CN103370181B - 用于在制造电子装置时将电子组合件附接到底部覆盖层的方法 - Google Patents
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Abstract
本发明提出一种用于在制造电子装置时将电子组合件粘着到底部盖片的方法。根据所述方法,使用经改质的紫外“UV”固化粘合剂将所述电子组合件附接到底部覆盖层。
Description
技术领域
本发明总体上涉及含有电子组合件的装置的领域。
背景技术
一般来说,这些装置可用作信用卡、银行卡、身份证、电话卡、安全卡、智能卡、生活卡、标签或类似装置。一般通过将若干个塑料片层组合在夹层结构阵列中来构造这些装置。此外,这些装置可含有使所述装置能执行多种功能的电子组合件。
0 350 179号欧洲专利揭示了一种智能卡,其中电子电路被封装于在卡的两个表面层之间所导入的一个塑料材料层中。所揭示的方法进一步包括使高抗拉强度的固持部件紧靠模具的一侧、使智能卡的电子组件相对于所述侧而放置且随后将反应可模制聚合材料注入模具内以使其封装所述电子组件。
95400365.3号欧洲专利申请案教示用于制造非接触智能卡的方法。所述方法采用刚架将电子模块定位且固定在上热塑片与下热塑片之间的空隙中。在以机械方式将框架固定到下热塑片之后,空隙充满可聚合树脂材料。
第5,399,847号美国专利教示由三个层(即,第一外部层、第二外部层及中间层)组成的信用卡。中间层是通过注入将智能卡的电子元件(例如,1C芯片及天线)围封在中间层材料中的热塑性粘合材料而形成的。粘合材料优选由具有两种或两种以上化学反应成分(其一旦与空气接触,就会变硬)的共聚酰胺的混合物或胶水而制成。此智能卡的外部层可由多种聚合材料(例如聚氯乙烯或聚亚胺酯)制成。
第5,417,905号美国专利教示用于制造塑料信用卡的方法,其中由两个壳组成的模具工具经闭合以界定产生此类卡的腔室。标签或图像支撑件被放置在每一模具壳中。然后将模具壳组合在一起且将热塑性材料注入模具中以形成卡。注入塑料强迫标签或图像支撑件紧靠相应模具面。
第5,510,074号美国专利教示制造智能卡的方法,所述智能卡具有带有大体上平行的主侧面的卡主体、在至少一个侧面上具有图形元件的支撑部件以及包括固定到芯片的接触阵列的电子模块。制造方法一般包括以下步骤:(1)将支撑部件放置在界定卡体积及卡形状的模具中;(2)固持支撑部件,使其紧靠模具的第一主壁;(3)将热塑性材料注入由中空空间所界定的体积中,以便填充体积中没有被支撑部件占据的部分;及(4)在注入的材料能够完全凝固之前在适当位置处将电子模块插入热塑性材料中。
第4,339,407号美国专利揭示一种具有壁的载体的形式的电子电路封装装置,所述壁具有特定布置的连接区、凹槽及凸部与特定的孔的组合。模具的壁区段使电路组合件保持给定的对准。载体的壁由略微呈柔性的材料制成以便有助于智能卡的电子电路的插入。载体能够被插入到外部模具中。此引起载体壁彼此相对移动,从而在热塑性材料的注入期间使组件稳固地保持对准。载体壁的外部具有凸起,其用于与模具壁上的锁键匹配以便将载体放置且固定在模具中。模具还具有孔以允许截留的气体逃逸出去。
第5,350,553号美国专利教示在注射模制机器内的塑料卡上产生装饰图案且将电子电路放置在注射模制机器内的塑料卡中的方法。所述方法包括以下步骤:(a)导入膜(例如带有装饰图案的膜)且将其定位在注射模制机器内的敞开的模具腔室上方;(b)使模具腔室闭合以便将膜固定且夹钳在其中的合适位置中;(c)通过模具中的小孔将电子电路芯片插入到模具腔室中以便将芯片定位在腔室中;(d)将热塑性支撑成分注入模具腔室中以形成统一的卡;(e)移除任何多余的材料;(f)打开模具腔室;及(g)移除卡。
第4,961,893号美国专利教示一种智能卡,其主要特征是支撑集成电路芯片的支撑元件。支撑元件用于将芯片定位在模具腔室内部。通过将塑料材料注入腔室中而形成卡主体以使芯片全部嵌入在塑料材料中。在一些实施例中,支撑件的边缘区域夹钳在相应模具的承载表面之间。支撑元件可为从成品卡剥离的膜或其可为保留为卡的整体部分的片。如果支撑元件为剥离掉的膜,那么其中所含有的任何图形元件均转移且在卡上保持可见。如果支撑元件保留为卡的整体部分,那么就在其面上形成此类图形元件且因此此类图形元件对持卡用户可见。
第5,498,388号美国专利教示包含具有从头到尾的开口的卡纸板的智能卡装置。半导体模块被安装到此开口上。将树脂注入开口中以便在仅暴露用于所述半导体模块的外部连接的一个电极终端面的此条件下形成树脂模制。通过将具有从头到尾的开口的卡纸板安装到两个相对的模制冲模的下模具上、将半导体模块安装到所述卡纸板的开口上、将具有门引线的上冲模紧固到下冲模上且经由门将树脂注入开口中。
第5,423,705号美国专利教示具有圆盘主体的圆盘,所述圆盘主体由热塑性注射模制材料及一体式连接到圆盘主体的层压层制成。层压层包含外部透明薄层及内部白色且不透明的薄层。成像材料夹在这些薄层之间。
第6,025,054号美国专利揭示用于使用低伸缩胶水构造智能卡的方法,所述低伸缩胶水用于在装置浸入热固性材料(其变成智能卡的芯层)中期间将电子装置固持在合适位置。
