HK1116277A1 - Method for manufacturing a smart card - Google Patents

Method for manufacturing a smart card

Info

Publication number
HK1116277A1
HK1116277A1 HK08105757.4A HK08105757A HK1116277A1 HK 1116277 A1 HK1116277 A1 HK 1116277A1 HK 08105757 A HK08105757 A HK 08105757A HK 1116277 A1 HK1116277 A1 HK 1116277A1
Authority
HK
Hong Kong
Prior art keywords
printed circuit
circuit board
smart card
top surface
manufacturing
Prior art date
Application number
HK08105757.4A
Other languages
English (en)
Inventor
Robert Singleton
Original Assignee
Innovatier Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36676049&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1116277(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Innovatier Inc filed Critical Innovatier Inc
Publication of HK1116277A1 publication Critical patent/HK1116277A1/xx

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07345—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2203/00—Form of contacts
    • H01H2203/036—Form of contacts to solve particular problems
    • H01H2203/038—Form of contacts to solve particular problems to be bridged by a dome shaped contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2231/00—Applications
    • H01H2231/05—Card, e.g. credit card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0186—Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Structure Of Printed Boards (AREA)
HK08105757.4A 2005-04-06 2008-05-23 Method for manufacturing a smart card HK1116277A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/099,477 US7237724B2 (en) 2005-04-06 2005-04-06 Smart card and method for manufacturing a smart card
PCT/US2006/012505 WO2006107968A1 (fr) 2005-04-06 2006-04-05 Carte a puce et son procede de fabrication

Publications (1)

Publication Number Publication Date
HK1116277A1 true HK1116277A1 (en) 2008-12-19

Family

ID=36676049

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08105757.4A HK1116277A1 (en) 2005-04-06 2008-05-23 Method for manufacturing a smart card

Country Status (18)

