HK1152589A1 - Adhesive film - Google Patents

Adhesive film

Info

Publication number
HK1152589A1
HK1152589A1 HK11106591.7A HK11106591A HK1152589A1 HK 1152589 A1 HK1152589 A1 HK 1152589A1 HK 11106591 A HK11106591 A HK 11106591A HK 1152589 A1 HK1152589 A1 HK 1152589A1
Authority
HK
Hong Kong
Prior art keywords
filler
adhesive film
conductive
particle size
average particle
Prior art date
Application number
HK11106591.7A
Other languages
English (en)
Inventor
Yasuhiro Suga
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1152589A1 publication Critical patent/HK1152589A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
HK11106591.7A 2008-05-28 2011-06-27 Adhesive film HK1152589A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008139005A JP5422921B2 (ja) 2008-05-28 2008-05-28 接着フィルム
PCT/JP2009/056592 WO2009145005A1 (ja) 2008-05-28 2009-03-31 接着フィルム

Publications (1)

Publication Number Publication Date
HK1152589A1 true HK1152589A1 (en) 2012-03-02

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HK11106591.7A HK1152589A1 (en) 2008-05-28 2011-06-27 Adhesive film

Country Status (8)

Country Link
US (1) US20100290205A1 (xx)
EP (1) EP2282328B1 (xx)
JP (1) JP5422921B2 (xx)
KR (1) KR101464807B1 (xx)
CN (1) CN102047401B (xx)
HK (1) HK1152589A1 (xx)
TW (1) TWI381036B (xx)
WO (1) WO2009145005A1 (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012116958A (ja) * 2010-12-01 2012-06-21 Furukawa Electric Co Ltd:The 接着フィルムおよび配線基板
JP5609716B2 (ja) * 2011-03-07 2014-10-22 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
KR101401574B1 (ko) * 2012-05-30 2014-06-11 한국과학기술연구원 하이브리드 필러를 이용한 전도성 접착제 및 이의 제조방법
CN107109161B (zh) * 2014-11-12 2019-07-02 迪睿合株式会社 热固化性粘合组合物
KR102505853B1 (ko) 2016-07-06 2023-03-03 삼성전자 주식회사 반도체 패키지
CN111560232B (zh) * 2020-06-08 2022-04-01 东莞市新懿电子材料技术有限公司 一种单组分环氧树脂流动型底部填充胶粘剂及其制备方法
CN113444481A (zh) * 2021-07-14 2021-09-28 深圳市汇海鑫科技有限公司 一种led芯片封装用导电胶粘剂及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6562217B1 (en) * 1997-04-17 2003-05-13 Sekisui Chemical Co., Ltd. Method and device for manufacturing conductive particles
JP3120837B2 (ja) * 1998-03-18 2000-12-25 日本電気株式会社 電気的接続用の樹脂フィルムおよび樹脂フィルムを用いた電気的接続方法
US6099745A (en) * 1998-06-05 2000-08-08 Parlex Corporation Rigid/flex printed circuit board and manufacturing method therefor
JP2000080341A (ja) * 1998-06-22 2000-03-21 Toshiba Chem Corp 異方性導電接着剤および基板搭載デバイス
KR100305750B1 (ko) * 1999-03-10 2001-09-24 윤덕용 플라스틱 기판의 플립 칩 접속용 이방성 전도성 접착제의 제조방법
JP3632558B2 (ja) * 1999-09-17 2005-03-23 日立化成工業株式会社 封止用エポキシ樹脂組成物及び電子部品装置
JP3491595B2 (ja) * 2000-02-25 2004-01-26 ソニーケミカル株式会社 異方導電性接着フィルム
JP4719992B2 (ja) 2001-03-19 2011-07-06 日立化成工業株式会社 接着剤組成物およびその用途
JP2004043602A (ja) * 2002-07-10 2004-02-12 Bridgestone Corp 異方性導電フィルム
JP2005089660A (ja) * 2003-09-18 2005-04-07 Nitto Denko Corp 半導体封止用樹脂組成物
US7186945B2 (en) * 2003-10-15 2007-03-06 National Starch And Chemical Investment Holding Corporation Sprayable adhesive material for laser marking semiconductor wafers and dies
US7507477B2 (en) * 2004-07-15 2009-03-24 Sekisui Chemical Co., Ltd. Conductive microparticle, process for producing the same and anisotropic conductive material
US7408263B2 (en) * 2005-05-03 2008-08-05 E.I. Du Pont De Nemours And Company Anisotropic conductive coatings and electronic devices
US20070213429A1 (en) * 2006-03-10 2007-09-13 Chih-Min Cheng Anisotropic conductive adhesive
TW200804557A (en) * 2006-07-07 2008-01-16 Ablestik Japan Co Ltd Conductive adhesive agent

Also Published As

Publication number Publication date
EP2282328A4 (en) 2011-12-21
CN102047401A (zh) 2011-05-04
KR20110019358A (ko) 2011-02-25
TWI381036B (zh) 2013-01-01
KR101464807B1 (ko) 2014-11-24
EP2282328A1 (en) 2011-02-09
JP2009289857A (ja) 2009-12-10
TW200948923A (en) 2009-12-01
EP2282328B1 (en) 2015-09-02
US20100290205A1 (en) 2010-11-18
WO2009145005A1 (ja) 2009-12-03
CN102047401B (zh) 2012-11-28
JP5422921B2 (ja) 2014-02-19

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