TWI267204B - Package-on-package structure - Google Patents

Package-on-package structure

Info

Publication number
TWI267204B
TWI267204B TW94123364A TW94123364A TWI267204B TW I267204 B TWI267204 B TW I267204B TW 94123364 A TW94123364 A TW 94123364A TW 94123364 A TW94123364 A TW 94123364A TW I267204 B TWI267204 B TW I267204B
Authority
TW
Taiwan
Prior art keywords
package
electric substrate
heat
bottom package
dissipating
Prior art date
Application number
TW94123364A
Other languages
Chinese (zh)
Other versions
TW200703686A (en
Inventor
Chin-Ju Ma
Yi-Shao Lai
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94123364A priority Critical patent/TWI267204B/en
Application granted granted Critical
Publication of TWI267204B publication Critical patent/TWI267204B/en
Publication of TW200703686A publication Critical patent/TW200703686A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A package-on-package structure comprises a bottom package connected on an electric substrate; a top package stacked on the bottom package; and a heat-sinking element disposed around the bottom package and connected between the electric substrate and the top package, whereby dissipating the heat generated by the packages.
TW94123364A 2005-07-11 2005-07-11 Package-on-package structure TWI267204B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94123364A TWI267204B (en) 2005-07-11 2005-07-11 Package-on-package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94123364A TWI267204B (en) 2005-07-11 2005-07-11 Package-on-package structure

Publications (2)

Publication Number Publication Date
TWI267204B true TWI267204B (en) 2006-11-21
TW200703686A TW200703686A (en) 2007-01-16

Family

ID=38191781

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94123364A TWI267204B (en) 2005-07-11 2005-07-11 Package-on-package structure

Country Status (1)

Country Link
TW (1) TWI267204B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI668823B (en) * 2018-08-09 2019-08-11 欣興電子股份有限公司 Heat dissipation substrate, manufacturing method thereof and chip package structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI668823B (en) * 2018-08-09 2019-08-11 欣興電子股份有限公司 Heat dissipation substrate, manufacturing method thereof and chip package structure

Also Published As

Publication number Publication date
TW200703686A (en) 2007-01-16

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