Country Link
US (1) US7237724B2 (fr)
EP (1) EP1866846B1 (fr)
JP (1) JP2008538430A (fr)
KR (1) KR20080005364A (fr)
CN (1) CN100595784C (fr)
AT (1) ATE467195T1 (fr)
AU (1) AU2006231517A1 (fr)
BR (1) BRPI0609969A2 (fr)
CA (1) CA2604153A1 (fr)
DE (1) DE602006014113D1 (fr)
HK (1) HK1116277A1 (fr)
IL (1) IL186415A0 (fr)
MX (1) MX2007012434A (fr)
MY (1) MY141813A (fr)
RU (1) RU2007140980A (fr)
TW (1) TW200710739A (fr)
WO (1) WO2006107968A1 (fr)
ZA (1) ZA200708492B (fr)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9210806B2 (en) 2004-06-02 2015-12-08 Joel S. Douglas Bondable conductive ink
US8127440B2 (en) 2006-10-16 2012-03-06 Douglas Joel S Method of making bondable flexible printed circuit
US8684267B2 (en) 2005-03-26 2014-04-01 Privasys Method for broadcasting a magnetic stripe data packet from an electronic smart card
KR20070119051A (ko) 2005-03-26 2007-12-18 프라이베이시스, 인크. 전자 상거래 카드 및 전자 상거래 방법
US8226001B1 (en) 2010-06-23 2012-07-24 Fiteq, Inc. Method for broadcasting a magnetic stripe data packet from an electronic smart card
WO2006116772A2 (fr) 2005-04-27 2006-11-02 Privasys, Inc. Cartes electroniques et leurs procedes de production
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
US20070171076A1 (en) * 2005-08-29 2007-07-26 Visible Assets, Inc. Low-frequency radio tag encapsulating system
EP1770608B1 (fr) * 2005-09-22 2009-07-29 Gemalto Oy Carte à puce avec bordure transparente et méthode de fabrication
US7551448B2 (en) * 2006-01-31 2009-06-23 Cryovac, Inc. Electronic device having improved electrical connection
AU2007243634A1 (en) * 2006-04-10 2007-11-08 Innovatier, Inc. An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards
US20070290048A1 (en) 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US7481365B2 (en) * 2006-07-05 2009-01-27 International Business Machines Corporation System and method for transaction card electronic messaging
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
WO2008082616A1 (fr) 2006-12-29 2008-07-10 Solicore, Inc. Carte conçue pour recevoir une batterie séparée
WO2008082617A2 (fr) 2006-12-29 2008-07-10 Solicore, Inc. Appareil d'expédition pour cartes auto-alimentées
US8267327B2 (en) * 2007-02-17 2012-09-18 Qsecure, Inc. Payment card manufacturing technology
US20080237356A1 (en) * 2007-03-23 2008-10-02 Innovatier, Inc. Step card and method for making a step card
HK1109708A2 (en) 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
KR101408510B1 (ko) * 2007-05-18 2014-06-17 삼성전자주식회사 표시소자용 연성기판 및 이를 이용한 디스플레이 소자
KR100798685B1 (ko) * 2007-05-31 2008-01-28 주식회사 제이디씨텍 액정 표시부를 갖는 스마트디스플레이카드의 제조방법
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US8011577B2 (en) 2007-12-24 2011-09-06 Dynamics Inc. Payment cards and devices with gift card, global integration, and magnetic stripe reader communication functionality
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
US20090188105A1 (en) * 2008-01-28 2009-07-30 Ming-Chin Chien Slim battery packaging method
US20090259579A1 (en) * 2008-04-09 2009-10-15 International Business Marchines Corp System and method for transferring monetary value between currency documents
WO2009142591A1 (fr) * 2008-05-20 2009-11-26 Swecard International Sa Fabrication d'une carte à puce
CN101493902B (zh) * 2009-03-06 2012-04-25 北京海升天达科技有限公司 一种卡片制造方法
EP2343174A1 (fr) * 2010-01-11 2011-07-13 Gemalto SA Cartes à puce moulées et procédé de fabrication
JP2013524364A (ja) * 2010-04-05 2013-06-17 イノベイティア インコーポレイテッド 電子カードおよびタグのためのプレラミネーションコアならびにプレラミネーションコアの製造方法
US8317103B1 (en) 2010-06-23 2012-11-27 FiTeq Method for broadcasting a magnetic stripe data packet from an electronic smart card
CN103370181B (zh) * 2011-01-18 2017-03-01 因诺瓦蒂尔公司 用于在制造电子装置时将电子组合件附接到底部覆盖层的方法
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US9122968B2 (en) * 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
TWI478069B (zh) * 2012-04-20 2015-03-21 Smartdisplayer Technology Co Ltd A display card with a security check
EP2767935A1 (fr) * 2013-02-18 2014-08-20 NagraID S.A. Couche plastique pour carte électronique
US10906287B2 (en) 2013-03-15 2021-02-02 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
KR101480388B1 (ko) * 2013-04-30 2015-01-26 주식회사 와이즈오토모티브 필름형 스위치를 갖는 스마트 키 조립체
KR101480387B1 (ko) * 2013-04-30 2015-01-12 주식회사 와이즈오토모티브 버튼 스위치를 갖는 스마트 키 조립체
KR101480386B1 (ko) * 2013-04-30 2015-01-12 주식회사 와이즈오토모티브 개량형 스마트 키 조립체
WO2017016456A1 (fr) * 2015-07-29 2017-02-02 飞天诚信科技股份有限公司 Carte à puce et procédé pour sa fabrication
US20170039462A1 (en) * 2015-08-03 2017-02-09 Johnson Electric S.A. Contact Smart Card and Method of Forming Such
EP3350750B1 (fr) 2015-09-18 2020-11-04 X-Card Holdings, LLC Inclusion autocentrée et couche de coeur pour carte-support d'informations, processus et produits résultants
US10335985B2 (en) 2015-10-14 2019-07-02 Capital One Services, Llc Molded pocket in transaction card construction
CN107273962B (zh) * 2016-06-15 2021-08-06 苏州海博智能系统有限公司 智能卡中料制作方法及中料结构
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
DK3491584T3 (da) 2016-07-27 2022-10-17 Composecure Llc Omstøbte elektroniske komponenter til transaktionskort og fremgangsmåder til fremstilling deraf
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
MX2021012822A (es) 2017-09-07 2023-03-02 Composecure Llc Tarjeta de transaccion con componentes electronicos incorporados y procedimiento para su fabricacion.
MX2020004012A (es) 2017-10-18 2020-09-25 Composecure Llc Tarjeta de transacción de metal, cerámica o recubierta con cerámica con ventana o patrón de ventana y retroiluminación opcional.
EP3762871B1 (fr) 2018-03-07 2024-08-07 X-Card Holdings, LLC Carte métallique
KR102138667B1 (ko) * 2019-05-14 2020-07-28 (주)비티비엘 개선된 배터리 접촉부을 구비한 스마트카드
GB2588382A (en) * 2019-10-15 2021-04-28 Zwipe As Method of manufacturing a smart card
USD1032613S1 (en) * 2020-02-02 2024-06-25 Federal Card Services, LLC Smart card
JP2021142683A (ja) * 2020-03-11 2021-09-24 凸版印刷株式会社 プラスチックカードおよびその製造方法
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
WO2023034642A1 (fr) 2021-09-06 2023-03-09 Metaland Llc Encapsulation d'une incrustation métallique avec de la résine thermodurcissable et procédé de fabrication d'une carte de transaction métallique

