TW200715578A - Package-on-package structure - Google Patents

Package-on-package structure

Info

Publication number
TW200715578A
TW200715578A TW094134708A TW94134708A TW200715578A TW 200715578 A TW200715578 A TW 200715578A TW 094134708 A TW094134708 A TW 094134708A TW 94134708 A TW94134708 A TW 94134708A TW 200715578 A TW200715578 A TW 200715578A
Authority
TW
Taiwan
Prior art keywords
package
heat sink
package structure
packages
heat
Prior art date
Application number
TW094134708A
Other languages
Chinese (zh)
Other versions
TWI284422B (en
Inventor
Chin-Ju Ma
Cheng-Yin Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94134708A priority Critical patent/TWI284422B/en
Publication of TW200715578A publication Critical patent/TW200715578A/en
Application granted granted Critical
Publication of TWI284422B publication Critical patent/TWI284422B/en

Links

Abstract

The present invention provides a package-on-package structure including a bottom package located at the bottom of the package-on-package structure, a top package stacked on and electrically connected to the bottom package, and a heat sink covering the two packages. The heat generated by the packages during operation can be conducted to the heat sink and thereby dissipated to the outside air. The poor heat dissipation of a package-on-package structure can therefore be overcome.
TW94134708A 2005-10-04 2005-10-04 Package-on-package structure TWI284422B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94134708A TWI284422B (en) 2005-10-04 2005-10-04 Package-on-package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94134708A TWI284422B (en) 2005-10-04 2005-10-04 Package-on-package structure

Publications (2)

Publication Number Publication Date
TW200715578A true TW200715578A (en) 2007-04-16
TWI284422B TWI284422B (en) 2007-07-21

Family

ID=39455106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94134708A TWI284422B (en) 2005-10-04 2005-10-04 Package-on-package structure

Country Status (1)

Country Link
TW (1) TWI284422B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102856296A (en) * 2012-09-24 2013-01-02 日月光半导体制造股份有限公司 Stacked semiconductor package element
TWI468086B (en) * 2012-11-07 2015-01-01 Universal Scient Ind Shanghai Electronic device, system package module and method of manufactoring system package module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9565793B2 (en) 2012-10-31 2017-02-07 Industrial Technology Research Institute Environmental sensitive electronic device package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102856296A (en) * 2012-09-24 2013-01-02 日月光半导体制造股份有限公司 Stacked semiconductor package element
TWI468086B (en) * 2012-11-07 2015-01-01 Universal Scient Ind Shanghai Electronic device, system package module and method of manufactoring system package module

Also Published As

Publication number Publication date
TWI284422B (en) 2007-07-21

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