HK1130278A1 - Silicate-base luminescent materials having multiple emission peaks, processes for preparing the same and light emitting devices using the same - Google Patents
Silicate-base luminescent materials having multiple emission peaks, processes for preparing the same and light emitting devices using the sameInfo
- Publication number
- HK1130278A1 HK1130278A1 HK09108092.1A HK09108092A HK1130278A1 HK 1130278 A1 HK1130278 A1 HK 1130278A1 HK 09108092 A HK09108092 A HK 09108092A HK 1130278 A1 HK1130278 A1 HK 1130278A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- same
- silicate
- preparing
- processes
- light emitting
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
- C09K11/77922—Silicates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610047460 | 2006-08-15 | ||
PCT/CN2007/002458 WO2008022552A1 (fr) | 2006-08-15 | 2007-08-15 | Matériau luminescent à base de silicate avec pic multi-émission, son procédé de fabrication et son utilisation dans un dispositif d'éclairage |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1130278A1 true HK1130278A1 (en) | 2009-12-24 |
Family
ID=39106470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09108092.1A HK1130278A1 (en) | 2006-08-15 | 2009-09-04 | Silicate-base luminescent materials having multiple emission peaks, processes for preparing the same and light emitting devices using the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US8154191B2 (ko) |
EP (1) | EP2062960B1 (ko) |
JP (1) | JP5331981B2 (ko) |
KR (1) | KR101439567B1 (ko) |
ES (1) | ES2391586T3 (ko) |
HK (1) | HK1130278A1 (ko) |
TW (1) | TW200909564A (ko) |
WO (1) | WO2008022552A1 (ko) |
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KR101172143B1 (ko) * | 2009-08-10 | 2012-08-07 | 엘지이노텍 주식회사 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
KR101163902B1 (ko) | 2010-08-10 | 2012-07-09 | 엘지이노텍 주식회사 | 발광 소자 |
US9909058B2 (en) | 2009-09-02 | 2018-03-06 | Lg Innotek Co., Ltd. | Phosphor, phosphor manufacturing method, and white light emitting device |
US20130089729A1 (en) * | 2010-05-20 | 2013-04-11 | Dalian Luminglight Co., Ltd. | Peelable light conversion luminescent film |
CN103074059A (zh) * | 2012-12-08 | 2013-05-01 | 北京工业大学 | 一种镝铥共掺硅磷铝酸盐白光荧光粉及其制备方法 |
US9617471B2 (en) | 2013-04-25 | 2017-04-11 | National Institute Of Materials Science | Inorganic phosphor, manufacture thereof, light-emitting device, and image display utilizing inorganic phosphor |
JP6682433B2 (ja) * | 2013-11-13 | 2020-04-15 | エルジー イノテック カンパニー リミテッド | 青緑色蛍光体、それを含む発光素子パッケージ及び照明装置 |
DE102014207318B4 (de) | 2014-04-16 | 2022-03-31 | Koenig & Bauer Ag | Identifikationsmerkmal mit mehreren in einer definiert begrenzten Fläche angeordneten Identifikationselementen zur Identifikation eines Gegenstandes |
KR102224069B1 (ko) * | 2014-05-30 | 2021-03-09 | 엘지이노텍 주식회사 | 산질화물계 형광체 |
CN109346005B (zh) * | 2014-06-26 | 2021-10-01 | 萤光勒克斯株式会社 | 有机el面板控制装置、光源装置、有机el面板控制方法、程序以及记录介质 |
DE102015219395B4 (de) | 2015-10-07 | 2019-01-17 | Koenig & Bauer Ag | Identifikationsmerkmal mit mindestens zwei in einer definiert begrenzten Fläche angeordneten Identifikationselementen zur Identifikation eines Gegenstandes |
DE102015219385A1 (de) | 2015-10-07 | 2017-04-13 | Koenig & Bauer Ag | Verfahren zur Ausbildung mindestens eines Identifikationsmerkmals mit einer Druckmaschine |
DE102015219396B4 (de) | 2015-10-07 | 2019-01-17 | Koenig & Bauer Ag | Gegenstand mit einem zu seiner Identifikation angeordneten Identifikationsmerkmal |
DE102015219400B4 (de) | 2015-10-07 | 2019-01-17 | Koenig & Bauer Ag | Verfahren zur Prüfung der Identität und/oder Echtheit eines Gegenstandes |
