-K Metal Gate Stack for Enhancement Mode GaN Semiconductor Devices |
US20160190319A1 (en) * | 2013-09-27 | 2016-06-30 | Intel Corporation | Non-Planar Semiconductor Devices having Multi-Layered Compliant Substrates |
US9373706B2 (en) | 2014-01-24 | 2016-06-21 | Samsung Electronics Co., Ltd. | Methods of forming semiconductor devices, including forming a semiconductor material on a fin, and related semiconductor devices |
US9472667B2 (en) | 2015-01-08 | 2016-10-18 | International Business Machines Corporation | III-V MOSFET with strained channel and semi-insulating bottom barrier |
EP3125273A1 (fr) | 2015-07-31 | 2017-02-01 | IMEC vzw | Canaux du groupe iv contraints |
CN106611787A (zh) * | 2015-10-26 | 2017-05-03 | 联华电子股份有限公司 | 半导体结构及其制作方法 |
WO2017213645A1 (fr) * | 2016-06-09 | 2017-12-14 | Intel Corporation | Dispositifs à points quantiques à empilements dopés par modulation |
WO2017213646A1 (fr) * | 2016-06-09 | 2017-12-14 | Intel Corporation | Dispositifs à points quantiques pourvus d'empilements à dopage modulé |
WO2017213659A1 (fr) * | 2016-06-10 | 2017-12-14 | Intel Corporation | Dispositifs à points quantiques dotés de matériaux d'interface de grille |
US10615160B2 (en) | 2016-09-25 | 2020-04-07 | Intel Corporation | Quantum dot array devices |
EP3520144B1 (fr) * | 2016-09-30 | 2023-09-06 | HRL Laboratories, LLC | Matériaux diélectriques de grille dopés |
US10043941B1 (en) | 2017-01-31 | 2018-08-07 | International Business Machines Corporation | Light emitting diode having improved quantum efficiency at low injection current |
WO2019004990A1 (fr) * | 2017-06-25 | 2019-01-03 | Intel Corporation | Dispositifs à points quantiques |
FR3080710B1 (fr) * | 2018-04-25 | 2021-12-24 | Commissariat Energie Atomique | Transistor hemt et procedes de fabrication favorisant une longueur et des fuites de grille reduites |
US11749721B2 (en) * | 2018-09-28 | 2023-09-05 | Intel Corporation | Gate walls for quantum dot devices |
CN113193041A (zh) * | 2021-04-30 | 2021-07-30 | 陕西科技大学 | 一种锑化物量子阱cmos器件的结构及其制备方法 |
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- 2010-12-09 KR KR1020147003586A patent/KR101640420B1/ko active IP Right Grant
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Also Published As
Publication number | Publication date |
---|---|
CN102687273A (zh) | 2012-09-19 |
EP2519974A2 (fr) | 2012-11-07 |
US9876014B2 (en) | 2018-01-23 |
US20160064520A1 (en) | 2016-03-03 |
EP2519974A4 (fr) | 2014-10-08 |
KR20120089353A (ko) | 2012-08-09 |
WO2011090583A3 (fr) | 2011-10-13 |
CN102687273B (zh) | 2015-05-20 |
JP5670473B2 (ja) | 2015-02-18 |
US9219135B2 (en) | 2015-12-22 |
US9478635B2 (en) | 2016-10-25 |
US20170012116A1 (en) | 2017-01-12 |
JP5755777B2 (ja) | 2015-07-29 |
KR101640420B1 (ko) | 2016-07-18 |
KR101374515B1 (ko) | 2014-03-13 |
KR20140028147A (ko) | 2014-03-07 |
US20110156005A1 (en) | 2011-06-30 |
US8193523B2 (en) | 2012-06-05 |
US20140061589A1 (en) | 2014-03-06 |
JP2014160847A (ja) | 2014-09-04 |
EP2933839A3 (fr) | 2016-01-20 |
JP2013513975A (ja) | 2013-04-22 |
TWI609485B (zh) | 2017-12-21 |
TW201507150A (zh) | 2015-02-16 |
US20120193609A1 (en) | 2012-08-02 |
EP2933839A2 (fr) | 2015-10-21 |
US8592803B2 (en) | 2013-11-26 |
TWI467758B (zh) | 2015-01-01 |
WO2011090583A2 (fr) | 2011-07-28 |
TW201133834A (en) | 2011-10-01 |
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