HK1135231A1 - Spin coater with optical controls - Google Patents

Spin coater with optical controls

Info

Publication number
HK1135231A1
HK1135231A1 HK10101625.9A HK10101625A HK1135231A1 HK 1135231 A1 HK1135231 A1 HK 1135231A1 HK 10101625 A HK10101625 A HK 10101625A HK 1135231 A1 HK1135231 A1 HK 1135231A1
Authority
HK
Hong Kong
Prior art keywords
spin coater
optical controls
controls
optical
coater
Prior art date
Application number
HK10101625.9A
Other languages
English (en)
Inventor
Lawrence M Minor
Lisa Marie Titolo
Hung Nguyen
Steve R Susie
Original Assignee
Transitions Optical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Transitions Optical Inc filed Critical Transitions Optical Inc
Publication of HK1135231A1 publication Critical patent/HK1135231A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00865—Applying coatings; tinting; colouring
    • B29D11/00884—Spin coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK10101625.9A 2006-08-28 2010-02-12 Spin coater with optical controls HK1135231A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US82369506P 2006-08-28 2006-08-28
US11/843,779 US7856939B2 (en) 2006-08-28 2007-08-23 Recirculation spin coater with optical controls
PCT/US2007/076702 WO2008027794A2 (en) 2006-08-28 2007-08-24 Spin coater with optical controls

Publications (1)

Publication Number Publication Date
HK1135231A1 true HK1135231A1 (en) 2010-05-28

Family

ID=39112176

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10101625.9A HK1135231A1 (en) 2006-08-28 2010-02-12 Spin coater with optical controls

Country Status (10)

Country Link
US (1) US7856939B2 (xx)
EP (1) EP2057666B1 (xx)
JP (3) JP5275232B2 (xx)
KR (1) KR101097490B1 (xx)
CN (1) CN101512722B (xx)
AU (1) AU2007289367B2 (xx)
BR (1) BRPI0713835B1 (xx)
ES (1) ES2390836T3 (xx)
HK (1) HK1135231A1 (xx)
WO (1) WO2008027794A2 (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7856939B2 (en) * 2006-08-28 2010-12-28 Transitions Optical, Inc. Recirculation spin coater with optical controls
DE102011082631B4 (de) * 2011-09-13 2017-04-27 VW-VM Forschungsgesellschaft mbH & Co. KG Intermittierendes Beschichten von bewegten Oberflächen
CN103111403B (zh) * 2013-03-11 2015-04-15 苏州斯莱克精密设备股份有限公司 易拉盖刻线补涂机的真空排污装置
US9204962B2 (en) 2013-03-13 2015-12-08 Acufocus, Inc. In situ adjustable optical mask
RU2644911C2 (ru) 2013-10-11 2018-02-14 Трэнсиженс Оптикал, Инк. Способ изготовления фотохромного оптического изделия с использованием предварительной обработки органическим растворителем и фотохромного покрытия
JP6543464B2 (ja) * 2014-12-26 2019-07-10 ホヤ レンズ タイランド リミテッドＨＯＹＡ Ｌｅｎｓ Ｔｈａｉｌａｎｄ Ｌｔｄ 眼鏡レンズ
EP3505232A1 (de) 2017-12-28 2019-07-03 Satisloh Photonics AG Vorrichtung zum mischen und/oder dosieren von flüssigen beschichtungsstoffen, beschichtungsanlage mit einer solchen vorrichtung und verfahren zum färben optischer gläser
US11637031B2 (en) * 2019-11-04 2023-04-25 Tokyo Electron Limited Systems and methods for spin process video analysis during substrate processing

