CN103406867B - 一种装配柔性输电阀的器具 - Google Patents
一种装配柔性输电阀的器具 Download PDFInfo
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CN201310234987.9A CN103406867B (zh) | 2013-03-06 | 2013-06-14 | 一种装配柔性输电阀的器具 |
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CN201310234987.9A CN103406867B (zh) | 2013-03-06 | 2013-06-14 | 一种装配柔性输电阀的器具 |
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CN103406867A CN103406867A (zh) | 2013-11-27 |
CN103406867B true CN103406867B (zh) | 2015-06-10 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201312252Y (zh) * | 2008-11-25 | 2009-09-16 | 袁忠杰 | 开关电源中igbt逆变部件与输入整流桥的安装结构 |
CN201976383U (zh) * | 2011-03-01 | 2011-09-14 | 山东奥太电气有限公司 | 焊机用igbt组件的安装装置 |
CN102299144A (zh) * | 2011-06-15 | 2011-12-28 | 佛山市顺德区和而泰电子科技有限公司 | 分立igbt模组和基板 |
KR20120124016A (ko) * | 2011-03-28 | 2012-11-12 | 권용도 | 공차발생을 최소화 한 사방향을 이용한 중심위치장치 및 그 정렬 방법 |
CN202586869U (zh) * | 2012-04-24 | 2012-12-05 | 大洋电机新动力科技有限公司 | 一种电机的igbt模块与驱动电路板装配结构 |
CN202586870U (zh) * | 2012-04-27 | 2012-12-05 | 大洋电机新动力科技有限公司 | 一种电机控制器连接igbt模块的母排和磁芯的装配结构 |
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US8590143B2 (en) * | 2011-05-25 | 2013-11-26 | Asm Technology Singapore Pte. Ltd. | Apparatus for delivering semiconductor components to a substrate |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201312252Y (zh) * | 2008-11-25 | 2009-09-16 | 袁忠杰 | 开关电源中igbt逆变部件与输入整流桥的安装结构 |
CN201976383U (zh) * | 2011-03-01 | 2011-09-14 | 山东奥太电气有限公司 | 焊机用igbt组件的安装装置 |
KR20120124016A (ko) * | 2011-03-28 | 2012-11-12 | 권용도 | 공차발생을 최소화 한 사방향을 이용한 중심위치장치 및 그 정렬 방법 |
CN102299144A (zh) * | 2011-06-15 | 2011-12-28 | 佛山市顺德区和而泰电子科技有限公司 | 分立igbt模组和基板 |
CN202586869U (zh) * | 2012-04-24 | 2012-12-05 | 大洋电机新动力科技有限公司 | 一种电机的igbt模块与驱动电路板装配结构 |
CN202586870U (zh) * | 2012-04-27 | 2012-12-05 | 大洋电机新动力科技有限公司 | 一种电机控制器连接igbt模块的母排和磁芯的装配结构 |
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Address after: 102211 Beijing city Changping District Xiaotangshan town big East Village Road No. 270 (future technology city) Co-patentee after: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Patentee after: STATE GRID SMART GRID Research Institute Co-patentee after: STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER Co. Co-patentee after: State Grid Corporation of China Address before: 102211 Beijing city Changping District Xiaotangshan town big East Village Road No. 270 (future technology city) Co-patentee before: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Patentee before: STATE GRID SMART GRID Research Institute Co-patentee before: SHANGHAI MUNICIPAL ELECTRIC POWER Co. Co-patentee before: State Grid Corporation of China |
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Effective date of registration: 20170612 Address after: 102200 Beijing city Changping District South Shao Zhen Nan Road No. 16 Co-patentee after: STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER Co. Patentee after: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Co-patentee after: State Grid Corporation of China Address before: 102211 Beijing city Changping District Xiaotangshan town big East Village Road No. 270 (future technology city) Co-patentee before: CHINA-EPRI ELECTRIC POWER ENGINEERING Co.,Ltd. Patentee before: STATE GRID SMART GRID Research Institute Co-patentee before: STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER Co. Co-patentee before: State Grid Corporation of China |