HK1113230A1 - Semiconductor package structure having enhanced thermal dissipation characteristics - Google Patents

Semiconductor package structure having enhanced thermal dissipation characteristics

Info

Publication number
HK1113230A1
HK1113230A1 HK08103408.2A HK08103408A HK1113230A1 HK 1113230 A1 HK1113230 A1 HK 1113230A1 HK 08103408 A HK08103408 A HK 08103408A HK 1113230 A1 HK1113230 A1 HK 1113230A1
Authority
HK
Hong Kong
Prior art keywords
thermal dissipation
current carrying
dissipation characteristics
enhanced thermal
semiconductor package
Prior art date
Application number
HK08103408.2A
Other languages
English (en)
Inventor
J Carney Francis
Michael J Seddon
Original Assignee
Semiconductor Components Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Components Ind filed Critical Semiconductor Components Ind
Publication of HK1113230A1 publication Critical patent/HK1113230A1/xx

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    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
HK08103408.2A 2004-12-20 2008-03-27 Semiconductor package structure having enhanced thermal dissipation characteristics HK1113230A1 (en)

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JP4989437B2 (ja) * 2007-12-14 2012-08-01 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
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US9123708B2 (en) * 2013-03-01 2015-09-01 Infineon Technologies Austria Ag Semiconductor chip package
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US20150221578A1 (en) * 2014-02-05 2015-08-06 Infineon Technologies Ag Semiconductor package and method for producing a semiconductor
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JP6663340B2 (ja) * 2016-10-28 2020-03-11 ルネサスエレクトロニクス株式会社 半導体装置
KR20190007936A (ko) * 2017-07-14 2019-01-23 제엠제코(주) 복합 클립 구조체 및 이를 이용한 반도체 패키지
WO2019135284A1 (ja) * 2018-01-05 2019-07-11 三菱電機株式会社 半導体装置
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