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JPS59211226A (ja) * 1983-05-17 1984-11-30 Nec Kyushu Ltd 半導体基板のレジスト塗布装置
JPS60226125A (ja) * 1984-04-25 1985-11-11 Matsushita Electronics Corp レジスト膜の形成方法
JPH03230516A (ja) * 1990-02-06 1991-10-14 Mitsubishi Electric Corp レジスト塗布装置
JPH03232219A (ja) * 1990-02-07 1991-10-16 Mitsubishi Electric Corp フオトレジスト塗布装置
US5094884A (en) * 1990-04-24 1992-03-10 Machine Technology, Inc. Method and apparatus for applying a layer of a fluid material on a semiconductor wafer
JPH04210271A (ja) * 1990-12-10 1992-07-31 Fujitsu Ltd 回転塗布装置
US5164228A (en) * 1991-05-20 1992-11-17 Bmc Industries, Inc. Method of applying scratch-resistant coatings to plastic ophthalmic lenses
US5461417A (en) * 1993-02-16 1995-10-24 Northeast Robotics, Inc. Continuous diffuse illumination method and apparatus
US5514214A (en) * 1993-09-20 1996-05-07 Q2100, Inc. Eyeglass lens and mold spin coater
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JPH09173946A (ja) * 1995-12-22 1997-07-08 Pioneer Electron Corp スピンコーティング装置
KR0169228B1 (ko) * 1995-12-29 1999-02-01 김광호 회전식 도포기의 배출 감광액 회수 장치
US5985031A (en) * 1996-06-21 1999-11-16 Micron Technology, Inc. Spin coating spindle and chuck assembly
US6129042A (en) * 1996-11-08 2000-10-10 Coburn Optical Industries, Inc. Process and machine for coating ophthalmic lenses
JPH10156265A (ja) * 1996-11-27 1998-06-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH10216598A (ja) * 1997-02-04 1998-08-18 Toray Ind Inc 塗布方法および塗布装置並びにカラーフィルターの製造方法および製造装置
KR100271759B1 (ko) * 1997-07-25 2000-12-01 윤종용 포토레지스트코팅장치및방법
US6352747B1 (en) * 1999-03-31 2002-03-05 Ppg Industries Ohio, Inc. Spin and spray coating process for curved surfaces
JP3725753B2 (ja) 2000-02-09 2005-12-14 大日本スクリーン製造株式会社 基板処理装置
JP2001269609A (ja) 2000-03-28 2001-10-02 Tokyo Electron Ltd 塗布処理装置
US6950196B2 (en) * 2000-09-20 2005-09-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimen
JP4531998B2 (ja) * 2001-02-21 2010-08-25 Ｏｋｉセミコンダクタ株式会社 廃液分離回収システム及び廃液分離回収方法
US6723168B2 (en) * 2001-06-20 2004-04-20 Taiwan Semiconductor Manufacturing Co., Ltd. Spin-coater with self-cleaning cup and method of using
US20030079679A1 (en) * 2001-10-30 2003-05-01 Toru Ikeda Spin coater
WO2003077291A1 (fr) * 2002-03-12 2003-09-18 Olympus Corporation Procede de fabrication de semi-conducteurs et dispositif d'usinage associe
KR100948220B1 (ko) * 2002-03-19 2010-03-18 도쿄엘렉트론가부시키가이샤 도포처리방법 및 도포처리장치
US20040072450A1 (en) * 2002-10-15 2004-04-15 Collins Jimmy D. Spin-coating methods and apparatuses for spin-coating, including pressure sensor
JP4172771B2 (ja) * 2003-03-27 2008-10-29 株式会社トクヤマ コーティング装置
JP2004355753A (ja) * 2003-05-30 2004-12-16 Tdk Corp 光記録媒体用コーティング材料の濾過方法、濾過装置、光記録媒体のコーティング方法、コーティング装置
JP2005116553A (ja) * 2003-10-02 2005-04-28 Tokyo Electron Ltd 塗布膜形成装置及び塗布膜形成方法
JP4069081B2 (ja) * 2004-01-13 2008-03-26 東京エレクトロン株式会社 位置調整方法及び基板処理システム
DE102004019731A1 (de) * 2004-04-20 2005-11-10 Sse Sister Semiconductor Equipment Gmbh Vorrichtung zum Drehbelacken von Substraten
JP4295175B2 (ja) * 2004-08-05 2009-07-15 東京エレクトロン株式会社 塗布成膜装置及び塗布成膜方法
JP4486476B2 (ja) * 2004-10-29 2010-06-23 東京エレクトロン株式会社 レーザー処理装置及びレーザー処理方法
FR2891477B1 (fr) * 2005-10-04 2008-02-15 Essilor Int Procede de coloration d'une lentille par centrifugation ("spin-coating") et lentille coloree obtenue par ce procede
US7856939B2 (en) * 2006-08-28 2010-12-28 Transitions Optical, Inc. Recirculation spin coater with optical controls

Also Published As

Publication number Publication date
EP2057666B1 (en) 2012-08-01
JP5662362B2 (ja) 2015-01-28
JP2012152736A (ja) 2012-08-16
JP2009545444A (ja) 2009-12-24
AU2007289367B2 (en) 2011-04-21
US7856939B2 (en) 2010-12-28
BRPI0713835B1 (pt) 2018-08-07
KR20090031779A (ko) 2009-03-27
CN101512722B (zh) 2010-12-08
KR101097490B1 (ko) 2011-12-22
AU2007289367A1 (en) 2008-03-06
JP2014087792A (ja) 2014-05-15
WO2008027794A2 (en) 2008-03-06
ES2390836T3 (es) 2012-11-16
US20080047488A1 (en) 2008-02-28
EP2057666A2 (en) 2009-05-13
JP5275232B2 (ja) 2013-08-28
WO2008027794A3 (en) 2008-08-28
CN101512722A (zh) 2009-08-19

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160824