DE102015219388B4 (de) | 2015-10-07 | 2019-01-17 | Koenig & Bauer Ag | Verfahren zur Produktionskontrolle von mit einer Druckmaschine auf einen Bedruckstoff oder Gegenstand gedruckten Identifikationsmerkmalen |
DE102015219392B4 (de) | 2015-10-07 | 2019-01-17 | Koenig & Bauer Ag | Identifikationsmerkmal mit mehreren in einer definiert begrenzten Fläche angeordneten Identifikationselementen zur Identifikation eines Gegenstandes |
DE102015219397A1 (de) | 2015-10-07 | 2017-04-13 | Koenig & Bauer Ag | Gegenstand mit einem zu seiner Identifikation angeordneten Identifikationsmerkmal |
DE102015219399B4 (de) | 2015-10-07 | 2019-01-17 | Koenig & Bauer Ag | Identifikationsmerkmal zur Identifikation eines Gegenstandes |
DE102015219393B4 (de) | 2015-10-07 | 2019-01-17 | Koenig & Bauer Ag | Verfahren zur Identifikation eines Gegenstandes |
WO2017060123A1 (de) | 2015-10-07 | 2017-04-13 | Koenig & Bauer Ag | Identifikationsmerkmal zur identifikation eines gegenstandes |
DE102015219394B4 (de) | 2015-10-07 | 2019-01-17 | Koenig & Bauer Ag | Identifikationsmerkmal zur Identifikation eines Gegenstandes |
CN105778913B (zh) * | 2016-04-07 | 2018-07-06 | 中山大学 | 一种单基质三掺杂白色荧光材料及其制备方法与应用 |
CN108922955B (zh) * | 2018-06-25 | 2024-04-16 | 欧普照明股份有限公司 | 一种光源模组及包括该光源模组的照明装置 |
CN112882284B (zh) * | 2019-11-29 | 2023-03-24 | 隆达电子股份有限公司 | 光转换材料、其制造方法、包含其的发光装置及背光模组 |
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US7252787B2 (en) * | 2003-10-29 | 2007-08-07 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
JP2005187690A (ja) * | 2003-12-26 | 2005-07-14 | Nichia Chem Ind Ltd | 真空紫外線励起珪酸塩蛍光体及びその製造方法並びに真空紫外線励起発光装置 |
JP2005239936A (ja) * | 2004-02-27 | 2005-09-08 | Sumitomo Chemical Co Ltd | 蛍光体 |
WO2006012234A2 (en) * | 2004-06-25 | 2006-02-02 | Sarnoff Corporation | Nitride phosphors and devices |
JP4521227B2 (ja) | 2004-07-14 | 2010-08-11 | 株式会社東芝 | 窒素を含有する蛍光体の製造方法 |
US7601276B2 (en) * | 2004-08-04 | 2009-10-13 | Intematix Corporation | Two-phase silicate-based yellow phosphor |
US7575697B2 (en) * | 2004-08-04 | 2009-08-18 | Intematix Corporation | Silicate-based green phosphors |
JP4836429B2 (ja) * | 2004-10-18 | 2011-12-14 | 株式会社東芝 | 蛍光体およびこれを用いた発光装置 |
CN101077973B (zh) * | 2006-05-26 | 2010-09-29 | 大连路明发光科技股份有限公司 | 硅酸盐荧光材料及其制造方法以及使用其的发光装置 |
JP5361736B2 (ja) * | 2006-12-29 | 2013-12-04 | エルジー イノテック カンパニー リミテッド | 蛍光体、コーティング蛍光体組成物、蛍光体の製造方法及び発光素子 |
JP5008723B2 (ja) * | 2007-06-08 | 2012-08-22 | パナソニック株式会社 | 青色蛍光体、発光装置およびプラズマディスプレイパネル |
-
2007
- 2007-08-15 KR KR1020097004808A patent/KR101439567B1/ko active IP Right Grant
- 2007-08-15 ES ES07785354T patent/ES2391586T3/es active Active
- 2007-08-15 JP JP2009524066A patent/JP5331981B2/ja active Active
- 2007-08-15 EP EP07785354A patent/EP2062960B1/en not_active Revoked
- 2007-08-15 US US12/377,491 patent/US8154191B2/en active Active
- 2007-08-15 WO PCT/CN2007/002458 patent/WO2008022552A1/zh active Application Filing
- 2007-08-24 TW TW096131590A patent/TW200909564A/zh unknown
-
2009
- 2009-09-04 HK HK09108092.1A patent/HK1130278A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
TWI363793B (ko) | 2012-05-11 |
KR20090052337A (ko) | 2009-05-25 |
EP2062960B1 (en) | 2012-09-19 |
KR101439567B1 (ko) | 2014-09-11 |
ES2391586T3 (es) | 2012-11-28 |
JP5331981B2 (ja) | 2013-10-30 |
US20100052513A1 (en) | 2010-03-04 |
WO2008022552A1 (fr) | 2008-02-28 |
EP2062960A1 (en) | 2009-05-27 |
US8154191B2 (en) | 2012-04-10 |
TW200909564A (en) | 2009-03-01 |
EP2062960A4 (en) | 2009-12-16 |
JP2010500458A (ja) | 2010-01-07 |
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