一般来说,上述方法全部涉及到使用专门的工艺、底座、锚点或其它装置来将电子组合件粘着到印刷覆盖层的一者。
发明内容
根据一个实施例,揭示一种包含以下步骤的方法:使用独特的经改质的UV可固化粘合剂来固定到具有电子组合件的电路板的底部覆盖层的顶部表面、将粘着到底部覆盖层的电子组合件装载到注射模制设备中、将定位在电子组合件的顶部表面上方的顶部覆盖层装载到注射模制设备中、使模制设备闭合以及在顶部覆盖层与底部覆盖层之间注射热固性聚合材料。
应了解,上文一般的描述及下文详细的描述仅为示范性及说明性,且不限制所主张的本发明。
附图说明
本发明的这些及其它特征、方面及优点将从下文的描述、所附权利要求书及图形中所展示的所附示范性实施例(其在下文进行简要描述)而变得显而易见。
图1展示已具有用独特的经改质UV可固化粘合剂印刷的电路轮廓丝网的覆盖层的顶部侧面的示意图。
图2展示具有安置在用独特的经改质UV可固化粘合剂印刷的丝网的顶部上的电路的覆盖层的顶部侧面的示意图。
图3展示电子装置的横截面图,所述电子装置由底部覆盖层、印刷到底部覆盖层的顶部侧面的独特的经改质UV可固化粘合剂丝网的层、附接到印刷的独特的经改质UV可固化粘合剂的顶部侧面的电子组合件以及顶部覆盖层的底部侧面与电子组合件的顶部侧面之间的注射的热固性材料的层组成。
图4为说明用于形成电子装置的方法的流程图。
具体实施方式
图1展示电子装置60的底部覆盖层10的顶部侧面的示意图。如在图1中及图4的步骤100及110中所展示,独特的经改质UV可固化粘合剂20固定到展现比电子组合件的周长测量值只大一点点的面积的底部覆盖层10的顶部侧面。UV可固化粘合剂20经配置以按照所控制的数量涂敷到表面。可经由丝网印刷、喷射或将粘合剂20涂敷到表面的任何其它已知涂敷法来固定UV可固化粘合剂20。
接着,在步骤120中,通过紫外光系统处理具有所涂敷的独特的经改质UV可固化粘合剂20的底部覆盖层10,以活化独特的经改质UV可固化粘合剂20。一旦施加UV光,UV可固化粘合剂20就变为有粘性的或粘着的。
如在图2中所展示,在步骤130中,将电子组合件30放置在丝网印刷的独特经改质UV可固化粘合剂20的顶部侧面上。电子组合件30可包含一个或一个以上电路组件,其包含(但不限于)印刷电路板、按钮、开关、电池、LCD或在电子装置60中可能会需要的或可能有用的其它电子组件。因为UV可固化粘合剂20已暴露于UV光且为有粘性的或粘着的,所以可轻易地将电子组合件30固定到UV可固化粘合剂20。UV可固化粘合剂20随后固化一段时间以产生永久性结合。优选地,UV可固化粘合剂20大约需要24小时来固化。UV可固化粘合剂20直接暴露于UV光时并不会立即固化的事实使其极具柔性且对电子装置制造工艺来说是理想的。
随后,在步骤140中,将附接有电子组合件30的底部覆盖层10装载到模具中,电子组合件30定位于顶部上。在步骤150中,将具有顶部表面及底部表面的顶部覆盖层50装载在被固定到底部覆盖层10的顶部表面的电子组合件30上方。接着,在步骤160中,使模具闭合且在顶部覆盖层50与底部覆盖层10之间注射热固性聚合材料40。在步骤170中,打开模具且将含有电子组合件30的注射顶部覆盖层50及底部覆盖层10从模具移除。最后,根据大小规格等切出电子装置60。图3展示完成的电子装置60,其具有底部覆盖层10、固定在底部覆盖层10的顶部侧面上的独特的经改质UV可固化粘合剂20、粘着到丝网印刷独特的经改质UV可固化粘合剂20的电子组合件30以及定位在电子组合件30的顶部与顶部覆盖层50的底部侧面之间的热固材料40的层。
鉴于本发明的揭示内容,所属领域的技术人员将了解在本发明的范围及精神内可存在其它实施例及修改。因此,所属领域的技术人员从本发明的范围及精神内的本揭示内容所获得的全部修改应作为本发明的进一步的实施例而包含进来。将根据在所附的权利要求书中所陈述的内容来界定本发明的范围。
Claims (2)
1.一种用于在制造电子装置时将电子组合件附接到底部覆盖层的方法,其包括:
提供具有顶部表面及底部表面的底部覆盖层;
将UV可固化粘合剂直接涂敷到所述底部覆盖层的顶部以形成比电子组合件的周长测量值大的UV可固化粘合剂的区域;
通过紫外光系统处理具有所涂敷的UV可固化粘合剂的所述底部覆盖层,以活化所述UV可固化粘合剂;及
将所述电子组合件直接粘着到所活化的UV可固化粘合剂的顶部使得所述电子组合件的周长位于UV可固化粘合剂的所述区域内,
其中所活化的UV可固化粘合剂在大约24个小时的时间期间被固化。
2.一种用于制造电子装置的方法,其包括:
提供具有顶部表面及底部表面的底部覆盖层;
将UV可固化粘合剂直接涂敷到所述底部覆盖层的顶部以形成比电子组合件的周长测量值大的UV可固化粘合剂的区域;
通过紫外光系统处理具有所涂敷的UV可固化粘合剂的所述底部覆盖层,以活化所述UV可固化粘合剂;
将所述电子组合件直接粘着到所活化的UV可固化粘合剂的顶部使得所述电子组合件的周长位于UV可固化粘合剂的所述区域内,其中所活化的UV可固化粘合剂在大约24个小时的时间期间被固化;
