HK1147140A1 - Process for producing substrate for power module, substrate for power module, and power module - Google Patents
Process for producing substrate for power module, substrate for power module, and power moduleInfo
- Publication number
- HK1147140A1 HK1147140A1 HK11101087.9A HK11101087A HK1147140A1 HK 1147140 A1 HK1147140 A1 HK 1147140A1 HK 11101087 A HK11101087 A HK 11101087A HK 1147140 A1 HK1147140 A1 HK 1147140A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- power module
- substrate
- producing
- producing substrate
- module
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12007—Component of composite having metal continuous phase interengaged with nonmetal continuous phase
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007299385 | 2007-11-19 | ||
PCT/JP2008/071018 WO2009066692A1 (fr) | 2007-11-19 | 2008-11-19 | Procédé de fabrication de substrat pour module de puissance, substrat pour module de puissance, et module de puissance |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1147140A1 true HK1147140A1 (en) | 2011-07-29 |
Family
ID=40667514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11101087.9A HK1147140A1 (en) | 2007-11-19 | 2011-02-01 | Process for producing substrate for power module, substrate for power module, and power module |
Country Status (7)
Country | Link |
---|---|
US (1) | US8116084B2 (fr) |
EP (1) | EP2214201B1 (fr) |
JP (1) | JP4747315B2 (fr) |
KR (1) | KR101083618B1 (fr) |
CN (1) | CN101861647B (fr) |
HK (1) | HK1147140A1 (fr) |
WO (1) | WO2009066692A1 (fr) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5640569B2 (ja) * | 2009-09-09 | 2014-12-17 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
JP5640570B2 (ja) * | 2009-09-09 | 2014-12-17 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
TWI521651B (zh) | 2009-09-09 | 2016-02-11 | 三菱綜合材料股份有限公司 | 附散熱器之電力模組用基板之製造方法、附散熱器之電力模組用基板及電力模組 |
JP5640571B2 (ja) * | 2009-09-09 | 2014-12-17 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
JP2011119653A (ja) * | 2009-09-09 | 2011-06-16 | Mitsubishi Materials Corp | ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンク付パワーモジュール用基板及びパワーモジュール |
CN102576697B (zh) * | 2009-10-22 | 2014-11-12 | 三菱综合材料株式会社 | 功率模块用基板、带散热器的功率模块用基板、功率模块、功率模块用基板的制造方法及带散热器的功率模块用基板的制造方法 |
JP5741793B2 (ja) * | 2009-10-22 | 2015-07-01 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、パワーモジュール用基板の製造方法及びヒートシンク付パワーモジュール用基板の製造方法 |
JP5724273B2 (ja) * | 2009-10-22 | 2015-05-27 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、パワーモジュール用基板の製造方法及びヒートシンク付パワーモジュール用基板の製造方法 |
KR101878492B1 (ko) * | 2011-02-01 | 2018-07-13 | 미쓰비시 마테리알 가부시키가이샤 | 파워 모듈용 기판의 제조 방법, 파워 모듈용 기판, 히트싱크가 부착된 파워 모듈용 기판 및 파워 모듈 |
CN102651349B (zh) * | 2011-02-25 | 2016-07-06 | 三菱综合材料株式会社 | 功率模块用基板及制法、自带散热器的该基板及功率模块 |
CN102651348B (zh) * | 2011-02-25 | 2016-08-03 | 三菱综合材料株式会社 | 功率模块用基板及制法、自带散热器的该基板及功率模块 |
JP5694094B2 (ja) * | 2011-09-01 | 2015-04-01 | Jx日鉱日石金属株式会社 | フレキシブルプリント配線板用銅箔、銅張積層板、フレキシブルプリント配線板及び電子機器 |
US9556074B2 (en) * | 2011-11-30 | 2017-01-31 | Component Re-Engineering Company, Inc. | Method for manufacture of a multi-layer plate device |
US9624137B2 (en) * | 2011-11-30 | 2017-04-18 | Component Re-Engineering Company, Inc. | Low temperature method for hermetically joining non-diffusing ceramic materials |
JP5910166B2 (ja) * | 2012-02-29 | 2016-04-27 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
JP5947104B2 (ja) * | 2012-05-18 | 2016-07-06 | 昭和電工株式会社 | 電子素子搭載用基板 |
WO2014046130A1 (fr) | 2012-09-21 | 2014-03-27 | 三菱マテリアル株式会社 | Structure de liaison pour élément en aluminium et élément en cuivre |
