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Publication of TW200703686ApublicationCriticalpatent/TW200703686A/en
Cooling Or The Like Of Semiconductors Or Solid State Devices
(AREA)
Abstract
A package-on-package structure comprises a bottom package connected on an electric substrate; a top package stacked on the bottom package; and a heat-sinking element disposed around the bottom package and connected between the electric substrate and the top package, whereby dissipating the heat generated by the packages.