HK1106175A1 - Mold-removal casting method and apparatus - Google Patents

Mold-removal casting method and apparatus

Info

Publication number
HK1106175A1
HK1106175A1 HK07107611.7A HK07107611A HK1106175A1 HK 1106175 A1 HK1106175 A1 HK 1106175A1 HK 07107611 A HK07107611 A HK 07107611A HK 1106175 A1 HK1106175 A1 HK 1106175A1
Authority
HK
Hong Kong
Prior art keywords
mold
casting method
molten metal
removal casting
removal
Prior art date
Application number
HK07107611.7A
Other languages
English (en)
Inventor
John R Grassi
George W Kuhlman
John Campbell
Original Assignee
Alotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alotech Ltd filed Critical Alotech Ltd
Publication of HK1106175A1 publication Critical patent/HK1106175A1/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D30/00Cooling castings, not restricted to casting processes covered by a single main group
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D29/00Removing castings from moulds, not restricted to casting processes covered by a single main group; Removing cores; Handling ingots

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mold Materials And Core Materials (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Casting Devices For Molds (AREA)
HK07107611.7A 2002-07-09 2007-07-16 Mold-removal casting method and apparatus HK1106175A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39471302P 2002-07-09 2002-07-09
US10/614,601 US7216691B2 (en) 2002-07-09 2003-07-07 Mold-removal casting method and apparatus

Publications (1)

Publication Number Publication Date
HK1106175A1 true HK1106175A1 (en) 2008-03-07

Family

ID=30118435

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07107611.7A HK1106175A1 (en) 2002-07-09 2007-07-16 Mold-removal casting method and apparatus

Country Status (14)

Country Link
US (1) US7216691B2 (xx)
EP (2) EP1752239B1 (xx)
JP (1) JP4403072B2 (xx)
AT (2) ATE347954T1 (xx)
AU (1) AU2003251817B2 (xx)
CA (1) CA2491452C (xx)
DE (2) DE60310404T2 (xx)
DK (1) DK1752239T3 (xx)
ES (2) ES2279168T3 (xx)
HK (1) HK1106175A1 (xx)
MX (1) MXPA05000410A (xx)
PT (1) PT1752239E (xx)
SI (1) SI1752239T1 (xx)
WO (1) WO2004004948A2 (xx)

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AU2003272624A1 (en) * 2002-09-20 2004-04-08 Alotech Ltd. Llc Lost pattern mold removal casting method and apparatus
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JP4408714B2 (ja) * 2004-02-12 2010-02-03 株式会社ツチヨシ産業 鋳造用鋳型及びその製造方法
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US20080041499A1 (en) * 2006-08-16 2008-02-21 Alotech Ltd. Llc Solidification microstructure of aggregate molded shaped castings
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JP6842472B2 (ja) * 2016-04-28 2021-03-17 アロテック リミテッド エルエルシーAlotech Ltd. Llc アブレーション鋳造プロセス
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CN110756785A (zh) * 2018-07-28 2020-02-07 宁国市金优机械配件有限公司 一种铸铁件的冷却装置
CN110369692B (zh) * 2019-08-26 2021-06-08 共享装备股份有限公司 缩短大型铸件压箱时间的方法
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Also Published As

Publication number Publication date
EP1752239A3 (en) 2007-05-30
AU2003251817A1 (en) 2004-01-23
DE60310404T2 (de) 2007-10-11
JP4403072B2 (ja) 2010-01-20
ATE347954T1 (de) 2007-01-15
WO2004004948A2 (en) 2004-01-15
CA2491452C (en) 2010-02-02
CA2491452A1 (en) 2004-01-15
MXPA05000410A (es) 2005-09-30
PT1752239E (pt) 2010-06-30
ATE460245T1 (de) 2010-03-15
AU2003251817B2 (en) 2009-01-15
EP1752239A2 (en) 2007-02-14
DE60310404D1 (de) 2007-01-25
EP1752239B1 (en) 2010-03-10
EP1519803A2 (en) 2005-04-06
DK1752239T3 (da) 2010-07-12
DE60331696D1 (de) 2010-04-22
ES2342483T3 (es) 2010-07-07
SI1752239T1 (sl) 2010-12-31
EP1519803B1 (en) 2006-12-13
JP2005532169A (ja) 2005-10-27
US20040050524A1 (en) 2004-03-18
WO2004004948A3 (en) 2004-03-11
US7216691B2 (en) 2007-05-15
ES2279168T3 (es) 2007-08-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140709