EP2911192B1 (fr) * | 2012-10-16 | 2021-05-05 | Mitsubishi Materials Corporation | Substrat destiné à un bloc de puissance doté d'un puits de chaleur, bloc de puissance doté d'un puits de chaleur, et procédé de production d'un substrat destiné à un bloc de puissance doté d'un puits de chaleur |
KR101459857B1 (ko) * | 2012-12-27 | 2014-11-07 | 현대자동차주식회사 | 히트싱크 일체형 양면 냉각 파워모듈 |
US9064805B1 (en) * | 2013-03-13 | 2015-06-23 | Itn Energy Systems, Inc. | Hot-press method |
JP6079505B2 (ja) * | 2013-08-26 | 2017-02-15 | 三菱マテリアル株式会社 | 接合体及びパワーモジュール用基板 |
US9969654B2 (en) * | 2014-01-24 | 2018-05-15 | United Technologies Corporation | Method of bonding a metallic component to a non-metallic component using a compliant material |
JP6264129B2 (ja) * | 2014-03-24 | 2018-01-24 | 三菱マテリアル株式会社 | パワーモジュール用基板及びその製造方法 |
US10068829B2 (en) | 2014-04-25 | 2018-09-04 | Mitsubishi Materials Corporation | Power-module substrate unit and power module |
JP6507722B2 (ja) * | 2015-03-05 | 2019-05-08 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
CN108688244A (zh) * | 2018-07-25 | 2018-10-23 | 青岛归来科技有限公司 | 陶瓷金属复合板及其制备方法 |
JP6733941B1 (ja) * | 2019-03-22 | 2020-08-05 | 大口マテリアル株式会社 | 半導体素子搭載用基板 |
CN114501820A (zh) * | 2022-02-21 | 2022-05-13 | 青州云领电子科技有限公司 | 一种陶瓷基电路板的制备工艺及产品 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03234045A (ja) | 1990-02-09 | 1991-10-18 | Toshiba Corp | 窒化アルミニウム基板およびこれを用いた半導体モジュール |
US5213877A (en) * | 1991-05-02 | 1993-05-25 | Mitsubishi Materials Corporation | Ceramic substrate used for fabricating electric or electronic circuit |
JP3023808B2 (ja) * | 1991-09-13 | 2000-03-21 | 健 増本 | 粒子強化金属基複合部材 |
DE69221047T2 (de) * | 1991-09-13 | 1998-02-26 | Tsuyoshi Masumoto | Konstruktionselement mit hoher Festigkeit und Verfahren seiner Herstellung |
JPH07172961A (ja) * | 1993-12-17 | 1995-07-11 | Kawasaki Steel Corp | メタライズ層を有する窒化アルミニウム焼結体及びその製造方法 |
EP0693776B1 (fr) * | 1994-07-15 | 2000-05-31 | Mitsubishi Materials Corporation | Emballage céramique à haute radiation de chaleur |
US6033787A (en) * | 1996-08-22 | 2000-03-07 | Mitsubishi Materials Corporation | Ceramic circuit board with heat sink |
JP3864282B2 (ja) * | 1998-09-22 | 2006-12-27 | 三菱マテリアル株式会社 | パワーモジュール用基板及びその製造方法並びにこの基板を用いた半導体装置 |
JP2000340897A (ja) * | 1999-05-31 | 2000-12-08 | Denki Kagaku Kogyo Kk | 回路基板 |
US7019975B2 (en) * | 2000-08-09 | 2006-03-28 | Mitsubishi Materials Corporation | Power module and power module with heat sink |
WO2003090277A1 (fr) * | 2002-04-19 | 2003-10-30 | Mitsubishi Materials Corporation | Carte de circuits imprimes, son procede de production et module de puissance |
JP4387658B2 (ja) * | 2002-10-30 | 2009-12-16 | 三菱マテリアル株式会社 | ヒートシンク付セラミック回路基板及びその製造方法 |
US20050098942A1 (en) | 2003-11-07 | 2005-05-12 | Heidelberger Druckmaschinen Ag | Pin conveyor for printed sheet material and transfer unit |
WO2005098942A1 (fr) * | 2004-04-05 | 2005-10-20 | Mitsubishi Materials Corporation | Materiau de jonction ai/ain, plaque de base pour module d'alimentation, module d’alimentation et procédé de fabrication de materiau de jonction ai/ain |
JP4682889B2 (ja) * | 2006-03-23 | 2011-05-11 | 三菱マテリアル株式会社 | パワーモジュール用基板およびパワーモジュール並びにパワーモジュール用基板の製造方法 |
-
2008
- 2008-11-18 JP JP2008294598A patent/JP4747315B2/ja active Active
- 2008-11-19 US US12/734,646 patent/US8116084B2/en active Active
- 2008-11-19 KR KR1020107005373A patent/KR101083618B1/ko active IP Right Grant
- 2008-11-19 CN CN2008801161925A patent/CN101861647B/zh active Active