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339407A (en) 1980-10-02 1982-07-13 Alden Research Foundation Electronic circuit encapsulation
US4501787A (en) * 1983-04-29 1985-02-26 Westinghouse Electric Corp. Flame retardant B-staged epoxy resin prepregs and laminates made therefrom
CH664595A5 (de) * 1984-03-15 1988-03-15 Bauer Kaba Ag Elektronisch-mechanischer flachschluessel.
US4961893A (en) 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
JPH03500033A (ja) 1988-06-21 1991-01-10 ダブリュー　アンド　ティー　エイヴァリー　リミテッド ポータブル電子トークンの製造法
US5244840A (en) 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
US5417905A (en) 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
JP2560895B2 (ja) 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
DE4038126C2 (de) 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
CA2051836C (fr) * 1990-11-30 1996-07-23 Richard Michael Flynn Fabrication d'une carte de donnees personnelle
FR2691563B1 (fr) * 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
JPH068681A (ja) * 1992-06-24 1994-01-18 Fuji Film Micro Device Kk Ｉｃカードとその製造方法
FR2702067B1 (fr) 1993-02-23 1995-04-14 Schlumberger Ind Sa Procédé et dispositif de fabrication de cartes à mémoire.
JPH0787234A (ja) * 1993-07-19 1995-03-31 Bell Syst 24:Kk クレジットカード
FR2716555B1 (fr) 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5423705A (en) 1994-03-28 1995-06-13 Kransco Flying disc with laminate surfacing
FR2727542B1 (fr) * 1994-11-25 1997-01-03 Droz Francois Carte incorporant au moins un element electronique
JPH08185498A (ja) * 1994-12-27 1996-07-16 Mitsubishi Chem Mkv Co 非接触式ｉｃカードの製造方法
JPH1086571A (ja) * 1996-09-20 1998-04-07 Hitachi Chem Co Ltd Ｉｃカード
US5955021A (en) 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
JPH1120357A (ja) * 1997-06-30 1999-01-26 Nippon Joho Insatsu Kk Ｉｃカード及びｉｃカードの製造方法
US6025054A (en) 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
FR2769110B1 (fr) * 1997-09-26 1999-12-03 Gemplus Card Int Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
US6241153B1 (en) 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
US6256873B1 (en) 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
JPH11296643A (ja) * 1998-04-14 1999-10-29 Three Bond Co Ltd Ｉｃカードおよびその製造方法
US6607136B1 (en) * 1998-09-16 2003-08-19 Beepcard Inc. Physical presence digital authentication system
US6404643B1 (en) 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
JP2002141731A (ja) * 2000-10-30 2002-05-17 Oji Paper Co Ltd Ｉｃ実装体及び共振周波数調整方法
WO2002078199A2 (fr) 2001-03-22 2002-10-03 Beepcard Incorporated Procede et systeme d'authentification a distance de dispositifs d'identification
JP2004256788A (ja) * 2002-11-29 2004-09-16 Sekisui Chem Co Ltd 加熱消滅性材料
TWI457835B (zh) * 2004-02-04 2014-10-21 Semiconductor Energy Lab 攜帶薄膜積體電路的物品
US7225537B2 (en) 2005-01-27 2007-06-05 Cardxx, Inc. Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
WO2006101493A1 (fr) 2005-03-23 2006-09-28 Cardxx, Inc. Procede de fabrication de cartes a puce perfectionnees comprenant des composants electroniques integres consistant a utiliser des materiaux adhesifs thermodurcis isotropes presentant des surfaces exterieures de haute qualite

