TWI560194B - Photosensitive resin composition, cured film, component of touch panel, and tft substrate - Google Patents

Photosensitive resin composition, cured film, component of touch panel, and tft substrate

Info

Publication number
TWI560194B
TWI560194B TW102111320A TW102111320A TWI560194B TW I560194 B TWI560194 B TW I560194B TW 102111320 A TW102111320 A TW 102111320A TW 102111320 A TW102111320 A TW 102111320A TW I560194 B TWI560194 B TW I560194B
Authority
TW
Taiwan
Prior art keywords
component
resin composition
touch panel
photosensitive resin
cured film
Prior art date
Application number
TW102111320A
Other languages
Chinese (zh)
Other versions
TW201404781A (en
Inventor
Hitoshi Araki
Mitsuhito Suwa
Toshiyasu Hibino
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW201404781A publication Critical patent/TW201404781A/en
Application granted granted Critical
Publication of TWI560194B publication Critical patent/TWI560194B/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D305/00Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms
    • C07D305/02Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings
    • C07D305/04Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D307/00Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
    • C07D307/02Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings
    • C07D307/04Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • C07D307/18Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D307/20Oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D333/00Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom
    • C07D333/02Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
    • C07D333/04Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings not substituted on the ring sulphur atom
    • C07D333/06Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings not substituted on the ring sulphur atom with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to the ring carbon atoms
    • C07D333/14Radicals substituted by singly bound hetero atoms other than halogen
    • C07D333/16Radicals substituted by singly bound hetero atoms other than halogen by oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00Compounds containing elements of Groups 3 or 13 of the Periodic System
    • C07F5/02Boron compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00Compounds containing elements of Groups 3 or 13 of the Periodic System
    • C07F5/02Boron compounds
    • C07F5/025Boronic and borinic acid compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/18Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804Compounds having Si-O-C linkages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0751Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
TW102111320A 2012-03-30 2013-03-29 Photosensitive resin composition, cured film, component of touch panel, and tft substrate TWI560194B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012079381 2012-03-30

Publications (2)

Publication Number Publication Date
TW201404781A TW201404781A (en) 2014-02-01
TWI560194B true TWI560194B (en) 2016-12-01

Family

ID=49259401

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102111320A TWI560194B (en) 2012-03-30 2013-03-29 Photosensitive resin composition, cured film, component of touch panel, and tft substrate

Country Status (3)

Country Link
JP (1) JPWO2013146130A1 (en)
TW (1) TWI560194B (en)
WO (1) WO2013146130A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI784152B (en) * 2018-03-30 2022-11-21 日商東麗股份有限公司 Positive photosensitive resin composition, method for producing cured film, cured film, and solid-state imaging device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102092659B1 (en) * 2012-06-12 2020-03-24 가부시키가이샤 아데카 Photosensitive composition
JP6569211B2 (en) * 2013-11-29 2019-09-04 東レ株式会社 Photosensitive resin composition, cured film obtained by curing the same, and light emitting device and solid-state imaging device comprising the same
JP6309755B2 (en) * 2013-12-25 2018-04-11 東京応化工業株式会社 Photosensitive resin composition
TWI559081B (en) * 2014-03-17 2016-11-21 奇美實業股份有限公司 Photosensitive resin composition and application thereof
JP6377928B2 (en) * 2014-03-25 2018-08-22 株式会社日本触媒 Resist composition containing alkali-soluble resin and storage method thereof
JP2015218139A (en) * 2014-05-19 2015-12-07 株式会社Kri Silicon-based compound
JP6822758B2 (en) * 2014-09-30 2021-01-27 日鉄ケミカル&マテリアル株式会社 A photosensitive resin composition for a touch panel, a cured film thereof, and a touch panel having the cured film.
TWI512058B (en) * 2014-12-25 2015-12-11 Chi Mei Corp Photo-curing coating composition, photo-curing coating film and touch panel
JP2016186047A (en) * 2015-03-27 2016-10-27 味の素株式会社 Molecular bonding agent
TWI566037B (en) * 2015-04-17 2017-01-11 奇美實業股份有限公司 Photosensitive resin composition and application thereof
JP6546462B2 (en) * 2015-06-24 2019-07-17 東京応化工業株式会社 Composition
KR102630893B1 (en) * 2015-11-25 2024-01-31 롬엔드하스전자재료코리아유한회사 Photosensitive resin composition and cured film prepared therefrom
TWI646391B (en) * 2015-12-24 2019-01-01 奇美實業股份有限公司 Photosensitive resin composition for black matrix and application thereof
JP6917815B2 (en) * 2017-07-19 2021-08-11 株式会社ニコン Compounds, pattern-forming substrates, coupling agents and pattern-forming methods
KR20190013091A (en) 2017-07-31 2019-02-11 다우 실리콘즈 코포레이션 Dually-Curable Resin Composition, Cured Body Prepared Therefrom, And Electronic Device Comprising Such Cured Body
JP7104489B2 (en) * 2018-03-30 2022-07-21 株式会社松風 A silane coupling compound having an epoxy ring and a urethane group and a curable composition for a medical / dental model containing them.
JP2021026029A (en) 2019-07-31 2021-02-22 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH Negative type photosensitive composition

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US6284898B1 (en) * 1997-03-25 2001-09-04 Ivoclar Ag Hydrolysable and polymerizable oxetane silanes
JP2001329112A (en) * 2000-05-23 2001-11-27 Toray Ind Inc Silane coupling agent, curable resin solution composition, and functional cured product made therefrom
JP2004127583A (en) * 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd Organic-inorganic hybrid type proton conducting material and fuel cell
US20080221238A1 (en) * 2007-03-09 2008-09-11 Su Shiu-Chin H Epoxysilanes, processes for their manufacture and curable compositions containing same

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DE19714324B4 (en) * 1997-03-25 2004-09-02 Ivoclar Vivadent Ag Hydrolyzable and polymerizable oxetane silanes
WO2009096050A1 (en) * 2008-01-28 2009-08-06 Toray Industries, Inc. Siloxane resin compositions
JP5343570B2 (en) * 2009-01-13 2013-11-13 信越化学工業株式会社 Metal surface treatment agent, surface treated steel material and surface treatment method thereof, and coated steel material and method for producing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6284898B1 (en) * 1997-03-25 2001-09-04 Ivoclar Ag Hydrolysable and polymerizable oxetane silanes
JP2001329112A (en) * 2000-05-23 2001-11-27 Toray Ind Inc Silane coupling agent, curable resin solution composition, and functional cured product made therefrom
JP2004127583A (en) * 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd Organic-inorganic hybrid type proton conducting material and fuel cell
US20080221238A1 (en) * 2007-03-09 2008-09-11 Su Shiu-Chin H Epoxysilanes, processes for their manufacture and curable compositions containing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI784152B (en) * 2018-03-30 2022-11-21 日商東麗股份有限公司 Positive photosensitive resin composition, method for producing cured film, cured film, and solid-state imaging device

Also Published As

Publication number Publication date
TW201404781A (en) 2014-02-01
JPWO2013146130A1 (en) 2015-12-10
WO2013146130A1 (en) 2013-10-03

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