将附接有所述电子组合件的所述底部覆盖层装载到模具中,所述电子组合件定位在顶部上;
将具有顶部表面及底部表面的顶部覆盖层装载在固定到所述底部覆盖层的所述顶部表面的所述电子组合件的上方;
使所述模具闭合且在所述顶部覆盖层与所述底部覆盖层之间注射热固性聚合材料;
打开所述模具且将含有所述电子组合件的经注射的顶部覆盖层及底部覆盖层从所述模具移除;及
切出所述电子装置。
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US201161433724P | 2011-01-18 | 2011-01-18 | |
US61/433,724 | 2011-01-18 | ||
PCT/US2012/021524 WO2012099863A1 (en) | 2011-01-18 | 2012-01-17 | A method for attaching an electronic assembly to a bottom overlay in the manufacture of an electronic device |
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CN103370181A CN103370181A (zh) | 2013-10-23 |
CN103370181B true CN103370181B (zh) | 2017-03-01 |
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US (1) | US20120180946A1 (zh) |
EP (1) | EP2665592A1 (zh) |
JP (2) | JP2014509269A (zh) |
KR (1) | KR20140006841A (zh) |
CN (1) | CN103370181B (zh) |
AU (1) | AU2012207433A1 (zh) |
BR (1) | BR112013018262A2 (zh) |
CA (1) | CA2825191A1 (zh) |
CL (1) | CL2013002071A1 (zh) |
IL (1) | IL227547A0 (zh) |
MX (1) | MX2013008291A (zh) |
RU (1) | RU2013135654A (zh) |
WO (1) | WO2012099863A1 (zh) |
Families Citing this family (1)
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JP6292469B2 (ja) * | 2014-02-14 | 2018-03-14 | パナソニックIpマネジメント株式会社 | 空気調和機の室外ユニット |
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JPH04286697A (ja) * | 1990-11-30 | 1992-10-12 | American Teleph & Telegr Co <Att> | 個人データカードとその製造方法 |
CN1264331A (zh) * | 1997-05-19 | 2000-08-23 | 卡德爱克斯公司 | 智能卡的制造方法 |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
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US6241153B1 (en) * | 1998-03-17 | 2001-06-05 | Cardxx, Inc. | Method for making tamper-preventing, contact-type, smart cards |
JP2000017242A (ja) * | 1998-06-29 | 2000-01-18 | Minnesota Mining & Mfg Co <3M> | ホットメルト接着剤組成物、熱圧着性フィルムおよびホットメルト接着剤組成物を用いた接着方法 |
US6265460B1 (en) * | 1998-06-29 | 2001-07-24 | 3M Innovative Properties Company | Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition |
US7225537B2 (en) * | 2005-01-27 | 2007-06-05 | Cardxx, Inc. | Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
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2012
