HK1147596A1 - Semiconductor package structure having enhanced thermal dissipation characteristics - Google Patents
Semiconductor package structure having enhanced thermal dissipation characteristicsInfo
- Publication number
- HK1147596A1 HK1147596A1 HK11101514.2A HK11101514A HK1147596A1 HK 1147596 A1 HK1147596 A1 HK 1147596A1 HK 11101514 A HK11101514 A HK 11101514A HK 1147596 A1 HK1147596 A1 HK 1147596A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor package
- package structure
- dissipation characteristics
- thermal dissipation
- enhanced thermal
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/41—Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors
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- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
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- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101641546A CN101819955B (en) | 2004-12-20 | 2004-12-20 | Semiconductor packaging structure with reinforced heat dissipation property |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1147596A1 true HK1147596A1 (en) | 2011-08-12 |
Family
ID=42654984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11101514.2A HK1147596A1 (en) | 2004-12-20 | 2011-02-16 | Semiconductor package structure having enhanced thermal dissipation characteristics |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101819955B (en) |
HK (1) | HK1147596A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120200281A1 (en) * | 2011-02-07 | 2012-08-09 | Texas Instruments Incorporated | Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing |
US8354733B2 (en) * | 2011-03-04 | 2013-01-15 | International Rectifier Corporation | IGBT power semiconductor package having a conductive clip |
CN102324391B (en) * | 2011-09-19 | 2013-04-24 | 杰群电子科技(东莞)有限公司 | Non-lead semiconductor lead frame aluminum foil welding method |
EP2930747A1 (en) | 2014-04-07 | 2015-10-14 | Nxp B.V. | Lead for connection to a semiconductor device |
US10074590B1 (en) * | 2017-07-02 | 2018-09-11 | Infineon Technologies Ag | Molded package with chip carrier comprising brazed electrically conductive layers |
CN115440686B (en) * | 2022-11-09 | 2023-03-10 | 华羿微电子股份有限公司 | Copper sheet and bonding structure |
CN116995041A (en) * | 2023-09-26 | 2023-11-03 | 深圳平创半导体有限公司 | Packaging structure and packaging method of power semiconductor device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6372539B1 (en) * | 2000-03-20 | 2002-04-16 | National Semiconductor Corporation | Leadless packaging process using a conductive substrate |
US6630726B1 (en) * | 2001-11-07 | 2003-10-07 | Amkor Technology, Inc. | Power semiconductor package with strap |
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2004
- 2004-12-20 CN CN2010101641546A patent/CN101819955B/en not_active Expired - Fee Related
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2011
- 2011-02-16 HK HK11101514.2A patent/HK1147596A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101819955A (en) | 2010-09-01 |
CN101819955B (en) | 2011-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20201219 |