- 2008-11-19 WO PCT/JP2008/071018 patent/WO2009066692A1/fr active Application Filing
- 2008-11-19 EP EP08851237.1A patent/EP2214201B1/fr active Active
-
2011
- 2011-02-01 HK HK11101087.9A patent/HK1147140A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
WO2009066692A1 (fr) | 2009-05-28 |
CN101861647A (zh) | 2010-10-13 |
US20100285331A1 (en) | 2010-11-11 |
US8116084B2 (en) | 2012-02-14 |
JP4747315B2 (ja) | 2011-08-17 |
CN101861647B (zh) | 2012-12-05 |
KR20100093515A (ko) | 2010-08-25 |
EP2214201A1 (fr) | 2010-08-04 |
KR101083618B1 (ko) | 2011-11-16 |
EP2214201B1 (fr) | 2018-09-19 |
EP2214201A4 (fr) | 2017-02-01 |
JP2009147316A (ja) | 2009-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1147140A1 (en) | Process for producing substrate for power module, substrate for power module, and power module | |
EP2296177A4 (fr) | Module de puissance, son substrat, et procédé de production de ce substrat | |
EP2259308A4 (fr) | Substrat pour module de puissance a dissipateur thermique et son procede de fabrication, module de puissance a dissipateur thermique, et substrat pour module de puissance | |
EP2477217A4 (fr) | Procédé de production de substrat pour module de puissance à dissipateur thermique, substrat pour module de puissance à dissipateur thermique et module de puissance | |
EP2080224A4 (fr) | Substrat de module de puissance, procede de fabrication d'un substrat de module de puissance et module de puissance | |
EP2282334A4 (fr) | Substrat pour module de puissance, module de puissance et procédé de fabrication de substrat pour module de puissance | |
EP2217043A4 (fr) | Substrat en céramique, procédé de fabrication d'un substrat en céramique, et procédé de fabrication d'un substrat pour un module de puissance | |
HK1132374A1 (en) | Cambered photovoltaic module and method for its manufacture | |
EP2211389A4 (fr) | Batterie solaire, procédé de fabrication d'une batterie solaire, procédé de fabrication d'un module de batterie solaire et module de batterie solaire | |
EP2492958A4 (fr) | Substrat pour module de puissance, substrat avec dissipateur thermique pour module de puissance, module de puissance, procédé de fabrication d'un substrat pour module de puissance et procédé de fabrication d'un substrat avec dissipateur thermique pour module de puissance | |
EP2002472A4 (fr) | Technique de fabrication de modules photovoltaïques | |
IL209544A0 (en) | Light, rigid, self - supporting solar module and method for the production thereof | |
EP2262040A4 (fr) | Module de batterie et procédé de production correspondant | |
EP2320477A4 (fr) | Module de cellule solaire, cellule solaire et procede de fabrication de module de cellule solaire | |
EP2141972A4 (fr) | Module incorporant un composant et son procédé de fabrication | |
EP2182556A4 (fr) | Procédé de fabrication de cellule solaire | |
EP2326155A4 (fr) | Module de substrat et son procédé de fabrication | |
EP2169725A4 (fr) | Procédé de fabrication de module de pile solaire | |
EP2224534A4 (fr) | Cellule solaire photosensibilisée, son procédé de fabrication et module de cellule solaire photosensibilisée | |
EP2287577A4 (fr) | Module spectral et procédé de fabrication d un module spectral | |
EP2234172A4 (fr) | Module de cellule solaire et son procédé de fabrication | |
EP2372780A4 (fr) | Module de cellule solaire et son procédé de fabrication | |
EP2139046A4 (fr) | Module photovoltaïque | |
EP2356695A4 (fr) | Cellule solaire et son procédé de fabrication, et module de cellule solaire | |
PL2208225T3 (pl) | Moduł półprzewodnikowy mocy |