TWI560194B - Photosensitive resin composition, cured film, component of touch panel, and tft substrate - Google Patents
Photosensitive resin composition, cured film, component of touch panel, and tft substrateInfo
- Publication number
- TWI560194B TWI560194B TW102111320A TW102111320A TWI560194B TW I560194 B TWI560194 B TW I560194B TW 102111320 A TW102111320 A TW 102111320A TW 102111320 A TW102111320 A TW 102111320A TW I560194 B TWI560194 B TW I560194B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- resin composition
- touch panel
- photosensitive resin
- cured film
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D305/00—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms
- C07D305/02—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings
- C07D305/04—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
- C07D307/02—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings
- C07D307/04—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
- C07D307/18—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
- C07D307/20—Oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D333/00—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom
- C07D333/02—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
- C07D333/04—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings not substituted on the ring sulphur atom
- C07D333/06—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings not substituted on the ring sulphur atom with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to the ring carbon atoms
- C07D333/14—Radicals substituted by singly bound hetero atoms other than halogen
- C07D333/16—Radicals substituted by singly bound hetero atoms other than halogen by oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic System
- C07F5/02—Boron compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic System
- C07F5/02—Boron compounds
- C07F5/025—Boronic and borinic acid compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012079381 | 2012-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201404781A TW201404781A (en) | 2014-02-01 |
TWI560194B true TWI560194B (en) | 2016-12-01 |
Family
ID=49259401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102111320A TWI560194B (en) | 2012-03-30 | 2013-03-29 | Photosensitive resin composition, cured film, component of touch panel, and tft substrate |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2013146130A1 (en) |
TW (1) | TWI560194B (en) |
WO (1) | WO2013146130A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI784152B (en) * | 2018-03-30 | 2022-11-21 | 日商東麗股份有限公司 | Positive photosensitive resin composition, method for producing cured film, cured film, and solid-state imaging device |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102092659B1 (en) * | 2012-06-12 | 2020-03-24 | 가부시키가이샤 아데카 | Photosensitive composition |
JP6569211B2 (en) * | 2013-11-29 | 2019-09-04 | 東レ株式会社 | Photosensitive resin composition, cured film obtained by curing the same, and light emitting device and solid-state imaging device comprising the same |
JP6309755B2 (en) * | 2013-12-25 | 2018-04-11 | 東京応化工業株式会社 | Photosensitive resin composition |
TWI559081B (en) * | 2014-03-17 | 2016-11-21 | 奇美實業股份有限公司 | Photosensitive resin composition and application thereof |
JP6377928B2 (en) * | 2014-03-25 | 2018-08-22 | 株式会社日本触媒 | Resist composition containing alkali-soluble resin and storage method thereof |
JP2015218139A (en) * | 2014-05-19 | 2015-12-07 | 株式会社Kri | Silicon-based compound |
JP6822758B2 (en) * | 2014-09-30 | 2021-01-27 | 日鉄ケミカル&マテリアル株式会社 | A photosensitive resin composition for a touch panel, a cured film thereof, and a touch panel having the cured film. |
TWI512058B (en) * | 2014-12-25 | 2015-12-11 | Chi Mei Corp | Photo-curing coating composition, photo-curing coating film and touch panel |
JP2016186047A (en) * | 2015-03-27 | 2016-10-27 | 味の素株式会社 | Molecular bonding agent |
TWI566037B (en) * | 2015-04-17 | 2017-01-11 | 奇美實業股份有限公司 | Photosensitive resin composition and application thereof |
JP6546462B2 (en) * | 2015-06-24 | 2019-07-17 | 東京応化工業株式会社 | Composition |
KR102630893B1 (en) * | 2015-11-25 | 2024-01-31 | 롬엔드하스전자재료코리아유한회사 | Photosensitive resin composition and cured film prepared therefrom |
TWI646391B (en) * | 2015-12-24 | 2019-01-01 | 奇美實業股份有限公司 | Photosensitive resin composition for black matrix and application thereof |
JP6917815B2 (en) * | 2017-07-19 | 2021-08-11 | 株式会社ニコン | Compounds, pattern-forming substrates, coupling agents and pattern-forming methods |
KR20190013091A (en) | 2017-07-31 | 2019-02-11 | 다우 실리콘즈 코포레이션 | Dually-Curable Resin Composition, Cured Body Prepared Therefrom, And Electronic Device Comprising Such Cured Body |
JP7104489B2 (en) * | 2018-03-30 | 2022-07-21 | 株式会社松風 | A silane coupling compound having an epoxy ring and a urethane group and a curable composition for a medical / dental model containing them. |
JP2021026029A (en) | 2019-07-31 | 2021-02-22 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | Negative type photosensitive composition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6284898B1 (en) * | 1997-03-25 | 2001-09-04 | Ivoclar Ag | Hydrolysable and polymerizable oxetane silanes |
JP2001329112A (en) * | 2000-05-23 | 2001-11-27 | Toray Ind Inc | Silane coupling agent, curable resin solution composition, and functional cured product made therefrom |
JP2004127583A (en) * | 2002-09-30 | 2004-04-22 | Fuji Photo Film Co Ltd | Organic-inorganic hybrid type proton conducting material and fuel cell |
US20080221238A1 (en) * | 2007-03-09 | 2008-09-11 | Su Shiu-Chin H | Epoxysilanes, processes for their manufacture and curable compositions containing same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19714324B4 (en) * | 1997-03-25 | 2004-09-02 | Ivoclar Vivadent Ag | Hydrolyzable and polymerizable oxetane silanes |
WO2009096050A1 (en) * | 2008-01-28 | 2009-08-06 | Toray Industries, Inc. | Siloxane resin compositions |
JP5343570B2 (en) * | 2009-01-13 | 2013-11-13 | 信越化学工業株式会社 | Metal surface treatment agent, surface treated steel material and surface treatment method thereof, and coated steel material and method for producing the same |
-
2013
- 2013-03-06 JP JP2013514477A patent/JPWO2013146130A1/en active Pending
- 2013-03-06 WO PCT/JP2013/056073 patent/WO2013146130A1/en active Application Filing
- 2013-03-29 TW TW102111320A patent/TWI560194B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6284898B1 (en) * | 1997-03-25 | 2001-09-04 | Ivoclar Ag | Hydrolysable and polymerizable oxetane silanes |
JP2001329112A (en) * | 2000-05-23 | 2001-11-27 | Toray Ind Inc | Silane coupling agent, curable resin solution composition, and functional cured product made therefrom |
JP2004127583A (en) * | 2002-09-30 | 2004-04-22 | Fuji Photo Film Co Ltd | Organic-inorganic hybrid type proton conducting material and fuel cell |
US20080221238A1 (en) * | 2007-03-09 | 2008-09-11 | Su Shiu-Chin H | Epoxysilanes, processes for their manufacture and curable compositions containing same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI784152B (en) * | 2018-03-30 | 2022-11-21 | 日商東麗股份有限公司 | Positive photosensitive resin composition, method for producing cured film, cured film, and solid-state imaging device |
Also Published As
Publication number | Publication date |
---|---|
TW201404781A (en) | 2014-02-01 |
JPWO2013146130A1 (en) | 2015-12-10 |
WO2013146130A1 (en) | 2013-10-03 |
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