- 2012-01-17 AU AU2012207433A patent/AU2012207433A1/en not_active Abandoned
- 2012-01-17 JP JP2013550533A patent/JP2014509269A/ja active Pending
- 2012-01-17 RU RU2013135654/05A patent/RU2013135654A/ru not_active Application Discontinuation
- 2012-01-17 EP EP12701621.0A patent/EP2665592A1/en not_active Withdrawn
- 2012-01-17 US US13/351,835 patent/US20120180946A1/en not_active Abandoned
- 2012-01-17 WO PCT/US2012/021524 patent/WO2012099863A1/en active Application Filing
- 2012-01-17 CA CA2825191A patent/CA2825191A1/en not_active Abandoned
- 2012-01-17 KR KR1020137019704A patent/KR20140006841A/ko not_active Application Discontinuation
- 2012-01-17 MX MX2013008291A patent/MX2013008291A/es unknown
- 2012-01-17 CN CN201280008911.8A patent/CN103370181B/zh not_active Expired - Fee Related
- 2012-01-17 BR BR112013018262A patent/BR112013018262A2/pt not_active IP Right Cessation
-
2013
- 2013-07-18 IL IL227547A patent/IL227547A0/en unknown
- 2013-07-18 CL CL2013002071A patent/CL2013002071A1/es unknown
-
2016
- 2016-08-04 JP JP2016153329A patent/JP2016215652A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04286697A (ja) * | 1990-11-30 | 1992-10-12 | American Teleph & Telegr Co <Att> | 個人データカードとその製造方法 |
CN1264331A (zh) * | 1997-05-19 | 2000-08-23 | 卡德爱克斯公司 | 智能卡的制造方法 |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
WO2002076717A2 (en) * | 2001-03-22 | 2002-10-03 | Beepcard Inc. | Manufacture of self-powered identification devices |
WO2006107968A1 (en) * | 2005-04-06 | 2006-10-12 | Innovatier, Inc. | A smart card and method for manufacturing a smart card |
Also Published As
Publication number | Publication date |
---|---|
KR20140006841A (ko) | 2014-01-16 |
US20120180946A1 (en) | 2012-07-19 |
IL227547A0 (en) | 2013-09-30 |
AU2012207433A1 (en) | 2013-09-05 |
EP2665592A1 (en) | 2013-11-27 |
WO2012099863A1 (en) | 2012-07-26 |
RU2013135654A (ru) | 2015-02-27 |
CL2013002071A1 (es) | 2014-04-04 |
CN103370181A (zh) | 2013-10-23 |
BR112013018262A2 (pt) | 2016-11-16 |
CA2825191A1 (en) | 2012-07-26 |
MX2013008291A (es) | 2013-10-03 |
JP2016215652A (ja) | 2016-12-22 |
JP2014509269A (ja) | 2014-04-17 |
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