HK1157880A1 - 感光性硅氧烷聚酰亞胺樹脂組合物 - Google Patents

感光性硅氧烷聚酰亞胺樹脂組合物

Info

Publication number
HK1157880A1
HK1157880A1 HK11112010.8A HK11112010A HK1157880A1 HK 1157880 A1 HK1157880 A1 HK 1157880A1 HK 11112010 A HK11112010 A HK 11112010A HK 1157880 A1 HK1157880 A1 HK 1157880A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
polyimide resin
photosensitive siloxane
siloxane polyimide
photosensitive
Prior art date
Application number
HK11112010.8A
Other languages
English (en)
Inventor
須永友康
野村麻美子
金谷紘希
石井淳
Original Assignee
迪睿合電子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪睿合電子材料有限公司 filed Critical 迪睿合電子材料有限公司
Publication of HK1157880A1 publication Critical patent/HK1157880A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
HK11112010.8A 2008-09-30 2011-11-07 感光性硅氧烷聚酰亞胺樹脂組合物 HK1157880A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008252953A JP5343494B2 (ja) 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物
PCT/JP2009/063885 WO2010038543A1 (ja) 2008-09-30 2009-08-05 感光性シロキサンポリイミド樹脂組成物

Publications (1)

Publication Number Publication Date
HK1157880A1 true HK1157880A1 (zh) 2012-07-06

Family

ID=42073320

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11112010.8A HK1157880A1 (zh) 2008-09-30 2011-11-07 感光性硅氧烷聚酰亞胺樹脂組合物

Country Status (5)

Country Link
JP (1) JP5343494B2 (zh)
CN (1) CN102165370B (zh)
HK (1) HK1157880A1 (zh)
TW (1) TWI394777B (zh)
WO (1) WO2010038543A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5417364B2 (ja) * 2011-03-08 2014-02-12 富士フイルム株式会社 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
KR101590862B1 (ko) 2011-09-21 2016-02-02 제이에스알 가부시끼가이샤 렌즈의 형성 방법 및 네거티브형 감광성 조성물
JP5494725B2 (ja) * 2011-09-21 2014-05-21 Ｊｓｒ株式会社 レンズの形成方法、レンズおよびネガ型感光性組成物
WO2013077365A1 (ja) * 2011-11-25 2013-05-30 日産化学工業株式会社 ディスプレイ基板用樹脂組成物
CN104066769B (zh) * 2011-11-25 2019-01-15 日产化学工业株式会社 显示器基板用树脂组合物
KR101597478B1 (ko) 2012-01-20 2016-02-24 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 조성물, 적층체, 다층 프린트 배선판 및 다층 플렉시블 배선판 및 그 제조 방법
KR102091496B1 (ko) * 2012-09-25 2020-03-20 도레이 카부시키가이샤 포지티브형 감광성 수지 조성물, 그것을 사용한 경화막을 포함하는 반도체 장치의 제조 방법
TW201413387A (zh) * 2012-09-26 2014-04-01 Toray Industries 正型感光性樹脂組成物
KR101896271B1 (ko) * 2013-03-18 2018-09-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법
CN105295792B (zh) * 2015-08-26 2017-12-29 北京化工大学 一种高性能聚酰亚胺交联改性环氧树脂及其制备方法
JP7111031B2 (ja) * 2018-03-23 2022-08-02 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
EP3786213A4 (en) * 2018-04-23 2022-01-19 Shin-Etsu Chemical Co., Ltd. COMPOUND WITH SILICON
CN109100917A (zh) * 2018-07-19 2018-12-28 江苏博砚电子科技有限公司 一种彩色感光性树脂组合物及其制备方法
KR102279081B1 (ko) * 2018-08-20 2021-07-19 주식회사 엘지화학 폴리이미드 필름 및 이를 이용하는 플렉서블 디바이스
CN110441989B (zh) * 2019-08-07 2022-08-23 沧州信联化工有限公司 一种光刻胶组合物
CN111830786B (zh) * 2020-07-17 2023-05-23 波米科技有限公司 一种含硅烷偶联剂的感光性树脂组合物
JP7397419B1 (ja) * 2023-06-02 2023-12-13 Jsr株式会社 感放射線性組成物、硬化膜及びその製造方法、半導体素子並びに表示素子

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JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
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JP4374840B2 (ja) * 2002-08-30 2009-12-02 東レ株式会社 ポジ型感光性樹脂組成物、半導体素子の製造方法および、半導体装置
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JP2005173027A (ja) * 2003-12-09 2005-06-30 Kyocera Chemical Corp ポジ型感光性樹脂組成物及びその硬化物
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Also Published As

Publication number Publication date
TW201012850A (en) 2010-04-01
CN102165370B (zh) 2013-11-20
CN102165370A (zh) 2011-08-24
JP5343494B2 (ja) 2013-11-13
TWI394777B (zh) 2013-05-01
JP2010083951A (ja) 2010-04-15
WO2010038543A1 (ja) 2010-04-08

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