Also Published As

Publication number Publication date
KR20080005364A (ko) 2008-01-11
DE602006014113D1 (de) 2010-06-17
US20060226240A1 (en) 2006-10-12
CN101189626A (zh) 2008-05-28
IL186415A0 (en) 2008-01-20
ATE467195T1 (de) 2010-05-15
WO2006107968A1 (fr) 2006-10-12
MX2007012434A (es) 2008-02-12
EP1866846A1 (fr) 2007-12-19
US7237724B2 (en) 2007-07-03
MY141813A (en) 2010-06-30
CA2604153A1 (fr) 2006-10-12
CN100595784C (zh) 2010-03-24
TW200710739A (en) 2007-03-16
RU2007140980A (ru) 2009-05-20
AU2006231517A1 (en) 2006-10-12
ZA200708492B (en) 2008-10-29
BRPI0609969A2 (pt) 2011-10-11
EP1866846B1 (fr) 2010-05-05
JP2008538430A (ja) 2008-10-23

Similar Documents

Publication Publication Date Title
TW200710739A (en) A smart card and method for manufacturing a smart card
MX2009010232A (es) Una tarjeta gradual y metodo para fabricar una tarjeta gradual.
TW200802775A (en) An embedded electronic device and method for manufacturing an embedded electronic device
TW200817159A (en) An electronic inlay module for electronic cards and tags
WO2008157143A3 (fr) Structure de raccordement de bord pour des cartes à circuits imprimés
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
TW200633614A (en) Method of fabricating printed circuit board having embedded multi-layer passive devices
TW200638811A (en) Flexible printed wiring board
WO2006134216A3 (fr) Structure de carte de circuits imprimes et procede de fabrication de structure de carte de circuits imprimes
TW200633176A (en) Printed circuit board, flip chip ball grid array board and method of fabricating the same
WO2007050114A3 (fr) Couche de protection transitoire incorporee sensiblement continue pour cartes de circuit imprime
TW200727744A (en) Multilayer wiring board
SG153797A1 (en) Circuit board
MX2007011790A (es) Tarjeta de circuito de capas multiples con componentes embebidos y metodo de fabricacion.
WO2008060256A3 (fr) Carte tridimensionnelle de circuit imprimé
TW200629998A (en) Printed circuit board and forming method thereof
TW200512776A (en) High tolerance embedded capacitors
WO2012087072A3 (fr) Carte de circuit imprimé et son procédé de fabrication
ATE519359T1 (de) Übertragungsleitung
EP1776002A4 (fr) Composant électronique hybride et procédé de fabrication de celui-ci
ATE513452T1 (de) Elektronisches gerät mit flipmodul mit geringer höhe
WO2011043537A3 (fr) Carte de circuit imprimé et son procédé de fabrication
TW200611620A (en) A manufacturing method of a multi-layer circuit board with embedded passive components
CN202310299U (zh) 一种软硬结合板
ATE332626T1 (de) Trennplatte zum herstellen von leiterplattenkomponenten

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)