TW200715578A - Package-on-package structure - Google Patents
Package-on-package structureInfo
- Publication number
- TW200715578A TW200715578A TW094134708A TW94134708A TW200715578A TW 200715578 A TW200715578 A TW 200715578A TW 094134708 A TW094134708 A TW 094134708A TW 94134708 A TW94134708 A TW 94134708A TW 200715578 A TW200715578 A TW 200715578A
- Authority
- TW
- Taiwan
- Prior art keywords
- package
- heat sink
- package structure
- packages
- heat
- Prior art date
Links
Abstract
The present invention provides a package-on-package structure including a bottom package located at the bottom of the package-on-package structure, a top package stacked on and electrically connected to the bottom package, and a heat sink covering the two packages. The heat generated by the packages during operation can be conducted to the heat sink and thereby dissipated to the outside air. The poor heat dissipation of a package-on-package structure can therefore be overcome.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94134708A TWI284422B (en) | 2005-10-04 | 2005-10-04 | Package-on-package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94134708A TWI284422B (en) | 2005-10-04 | 2005-10-04 | Package-on-package structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715578A true TW200715578A (en) | 2007-04-16 |
TWI284422B TWI284422B (en) | 2007-07-21 |
Family
ID=39455106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94134708A TWI284422B (en) | 2005-10-04 | 2005-10-04 | Package-on-package structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI284422B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102856296A (en) * | 2012-09-24 | 2013-01-02 | 日月光半导体制造股份有限公司 | Stacked semiconductor package element |
TWI468086B (en) * | 2012-11-07 | 2015-01-01 | Universal Scient Ind Shanghai | Electronic device, system package module and method of manufactoring system package module |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9565793B2 (en) | 2012-10-31 | 2017-02-07 | Industrial Technology Research Institute | Environmental sensitive electronic device package |
-
2005
- 2005-10-04 TW TW94134708A patent/TWI284422B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102856296A (en) * | 2012-09-24 | 2013-01-02 | 日月光半导体制造股份有限公司 | Stacked semiconductor package element |
TWI468086B (en) * | 2012-11-07 | 2015-01-01 | Universal Scient Ind Shanghai | Electronic device, system package module and method of manufactoring system package module |
Also Published As
Publication number | Publication date |
---|---|
TWI284422B (en) | 2007-07-21 |
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