BR112013018262A2 - método para fixar eletrônico em cobertura de fundo na fabricação de dispositivo eletrônico e para fabricar dispositivo eletrônico - Google Patents

método para fixar eletrônico em cobertura de fundo na fabricação de dispositivo eletrônico e para fabricar dispositivo eletrônico

Info

Publication number
BR112013018262A2
BR112013018262A2 BR112013018262A BR112013018262A BR112013018262A2 BR 112013018262 A2 BR112013018262 A2 BR 112013018262A2 BR 112013018262 A BR112013018262 A BR 112013018262A BR 112013018262 A BR112013018262 A BR 112013018262A BR 112013018262 A2 BR112013018262 A2 BR 112013018262A2
Authority
BR
Brazil
Prior art keywords
electronic device
device manufacturing
electronic
back cover
fixing
Prior art date
Application number
BR112013018262A
Other languages
English (en)
Inventor
Robert Singleton
Original Assignee
Innovatier Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innovatier Inc filed Critical Innovatier Inc
Publication of BR112013018262A2 publication Critical patent/BR112013018262A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B29C2045/14532—Joining articles or parts of a single article injecting between two sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

método para fixar eletrônico em cobertura de fundo na fabricação de dispositivo eletrônico e para fabricar dispositivo eletrônico um método para aderir um conjunto eletrônico a uma folha de cobertura de fundo na fabricação de um dispositivo eletrônico é apresentado. de acordo com o método, o conjunto eletrônico é fixado à cobertura de fundo usando um adesivo curado por ultravioleta ("uv") modificado.
BR112013018262A 2011-01-18 2012-01-17 método para fixar eletrônico em cobertura de fundo na fabricação de dispositivo eletrônico e para fabricar dispositivo eletrônico BR112013018262A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161433724P 2011-01-18 2011-01-18
PCT/US2012/021524 WO2012099863A1 (en) 2011-01-18 2012-01-17 A method for attaching an electronic assembly to a bottom overlay in the manufacture of an electronic device

Publications (1)

Publication Number Publication Date
BR112013018262A2 true BR112013018262A2 (pt) 2016-11-16

Family

ID=45554869

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013018262A BR112013018262A2 (pt) 2011-01-18 2012-01-17 método para fixar eletrônico em cobertura de fundo na fabricação de dispositivo eletrônico e para fabricar dispositivo eletrônico

Country Status (13)

Country Link
US (1) US20120180946A1 (pt)
EP (1) EP2665592A1 (pt)
JP (2) JP2014509269A (pt)
KR (1) KR20140006841A (pt)
CN (1) CN103370181B (pt)
AU (1) AU2012207433A1 (pt)
BR (1) BR112013018262A2 (pt)
CA (1) CA2825191A1 (pt)
CL (1) CL2013002071A1 (pt)
IL (1) IL227547A0 (pt)
MX (1) MX2013008291A (pt)
RU (1) RU2013135654A (pt)
WO (1) WO2012099863A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6292469B2 (ja) * 2014-02-14 2018-03-14 パナソニックＩｐマネジメント株式会社 空気調和機の室外ユニット

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2051836C (en) * 1990-11-30 1996-07-23 Richard Michael Flynn Personal data card construction
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
US6241153B1 (en) * 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
JP2000017242A (ja) * 1998-06-29 2000-01-18 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物、熱圧着性フィルムおよびホットメルト接着剤組成物を用いた接着方法
US6265460B1 (en) * 1998-06-29 2001-07-24 3M Innovative Properties Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
AU2002249532A1 (en) * 2001-03-22 2002-10-08 Beepcard Inc. Manufacture of self-powered identification devices
US7225537B2 (en) * 2005-01-27 2007-06-05 Cardxx, Inc. Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device

Also Published As

Publication number Publication date
AU2012207433A1 (en) 2013-09-05
WO2012099863A1 (en) 2012-07-26
CL2013002071A1 (es) 2014-04-04
RU2013135654A (ru) 2015-02-27
KR20140006841A (ko) 2014-01-16
CA2825191A1 (en) 2012-07-26
IL227547A0 (en) 2013-09-30
CN103370181A (zh) 2013-10-23
MX2013008291A (es) 2013-10-03
JP2014509269A (ja) 2014-04-17
EP2665592A1 (en) 2013-11-27
CN103370181B (zh) 2017-03-01
US20120180946A1 (en) 2012-07-19
JP2016215652A (ja) 2016-12-22

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2497 DE 13-11-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.