HK1171572A1 - Apparatus for delivering semiconductor components to a substrate during semiconductor package manufacturing - Google Patents

Apparatus for delivering semiconductor components to a substrate during semiconductor package manufacturing

Info

Publication number
HK1171572A1
HK1171572A1 HK12112358.7A HK12112358A HK1171572A1 HK 1171572 A1 HK1171572 A1 HK 1171572A1 HK 12112358 A HK12112358 A HK 12112358A HK 1171572 A1 HK1171572 A1 HK 1171572A1
Authority
HK
Hong Kong
Prior art keywords
substrate during
delivering
package manufacturing
semiconductor package
semiconductor components
Prior art date
Application number
HK12112358.7A
Other languages
English (en)
Chinese (zh)
Inventor
林鉅淦鄧諺羲張偉源林永堅
Original Assignee
先進科技新加坡有限公司 義順
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 先進科技新加坡有限公司 義順 filed Critical 先進科技新加坡有限公司 義順
Publication of HK1171572A1 publication Critical patent/HK1171572A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y10T29/515—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means to trim electric component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK12112358.7A 2011-05-25 2012-11-29 Apparatus for delivering semiconductor components to a substrate during semiconductor package manufacturing HK1171572A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/115,261 US8590143B2 (en) 2011-05-25 2011-05-25 Apparatus for delivering semiconductor components to a substrate

Publications (1)

Publication Number Publication Date
HK1171572A1 true HK1171572A1 (en) 2013-03-28

Family

ID=47199681

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12112358.7A HK1171572A1 (en) 2011-05-25 2012-11-29 Apparatus for delivering semiconductor components to a substrate during semiconductor package manufacturing

Country Status (8)

Country Link
US (1) US8590143B2 (ja)
JP (1) JP5636391B2 (ja)
KR (1) KR101388948B1 (ja)
CN (1) CN102800613B (ja)
HK (1) HK1171572A1 (ja)
MY (1) MY155118A (ja)
SG (1) SG185905A1 (ja)
TW (1) TWI489581B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103406867B (zh) * 2013-03-06 2015-06-10 国网智能电网研究院 一种装配柔性输电阀的器具
US20140341691A1 (en) * 2013-05-14 2014-11-20 Kui Kam Lam Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
WO2019116530A1 (ja) * 2017-12-15 2019-06-20 ヤマハ発動機株式会社 部品実装システム、部品実装方法
CN111916370B (zh) * 2020-05-29 2023-09-05 佛山市顺德区蚬华多媒体制品有限公司 一种固晶机及其半导体器件封装方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3840978A (en) * 1969-11-12 1974-10-15 Ibm Method for positioning and bonding
JPH0770550B2 (ja) * 1990-04-23 1995-07-31 三菱電機株式会社 半導体フレームの搬送装置および搬送方法
JP2924760B2 (ja) * 1996-02-20 1999-07-26 日本電気株式会社 ダイボンディング装置
KR100199293B1 (ko) * 1996-11-08 1999-06-15 윤종용 반도체 패키지 제조 장치
JP2002368495A (ja) * 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
US7179346B2 (en) * 2003-06-03 2007-02-20 Asm Assembly Automation Ltd. Semiconductor apparatus with multiple delivery devices for components
JP4402996B2 (ja) * 2004-03-26 2010-01-20 Ｊｕｋｉ株式会社 電子部品実装装置
TWI322476B (en) * 2006-10-05 2010-03-21 Advanced Semiconductor Eng Die bonder and die bonding method thereof
KR100924548B1 (ko) * 2007-11-09 2009-11-02 주식회사 하이닉스반도체 다이 본딩 장치
KR100967526B1 (ko) * 2008-04-25 2010-07-05 에스티에스반도체통신 주식회사 광폭 리드 프레임을 위한 반도체 패키지 제조 장치 및 이를이용한 반도체 패키지 제조 방법

Also Published As

Publication number Publication date
US8590143B2 (en) 2013-11-26
SG185905A1 (en) 2012-12-28
MY155118A (en) 2015-09-15
CN102800613A (zh) 2012-11-28
TWI489581B (zh) 2015-06-21
KR101388948B1 (ko) 2014-04-24
US20120301251A1 (en) 2012-11-29
JP2012248839A (ja) 2012-12-13
KR20120132370A (ko) 2012-12-05
TW201248762A (en) 2012-12-01
CN102800613B (zh) 2015-10-28
JP5636391B2 (ja) 2014-12-03

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